LED已逐漸地普及應用至日常生活，進而應用至室內照明，因此提高LED的發光亮度是各界努力的目標。本論文係探討螢光粉轉換白光發光二極體（Phosphor-Conversion Light Emitting Diode, PC-LED）之封裝，研究螢光粉之塗佈位置、濃度及沈降對白光PC-LED光通量及色溫之影響。
由螢光粉塗佈位置及濃度實驗結果可知，在CIE1931色度座標為(0.33,0.33)條件下，螢光粉塗佈位置於封裝體上層、下層及全滿，其使用的濃度分別為1.5%、7%及1.5%，光通量皆約為40流明，並可知不同螢光粉濃度以三種不同塗佈位置封裝之白光PC-LED所對應色溫及光通量之結果。
針對螢光粉沈降對白光PC-LED光通量之實驗，使用高黏滯係數膠材封裝之白光LED的光通量高於使用低黏滯係數膠材封裝之白光LED約12%，在沈澱兩小時後，使用低黏滯係數封裝膠材較螢光粉未沈澱之白光PC-LED光通量僅增加4%，而使用高黏滯係數封裝膠材之PC-LED亮度則增加7%。

Light emitting diodes (LEDs) are generally used in daily life. Our major target is to increase the brightness of LED. We study the package of white phosphor-conversion light emitting diodes (PC-LEDs) and analyze the effect on the luminous flux and color temperature from different locations and concentrations of phosphor coatings and deposition of phosphor.

In this study, the color temperature and luminous flux are measured. When the phosphor is placed on the top of the reflected cup with 1.5% of concentration, or on the bottom with 7% of concentration, or when it fills the reflected cup with 1.5% of concentration, the luminous flux is about 40 lm under the CIE 1931 color coordinate of (0.33,0.33).

We also studied the effect on deposition of phosphor of two different viscosities of resin used to package white PC-LED. The luminous flux which is packaged with higher viscosity resin is about 12% higher than the one found with the lower viscosity resin. After two hours of deposition, the luminous flux of the white PC-LED which is packaged with the resin of lower viscosity increased 4%, and the one packaged with the resin of higher viscosity increased 7%.

中文摘要 -------------------------------------------------------------Ⅰ
英文摘要 -------------------------------------------------------------Ⅱ
誌謝 -------------------------------------------------------------------Ⅲ
內容目錄 -------------------------------------------------------------Ⅳ
圖表目錄 -------------------------------------------------------------Ⅵ
第一章 白光LED -------------------------------------------------1
1-1 前言 ----------------------------------------------------------1
1-2 白光LED之應用 ------------------------------------------3
1-3 白光LED之優點 ------------------------------------------4
第二章 LED之概述----------------------------------------------13
2-1 LED之發光原理--------------------------------------------13
2-2 傳統小功率LED之封裝 --------------------------------15
2-3 LED製程技術 ---------------------------------------------16
2-4 提高LED發光效率之方法 -----------------------------19
2-4-1 改變LED晶粒外型 -------------------------------20
2-4-2 表面粗化 --------------------------------------------21
2-4-3 晶圓黏貼技術 --------------------------------------22
2-4-4 覆晶封裝技術 --------------------------------------22
2-4-5 薄膜式LED -----------------------------------------23
2-5 白光LED發光技術 --------------------------------------25
2-5-1 多晶型RGB三顆LED混成白光 ---------------25
2-5-2 單晶型紫外光LED加上RBG螢光粉 ---------26
2-5-3 單晶型藍光LED加上黃色螢光粉 -------------26
第三章 實驗設備與實驗流程 --------------------------------36
3-1 實驗材料 ---------------------------------------------------36
3-2 實驗設備與量測系統 ------------------------------------37
3-3 量測參數解釋 ---------------------------------------------38
3-4 實驗流程 ---------------------------------------------------40
第四章 結果與討論----------------------------------------------49
4-1 螢光粉塗佈位置及濃度之實驗結果 ------------------49
4-2 螢光粉沈降之實驗結果 ---------------------------------51
4-3實驗結果之討論 -------------------------------------------52
第五章 結論 -----------------------------------------------------60
參考文獻 -------------------------------------------------------------61

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