高功率發光二極體(LED)技術趨於成熟，為了有利於LED取代傳統照明，本研究經由高溫加速老化方式，了解LED元件在長時間使用下出現的失效因素及光場變化，並利用光學模擬軟體Tracepro探討透鏡曲率改變及材料老化將分別如何造成光場改變。
實驗架構中，使用三間不同廠牌的LED元件，放置於95℃、85℃、65℃三個恆溫烤箱中高溫加速老化。根據實驗結果發現，老化因素包括:透鏡與矽膠黃化、矽膠碳化、透鏡細微裂痕、矽膠裂痕、透鏡與矽膠之間氣泡產生、晶片損壞逆偏電流增加。本研究分別指出LED之光功率在90%、80%、70%、60%、50%時，各元件產生之老化因素及現象。此外，對於不同廠牌LED元件本文亦比較其失效模式，A廠元件因矽膠發生碳化光功率下降快速生命期短，B廠與C廠元件矽膠無碳化有較長生命期。
透過光學軟體模擬，了解老化後透鏡曲率產生改變，造成光場在-60°~-40°與40°~60°上的衰減，材料吸收係數增加也加速光場衰減，矽膠吸收係數與PC吸收係數分別增加0.0263mm-1與0.0678mm-1，在光場±60°上衰減149mcd。

The technology of high-power light-emitting diodes (LEDs) is mature. In this study, the LEDs were aged through high temperature to understand the packaging failure mechanisms under lasting lighting. The Tracepro optics simulation software is also applied to analyze the radiation pattern decay caused by curvature variation and material aging.
In the experiment procedure, the LEDs of three manufactures were placed in aging ovens in three different temperatures set at 95℃, 85℃, and 65℃. The experiment results showed that the LED failures were the lens and silicon gel yellowing, silicon gel carbonization, lens slightly chapping, silicon cracks, bubbles generated between lens and silicon gel, and chip damage induced reverse current increase during the aging experiment. We observed the failure mechanism in reduction of optical power at 90%, 80%, 70%, 60%, 50% original power. Furthermore, the failure mechanisms of different from the manufactures is also compared in this work. The LED packages have long lifetime without silicon gel carbonization.
In simulation study, a gap of lens deformation showed a reduction at -60°~-40° and 40°~60° of the radiation pattern. The LED modules also showed that the silicon gel and PC absorption coefficient increased. Material absorption coefficient increased more in the short wavelength showed 149mcd at ±60° of the radiation pattern.

中文摘要 -------------------------------------------------------------Ⅰ
英文摘要 -------------------------------------------------------------Ⅱ
致謝--------------------------------------------------------------------Ⅲ
目錄--------------------------------------------------------------------Ⅳ
圖表索引--------------------------------------------------------------Ⅶ

第一章 簡介
1-1 LED發展--------------------------------------------------------1
1-2 文獻回顧-------------------------------------------------------4
1-3 論文架構-------------------------------------------------------4
第二章 LED概述
2-1 LED發光原理及封裝結構-----------------------------------5
2-1-1 LED發光原理---------------------------------------------5
2-1-2 LED封裝結構---------------------------------------------8
2-2 白光發光技術-------------------------------------------------9
2-3 LED外部量子效率-------------------------------------------14
第三章 實驗架構與結果
3-1 實驗架構------------------------------------------------------20
3-2 實驗儀器------------------------------------------------------23
3-3 實驗流程------------------------------------------------------28
3-4 實驗結果討論------------------------------------------------30
3-4-1 A廠實驗結果--------------------------------------------30
3-4-2 B廠實驗結果--------------------------------------------39
3-4-3 C廠實驗結果--------------------------------------------43
3-5 光場實驗結果討論------------------------------------------48
3-5-1 A廠光場分析--------------------------------------------48
3-5-2 B廠光場分析--------------------------------------------52
3-5-3 C廠光場分析--------------------------------------------54
第四章 模擬分析
4-1 透鏡曲率模擬------------------------------------------------56
4-1-1 透鏡外型曲率測量------------------------------------56
4-1-2 透鏡外型曲率模擬------------------------------------58
4-2 材料吸收係數模擬------------------------------------------62
4-2-1 PC塑膠及矽膠吸收係數測量------------------------62
4-2-2 PC塑膠及矽膠吸收係數模擬------------------------66
4-3 光譜測量分析------------------------------------------------70
第五章 結論
5-1 結論------------------------------------------------------------72
5-2 未來工作------------------------------------------------------73
參考文獻--------------------------------------------------------------74

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