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博碩士論文 etd-0716109-160201 詳細資訊
Title page for etd-0716109-160201
論文名稱
Title
無鉛錫球脫落機制研究
The Study of Mechanism for Pb-free Solder Lift-off
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
123
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2009-06-11
繳交日期
Date of Submission
2009-07-16
關鍵字
Keywords
脫落機制、無鉛錫球
Pb-free solder, lift-off
統計
Statistics
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中文摘要
本研究計畫配合南茂公司的實驗計畫及中正大學機械系的無鉛錫球快速衝擊測試結果,分析SAC105和SAC305試片,利用reflow不同溫度條件,經由時效5至60天後之破裂面及橫截面顯微組織,有系統的探討介金屬相與型態的影響及可能的無鉛錫球脫落機制。
實驗結果發現錫球破裂面依IMC位置不同可分成ModeA、ModeB、ModeC、ModeD。由元素分佈圖推測破裂層由下而上為Ni、(Ni,Cu,Sn)、Sn,其中破裂型態途徑可分成ModeC1、ModeC2、ModeC3、ModeD1,而經由時效後,IMC層厚度增加,破裂型態均為ModeC3,主要破裂的IMC層為(Cu,Ni,Au)6Sn5且破裂至Ni層。
Reflow溫度不同,IMC增加的厚度也不同,其中standard為最厚,X組為最薄,又SAC305增加的厚度比SAC105快速,均受擴散控制所影響。
Abstract
none
目次 Table of Contents
目錄
摘要 i
目錄 ii
表目錄 v
圖目錄 vi
壹、 前言 1
1.1研究背景 1
1.2研究動機 2
貳、 文獻回顧 4
2.1無鉛銲料 4
2.1.1 Sn-Ag銲料 5
2.1.2 Sn-Ag-Cu銲料 6
2.1.3 Sn-Cu銲料 7
2.1.4 Sn-Zn銲料 8
2.2 銲錫接點的脆性破壞 8
2.3 破裂型態 9
參、 實驗方法與步驟 10
3.1 實驗目的 10
3.2 儀器設備 10
3.3 實驗流程 12
3.4 試片種類 12
3.4.1 衝擊試片 12
3.4.2 時效處理後衝擊試片 13
3.4.3 時效處理試片 13
3.5 測試電路板 14
3.6衝擊試片 14
3.7 金相處理 14
3.8 試片分析 15
肆、 實驗結果與討論 17
4.1 測試電路板 17
4.1.1 OSP電路板 17
4.1.2 Ni/Au電路板 17
4.1.3 比較電路板 18
4.2 破裂面分析 18
4.2.1 基板表面Mode 18
4.2.2 破裂面型態 19
4.2.3 時效後破裂面型態 20
4.3 錫球接點界面反應 21
4.3.1 錫球接合部位IMC成長行為 21
4.3.2 錫球內部析出IMC 22
4.3.3 各成分擴散行為 22
4.4 介金屬化合物成分分析 23
4.5 破裂面與cross section比較 25
伍、 結論 26
5.1錫球破裂型態 26
5.2 界面反應IMC 26
陸、 參考文獻 28




















表目錄
Table 2.1無鉛銲料的分類及特性 34
Table 2.2 Sn-Ag-Cu/Ni界面IMC形成之EPMA成分分析 35
Table 3.1 reflow溫度條件 41
Table 3.2 試片種類編號 41
Table 3.3 SAC305S時效衝擊試片編號 42
Table 3.4 SAC105S時效衝擊試片編號 42
























圖目錄
Figure 1.1三種常見的晶片接合於電路板方式 33
Figure 1.2常見的BGA試片 33
Figure 2.1錫球與基板示意圖 36
Figure 2.2 FCII-SnPb試片EPMA之Cu、Ni、Au的擴散 36
Figure 2.3 Sn-Ag-Cu在240 oC的三元相圖 37
Figure 2.4 Sn-Ag-Cu/Ni在reflow溫度255 oC之SEM影像,反應時間為:(a)1 s, (b)1 min, (c)5 min, (d)10 min, (d)20 min 38
Figure 2.5 Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge銲料與Cu/Ni-P/Au基板IMC(a)cross section (b)surface 39
Figure 2.6 Sn-Zn銲料電鍍Ni/Au於Cu pad上時效溫度150 oC時間900h的界面反應(a)Sn-7Zn (b)Sn-8Zn-3Bi 39
Figure 2.7 破裂面Mode 40
Figure 3.1 衝擊試片示意圖 43
Figure 3.2 reflow profile 43
Figure 3.3 基板側面示意圖 44
Figure 3.4 Holder側面示意圖 44
Figure 4.1 電路板OSP-SAC105凸狀基板 45
Figure 4.2 電路板OSP-SAC305凹狀基板 46
Figure 4.3 電路板Ni/Au-SAC105凸狀基板 47
Figure 4.4 電路板Ni/Au-SAC305凹狀基板 48
Figure 4.5基板破裂面 49
Figure 4.6 基板破裂面:(a)從IMC層破裂且下方無殘留銲料, (b)從IMC層破裂且下方殘留銲料, (c)Ni層中破裂, (d)從銲料中破裂, (e)側面示意圖 50
Figure 4.7破裂面依IMC位置分為四類型:(a)Mode A, (b)Mode B, (c)Mode C, (d)Mode D
51
Figure 4.8 破裂面錫球:(a)RT-T021-0.3錫球SEI 150X(箭頭為推球方向), (b)RT-T021-0.5錫球SEI 150X, (c)為(a)中1號位置SEI1000X, (d)為(b)放大至1000X, (e)為(a)中2號位置SEI1000X 52
Figure 4.9 破裂型態Mode C1 53
Figure 4.10 破裂型態Mode C2 54
Figure 4.11 破裂型態Mode C3 55
Figure 4.12 破裂型態Mode D1 56
Figure 4.13 SAC305S時效處理後的衝擊試片基板與錫球配對SEI 150X 57
Figure 4.14 SAC305S時效5天破裂型態Mode 58
Figure 4.15 SAC305S時效20天破裂型態Mode 59
Figure 4.16 SAC30S時效30天破裂型態Mode 60
Figure 4.17 SAC305S時效40天破裂型態Mode 61
Figure 4.18 SAC305S時效45天破裂型態Mode 62
Figure 4.19 破裂面SAC305S時效5天EDS分析 63
Figure 4.20 破裂面SAC305S時效30天EDS分析 64
Figure 4.21 破裂面SAC305S時效45天EDS分析 65
Figure 4.22 SAC105S時效處理後的衝擊試片基板與錫球配對 66
Figure 4.23 SAC105S時效45天破裂型態Mode 67
Figure 4.24 Ni/Au-SAC105X在155 oC下之Cross section:(a)as reflow, (b)5, (c)10, (d)20, (e)30, (f)40, (g)45, (h)60天 68
Figure 4.25 Ni/Au-SAC105X厚度對時間作圖:(a)時間為天數, (b)時間為小時的1/2次方 69
Figure 4.26 Ni/Au-SAC105A在155 oC下之Cross section:(a)5, (b)10, (c)20, (d)30, (e)40, (f)45, (g)60天 70
Figure 4.27 Ni/Au-SAC305A在155 oC下之Cross section:(a)5, (b)10, (c)20, (d)30, (e)40, (f)45, (g)60天 71
Figure 4.28 Ni/Au-SAC105A厚度對時間作圖:(a)時間為天數, (b)時間為小時的1/2次方 72
Figure 4.29 Ni/Au-SAC105C在155 oC下之Cross section:(a)as reflow, (b)5, (c)10, (d)20, (e)30, (f)40, (g)45, (h)60天 73
Figure 4.30 Ni/Au-SAC305C在155 oC下之Cross section:(a)as reflow, (b)5, (c)10, (d)20, (e)30, (f)40, (g)45, (h)60天 74
Figure 4.31 Ni/Au-SAC105A厚度對時間作圖:(a)時間為天數, (b)時間為小時的1/2次方 75
Figure 4.32 Ni/Au-SAC105S在155 oC下之Cross section:(a)as reflow, (b)5, (c)10, (d)20, (e)30, (f)40, (g)45, (h)60天 76
Figure 4.33 Ni/Au-SAC305S在155 oC下之Cross section:(a)as reflow, (b)5, (c)10, (d)20, (e)30, (f)40, (g)45, (h)60天 77
Figure 4.34 Ni/Au-SAC305S厚度對時間作圖:(a)時間為天數, (b)時間為小時的1/2次方 78
Figure 4.35 各BGA試片厚度對時間作圖 79
Figure 4.36 Ni/Au-SAC105S在155 oC下元素分佈圖:(a)as reflow, (b)5天 80
Figure 4.37 Ni/Au-SAC105S在155 oC下元素分佈圖:(a)10天, (b)20天 81
Figure 4.38 Ni/Au-SAC105S在155 oC下元素分佈圖:(a)30天, (b)40天 82
Figure 4.39 Ni/Au-SAC105S在155 oC下元素分佈圖:(a)45天, (b)60天 83
Figure 4.40 Ni/Au-SAC305S在155 oC下元素分佈圖:(a)as reflow, (b)5天 84
Figure 4.41 Ni/Au-SAC305S在155 oC下元素分佈圖:(a)10天, (b)20天 85
Figure 4.42 Ni/Au-SAC305S在155 oC下元素分佈圖:(a)30天, (b)40天 86
Figure 4.43 Ni/Au-SAC305S在155 oC下元素分佈圖:(a)45天, (b)60天 87
Figure 4.44 Ni/Au-SAC105C定量分析:(a)as reflow, (b)5天 88
Figure 4.45 Ni/Au-SAC105C定量分析:(a)10天, (b)20天 89
Figure 4.46 Ni/Au-SAC105C定量分析:(a)30天, (b)45天 90
Figure 4.47 Ni/Au-SAC105C定量分析:60天 91
Figure 4.48 Ni/Au-SAC305C定量分析:(a)as reflow, (b)5天 92
Figure 4.49 Ni/Au-SAC305C定量分析:(a)10, (b)20天 93
Figure 4.50 Ni/Au-SAC305C定量分析:(a)30, (b)40天 94
Figure 4.51 Ni/Au-SAC305C定量分析:(a)45, (b)60天 95
Figure 4.52 Ni/Au-SAC105S定量分析:(a)as reflow, (b)5天 96
Figure 4.53 Ni/Au-SAC105 S定量分析:(a)10天, (b)20天 97
Figure 4.54 Ni/Au-SAC105 standard定量分析:30天 98
Figure 4.55 Ni/Au-SAC105S定量分析:40天 99
Figure 4.56 Ni/Au-SAC105S定量分析:45天 100
Figure 4.57 Ni/Au-SAC105S定量分析:60天 101
Figure 4.58 Ni/Au-SAC305S定量分析:(a)as reflow, (b)5天 102
Figure 4.59 Ni/Au-SAC305S定量分析:(a)10天, (b)20天 103
Figure 4.60 Ni/Au-SAC305S定量分析:30天 104
Figure 4.61 Ni/Au-SAC305S定量分析:40天 105
Figure 4.62 Ni/Au-SAC305S定量分析:45天 106
Figure 4.63 Ni/Au-SAC305S定量分析:60天 107
Figure 4.64 SAC105與305在155 oC,IMC成長圖 108
參考文獻 References
1. 劉漢城,“球腳格狀陣列封裝技術”,鴻海精密工業,1997

2. 鐘文仁、陳佑任,“IC封裝製程與CAE應用(初版)”,全華圖書,2003

3. Z. Mei, M. Kaufmann, A. Eslambolchi, and P. Johnson, “Brittle Interfacial Fracture of PBGA Packages on Electronless Ni/Immersion Au,” Proc. 48th Electronic Component and Technology Conference, pp. 952-961, 1998.

4. N. Duan , J. Scheer, J. Bielen , M. van Kleef, “The Influence of Sn–Cu–Ni(Au) and Sn–Au Intermetallic Compounds on the Solder Joint Reliability of Flip Chips on Low Temperature Co-fired Ceramic Substrates,” Microelectronics Reliability, Vol. 43, pp.1317-1327, 2003.

5. A. Syed, “Reliability and Au Embrittlement of Lead Free Solders for BGA Applications,”Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on, pp. 143-147, 2001.

6. 田民波,“半導體電子元件構裝技術”,五南圖書,2005

7. C.M. Liu, C.E. Ho, W.T. Chen, and C.R. Kao, “Reflow Soldering and Isothermal Solid-State Aging of Sn-Ag Eutectic Solder on Au/Ni Surface Finish,” Journal of Electronic Materials, Vol. 30, No. 9, p. 1152, 2001.

8. C.H. Lin, S.W. Chen, and C.H. Wang, “Phase Equilibria and Soilification Properties of Sn-Cu-Ni Alloys,” Journal of Electronic Materials, Vol. 31, No. 9, pp. 907-915, 2002.

9. A. Zribi, A. Clark, L. Zavalij, P. Borgesen, and E.J. Cotts, “The Growth of Intermetallic compounts at Sn-Ag-Cu Solder/Cu and Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of the Solder Microstructure, ” Journal of Electronic Materials, Vol. 30, No. 6, pp. 1157-1164, 2001.

10. A. Sharif, M.N. Islam, and Y.C. Chan, “Interfacial Rections of BGA Sn-3.5%Ag-0.5%Cu and Sn-3.5%Ag Solders during high-temperature Aging with Ni/Au Metallization,” Materials Science and Engineering B, Vol. 113, pp. 184-189, 2004.

11. L.C. Shiau, C.E. Ho, and C.R. Kao, “Reactions between Sn-Ag-Cu Lead-free Solders and the Au/Ni Surface Finish in Advanced Electronic Packages,” Soldering and Surface Mount technology, Vol. 14, No. 3, pp. 25-29, 2002.

12. C.E. Ho., Y.L. Lin, and C.R. Kao, Chemistry of Material, Vol. 14, No. 3, pp. 949-951, 2002.

13. 高振宏,羅偉誠,2002材料年會中國材料科學學會,2002年年會論文集(光碟),電子構裝及材料組。

14. J.W. Yoon, S.W. Kim, and S.B. Jung, “IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate,” Journal of Alloys and Compounds, Vol. 392, pp. 247-252, 2005.

15. K.L. Lin, P.C. Shih, “IMC Formation on BGA Package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge Solder Balls,” Journal of Alloys and Compounds, Vol. 452, pp. 291-297, 2008.

16. M.J. Rizvi, C. Bailey, Y.C. Chan, M.N. Islam, and H. Lu, “Effect of Adding 0.3 wt% Ni into the Sn-0.7 wt% Cu Solder Part II. Growth of Intermetallic Layer with Cu During Wetting and Aging,” Journal of Alloys and Compounds, Vol. 438, pp. 122-128, 2007.

17. K.S. Kim, J.M. Yang, C.H.Yu, I.O. Jung, and H.H. Kim, “Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad,” Journal of Alloys and Compounds, Vol. 379, pp. 314-318, 2004.

18. T. Gregorich, P. Holmes, J. C.B. Lee, and C. C. Lee, “SnNi and SnNiCu Intermetallic Compounds Found when using SnAgCu Solders,” IPC/Soldertec Global 2nd Int. Conf. on Lead Free Electronics, 2004.

19. Y.C. Sohn, Jin Yu, S.K. Kang, D.Y. Shih, and T.Y. Lee, “Effect of Intermetallics Spaclling on the Mechanical Behavior of Electroless Ni(P) Pb-free Solder Interconnection,” Electronic Components and Technology Conference, pp. 83-88, 2005.

20. R.J. Coyle,A. Holliday, P. Mescher, P.P. Solan, S.A. Gahr, H.A. Cyker, K. Dorey, and T.I. Ejim, “The Influence of NickeVGold Surface Finish on the Assembly Quality and Long Term Reliability of Thermally Enhanced BGA Packages,” Electronics Manufacturing Technology Symposium twenty-fourth IEEE/CPMT, pp. 23-35, 1999.

21. P. Oberndorff, “Lead-free solder systems,”PhD thesis, Technical University of Eindhoven, pp.61–70, 2001.

22. 張貴閔,“BGA無鉛(Sn-Ag-Cu)接點之顯微分析研究”,國立中山大學材料科學所 碩士論文,2005

23. 林勝志,“錫銀銅無鉛焊料可靠度及環形介金屬形成機制的探討”,國立中山大學材料科學所 博士論文,2006

24. 杞金樹,“BGA含鉛(Pb-Sn)與無鉛(Sn-Ag-Cu)接點之顯微分析研究”,國立中山大學材料科學所 碩士論文,2001
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