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論文名稱 Title |
無鉛錫球脫落機制研究 The Study of Mechanism for Pb-free Solder Lift-off |
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系所名稱 Department |
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畢業學年期 Year, semester |
語文別 Language |
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學位類別 Degree |
頁數 Number of pages |
123 |
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研究生 Author |
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指導教授 Advisor |
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召集委員 Convenor |
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口試委員 Advisory Committee |
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口試日期 Date of Exam |
2009-06-11 |
繳交日期 Date of Submission |
2009-07-16 |
關鍵字 Keywords |
脫落機制、無鉛錫球 Pb-free solder, lift-off |
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統計 Statistics |
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中文摘要 |
本研究計畫配合南茂公司的實驗計畫及中正大學機械系的無鉛錫球快速衝擊測試結果,分析SAC105和SAC305試片,利用reflow不同溫度條件,經由時效5至60天後之破裂面及橫截面顯微組織,有系統的探討介金屬相與型態的影響及可能的無鉛錫球脫落機制。 實驗結果發現錫球破裂面依IMC位置不同可分成ModeA、ModeB、ModeC、ModeD。由元素分佈圖推測破裂層由下而上為Ni、(Ni,Cu,Sn)、Sn,其中破裂型態途徑可分成ModeC1、ModeC2、ModeC3、ModeD1,而經由時效後,IMC層厚度增加,破裂型態均為ModeC3,主要破裂的IMC層為(Cu,Ni,Au)6Sn5且破裂至Ni層。 Reflow溫度不同,IMC增加的厚度也不同,其中standard為最厚,X組為最薄,又SAC305增加的厚度比SAC105快速,均受擴散控制所影響。 |
Abstract |
none |
目次 Table of Contents |
目錄 摘要 i 目錄 ii 表目錄 v 圖目錄 vi 壹、 前言 1 1.1研究背景 1 1.2研究動機 2 貳、 文獻回顧 4 2.1無鉛銲料 4 2.1.1 Sn-Ag銲料 5 2.1.2 Sn-Ag-Cu銲料 6 2.1.3 Sn-Cu銲料 7 2.1.4 Sn-Zn銲料 8 2.2 銲錫接點的脆性破壞 8 2.3 破裂型態 9 參、 實驗方法與步驟 10 3.1 實驗目的 10 3.2 儀器設備 10 3.3 實驗流程 12 3.4 試片種類 12 3.4.1 衝擊試片 12 3.4.2 時效處理後衝擊試片 13 3.4.3 時效處理試片 13 3.5 測試電路板 14 3.6衝擊試片 14 3.7 金相處理 14 3.8 試片分析 15 肆、 實驗結果與討論 17 4.1 測試電路板 17 4.1.1 OSP電路板 17 4.1.2 Ni/Au電路板 17 4.1.3 比較電路板 18 4.2 破裂面分析 18 4.2.1 基板表面Mode 18 4.2.2 破裂面型態 19 4.2.3 時效後破裂面型態 20 4.3 錫球接點界面反應 21 4.3.1 錫球接合部位IMC成長行為 21 4.3.2 錫球內部析出IMC 22 4.3.3 各成分擴散行為 22 4.4 介金屬化合物成分分析 23 4.5 破裂面與cross section比較 25 伍、 結論 26 5.1錫球破裂型態 26 5.2 界面反應IMC 26 陸、 參考文獻 28 表目錄 Table 2.1無鉛銲料的分類及特性 34 Table 2.2 Sn-Ag-Cu/Ni界面IMC形成之EPMA成分分析 35 Table 3.1 reflow溫度條件 41 Table 3.2 試片種類編號 41 Table 3.3 SAC305S時效衝擊試片編號 42 Table 3.4 SAC105S時效衝擊試片編號 42 圖目錄 Figure 1.1三種常見的晶片接合於電路板方式 33 Figure 1.2常見的BGA試片 33 Figure 2.1錫球與基板示意圖 36 Figure 2.2 FCII-SnPb試片EPMA之Cu、Ni、Au的擴散 36 Figure 2.3 Sn-Ag-Cu在240 oC的三元相圖 37 Figure 2.4 Sn-Ag-Cu/Ni在reflow溫度255 oC之SEM影像,反應時間為:(a)1 s, (b)1 min, (c)5 min, (d)10 min, (d)20 min 38 Figure 2.5 Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge銲料與Cu/Ni-P/Au基板IMC(a)cross section (b)surface 39 Figure 2.6 Sn-Zn銲料電鍍Ni/Au於Cu pad上時效溫度150 oC時間900h的界面反應(a)Sn-7Zn (b)Sn-8Zn-3Bi 39 Figure 2.7 破裂面Mode 40 Figure 3.1 衝擊試片示意圖 43 Figure 3.2 reflow profile 43 Figure 3.3 基板側面示意圖 44 Figure 3.4 Holder側面示意圖 44 Figure 4.1 電路板OSP-SAC105凸狀基板 45 Figure 4.2 電路板OSP-SAC305凹狀基板 46 Figure 4.3 電路板Ni/Au-SAC105凸狀基板 47 Figure 4.4 電路板Ni/Au-SAC305凹狀基板 48 Figure 4.5基板破裂面 49 Figure 4.6 基板破裂面:(a)從IMC層破裂且下方無殘留銲料, (b)從IMC層破裂且下方殘留銲料, (c)Ni層中破裂, (d)從銲料中破裂, (e)側面示意圖 50 Figure 4.7破裂面依IMC位置分為四類型:(a)Mode A, (b)Mode B, (c)Mode C, (d)Mode D 51 Figure 4.8 破裂面錫球:(a)RT-T021-0.3錫球SEI 150X(箭頭為推球方向), (b)RT-T021-0.5錫球SEI 150X, (c)為(a)中1號位置SEI1000X, (d)為(b)放大至1000X, (e)為(a)中2號位置SEI1000X 52 Figure 4.9 破裂型態Mode C1 53 Figure 4.10 破裂型態Mode C2 54 Figure 4.11 破裂型態Mode C3 55 Figure 4.12 破裂型態Mode D1 56 Figure 4.13 SAC305S時效處理後的衝擊試片基板與錫球配對SEI 150X 57 Figure 4.14 SAC305S時效5天破裂型態Mode 58 Figure 4.15 SAC305S時效20天破裂型態Mode 59 Figure 4.16 SAC30S時效30天破裂型態Mode 60 Figure 4.17 SAC305S時效40天破裂型態Mode 61 Figure 4.18 SAC305S時效45天破裂型態Mode 62 Figure 4.19 破裂面SAC305S時效5天EDS分析 63 Figure 4.20 破裂面SAC305S時效30天EDS分析 64 Figure 4.21 破裂面SAC305S時效45天EDS分析 65 Figure 4.22 SAC105S時效處理後的衝擊試片基板與錫球配對 66 Figure 4.23 SAC105S時效45天破裂型態Mode 67 Figure 4.24 Ni/Au-SAC105X在155 oC下之Cross section:(a)as reflow, (b)5, (c)10, (d)20, (e)30, (f)40, (g)45, (h)60天 68 Figure 4.25 Ni/Au-SAC105X厚度對時間作圖:(a)時間為天數, (b)時間為小時的1/2次方 69 Figure 4.26 Ni/Au-SAC105A在155 oC下之Cross section:(a)5, (b)10, (c)20, (d)30, (e)40, (f)45, (g)60天 70 Figure 4.27 Ni/Au-SAC305A在155 oC下之Cross section:(a)5, (b)10, (c)20, (d)30, (e)40, (f)45, (g)60天 71 Figure 4.28 Ni/Au-SAC105A厚度對時間作圖:(a)時間為天數, (b)時間為小時的1/2次方 72 Figure 4.29 Ni/Au-SAC105C在155 oC下之Cross section:(a)as reflow, (b)5, (c)10, (d)20, (e)30, (f)40, (g)45, (h)60天 73 Figure 4.30 Ni/Au-SAC305C在155 oC下之Cross section:(a)as reflow, (b)5, (c)10, (d)20, (e)30, (f)40, (g)45, (h)60天 74 Figure 4.31 Ni/Au-SAC105A厚度對時間作圖:(a)時間為天數, (b)時間為小時的1/2次方 75 Figure 4.32 Ni/Au-SAC105S在155 oC下之Cross section:(a)as reflow, (b)5, (c)10, (d)20, (e)30, (f)40, (g)45, (h)60天 76 Figure 4.33 Ni/Au-SAC305S在155 oC下之Cross section:(a)as reflow, (b)5, (c)10, (d)20, (e)30, (f)40, (g)45, (h)60天 77 Figure 4.34 Ni/Au-SAC305S厚度對時間作圖:(a)時間為天數, (b)時間為小時的1/2次方 78 Figure 4.35 各BGA試片厚度對時間作圖 79 Figure 4.36 Ni/Au-SAC105S在155 oC下元素分佈圖:(a)as reflow, (b)5天 80 Figure 4.37 Ni/Au-SAC105S在155 oC下元素分佈圖:(a)10天, (b)20天 81 Figure 4.38 Ni/Au-SAC105S在155 oC下元素分佈圖:(a)30天, (b)40天 82 Figure 4.39 Ni/Au-SAC105S在155 oC下元素分佈圖:(a)45天, (b)60天 83 Figure 4.40 Ni/Au-SAC305S在155 oC下元素分佈圖:(a)as reflow, (b)5天 84 Figure 4.41 Ni/Au-SAC305S在155 oC下元素分佈圖:(a)10天, (b)20天 85 Figure 4.42 Ni/Au-SAC305S在155 oC下元素分佈圖:(a)30天, (b)40天 86 Figure 4.43 Ni/Au-SAC305S在155 oC下元素分佈圖:(a)45天, (b)60天 87 Figure 4.44 Ni/Au-SAC105C定量分析:(a)as reflow, (b)5天 88 Figure 4.45 Ni/Au-SAC105C定量分析:(a)10天, (b)20天 89 Figure 4.46 Ni/Au-SAC105C定量分析:(a)30天, (b)45天 90 Figure 4.47 Ni/Au-SAC105C定量分析:60天 91 Figure 4.48 Ni/Au-SAC305C定量分析:(a)as reflow, (b)5天 92 Figure 4.49 Ni/Au-SAC305C定量分析:(a)10, (b)20天 93 Figure 4.50 Ni/Au-SAC305C定量分析:(a)30, (b)40天 94 Figure 4.51 Ni/Au-SAC305C定量分析:(a)45, (b)60天 95 Figure 4.52 Ni/Au-SAC105S定量分析:(a)as reflow, (b)5天 96 Figure 4.53 Ni/Au-SAC105 S定量分析:(a)10天, (b)20天 97 Figure 4.54 Ni/Au-SAC105 standard定量分析:30天 98 Figure 4.55 Ni/Au-SAC105S定量分析:40天 99 Figure 4.56 Ni/Au-SAC105S定量分析:45天 100 Figure 4.57 Ni/Au-SAC105S定量分析:60天 101 Figure 4.58 Ni/Au-SAC305S定量分析:(a)as reflow, (b)5天 102 Figure 4.59 Ni/Au-SAC305S定量分析:(a)10天, (b)20天 103 Figure 4.60 Ni/Au-SAC305S定量分析:30天 104 Figure 4.61 Ni/Au-SAC305S定量分析:40天 105 Figure 4.62 Ni/Au-SAC305S定量分析:45天 106 Figure 4.63 Ni/Au-SAC305S定量分析:60天 107 Figure 4.64 SAC105與305在155 oC,IMC成長圖 108 |
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