隨著科技的發展，如微機電系統、顯示器元件與生物醫療產品等，帶動了微小化元件的需求量，使元件加工尺寸要求向下探至奈米等級。現今，微光刻電鑄模造技術（LIGA，譯至德文Lithographie, Galvanoformung, and Abformung），乃一常見的微小化加工技術，可製造出多變化圖樣且具高深寬比的微結構，精度可達一微米以下。其主要技術包含：光刻、電鍍與模造。微結構主要是靠電鍍製程將金屬沈積而成，因此電鍍材料選用有其限制所在。再者，光刻製程需要高能量的X光以光刻出高深寬比的光阻結構，故需利用同步輻射設備產生具高能量的X光，因此提高了製程的費用。
金屬玻璃為二十世紀末發展出來的新興材料，由於它是缺乏結晶、無晶格界線且無差排的結構，造就了具單相且均質特性的非晶質合金。因此，金屬玻璃結構可小至原子等級，是微小化製程的另一種材料選擇。與同種純金屬比較，具備高強度、高硬度、高拉伸極限與高抗腐之特性。再者，在過冷液相區（材料玻璃轉換溫度與結晶溫度之間），其極佳的可加工性與可壓印能力特性已經在近來受到矚目與研究。
由於輕量型鎂基非晶質合金具良好之玻璃成型能力（Glass forming ability），可達元件輕量化與製程簡單化之優點。故本文除探討LIGA技術外，提出另一創新製程，結合UV-LIGA與金屬玻璃可熱塑性特性製作微結構，探討鎂銅釔（Mg58Cu31Y11）金屬玻璃之熱成型性與用於壓印材料的可能性。首先，利用電鍍技術製作具高硬度之鎳鈷合金模具，再由熱壓印方法，熱壓溫度設定在約150 oC，將鎳鈷模具上的微結構轉印到鎂基非晶質合金，可形成第二模具。就成型能力而言，鎂銅釔金屬玻璃需要之壓印壓力較一般常用的壓印材料聚甲基丙烯酸甲酯（PMMA, Polymethylmethacrylate）低，故有較易壓印成型的特性。因此，鎂銅釔非晶質合金為一適合壓印加工且可快速成型的材料。
此外，以不同形狀與材料的模具轉印於鎂基非晶質合金，再次說明鎂銅釔非晶質合金的加工性。其一，利用溫度轉變造成硬度改變的特性，可將較軟之材料無氧銅（常溫下，硬度1.606 GPa）上的結構轉印到鎂銅釔金屬玻璃（常溫下，硬度3.445 GPa）；其二，利用多道熱壓印方法，可將三角微陣列縮印至鎂銅釔金屬玻璃，以縮小原結構尺寸。最後，利用奈米壓痕系統測試鎂銅釔非晶質合金的機械性質，可供將來該材料應用於更小尺寸加工之參考。

Advancements in technologies such as microelectromechanical systems (MEMS), display devices, biomedical products have created an increasing requirement for miniature components on the scale of micrometers to nanometers. Currently, a commonly used fabrication for miniaturization is LIGA (Lithographie, Galvanoformung, and Abformung). It is a reliably manufacturing method for high-aspect-ratio microstructures with a precision of less than one micrometer. The use of electroplating within LIGA techniques, however, limits the range of materials that can be used. But the main disadvantage of LIGA is its cost: high-energy X-rays generated by synchrotron equipment.
The homogeneous and isotropic characteristics of amorphous bulk metallic glasses (BMGs) due to the absence of crystallites, grain boundaries and dislocations lead to the scale of the metallic-glass structures can be miniaturized down to the atomic scale, which presents very high strength, hardness, elastic strain limit and corrosion resistance. In addition, the excellent workability and surface printability in the supercooled liquid state (the region defined from the glass transition temperature (Tg) to the crystallization temperature (Tx) of BMG) has been considered to be one of the most attractive properties of BMGs.
The lighter Mg-based metallic glasses exhibit their superior glass forming ability (GFA). Consequently, the using of Mg-based BMGs can gain the goals of light devices and simplify manufacturing process. In this study, therefore, besides the study of LIGA process, a new process utilize the thermoplastic properties of BMGs is presented. First, UV (ultraviolet) -LIGA, a more economical process than LIGA, is used to fabricate the master mold with nickle-cobalt (Ni-Co) alloy. Then, this mold is applied to hot emboss on Mg58Cu31Y11 amorphous alloy to form a secondary mold. The hot embossing temperature is set at 423 K (150 oC) according to the Tg of the BMG around 413 K (140 oC). This embossing process shows that the thermoplastic forming ability of the BMG material is better than Polymethylmethacrylate (PMMA) which requires high hot embossing pressure. BMG is not only a good material for hot embossing process to fabricate microstructure directly, but also a fast-forming material for mold (or die) fabrication.
On the other hand, other replicated-able moulds are presented to demonstrate the multifunctional ability of BMGs. First, a mold of oxygen free copper (OFC) with a very low hardness of 1.606 GPa, which is a popular material for machining due to its good machinability, is used to hot emboss on Mg58Cu31Y11 BMG with a higher hardness of 3.445 GPa. Second, micro triangular-pyramidal array (MTPA) on a tungsten (W) steel mold is transferred on Mg58Cu31Y11 BMG using this modified multi-step hot-embossing method to reduce the pattern size. In addition, scratch test with the Nano Indenter® XP system is used to study the mechanical behavior of the Mg58Cu31Y11 BMG for the application such as surface printability.

Content i
Table captions iv
Figure captions v
中文摘要 xiii
Abstract xv
Chapter 1 Introduction 1
1.1 General background 1
1.2 Metallic glass 3
1.3 Mg-based metallic glass 6
1.4 Concept of mold transformation 11
Chapter 2 Survey 13
2.1 Manufacturing of nano/micro structures 13
2.2 MEMS process 13
2.2.1 Mechanical precision manufacturing 13
2.2.2 Direct writing techniques 14
2.2.3 LIGA, LIGA-like process 16
2.3 Imprint 25
2.3.1 Nanoimprinting lithography 25
2.3.2 Hot embossing 25
2.4 Purpose of this work 28
Chapter 3 Theory and methodology 31
3.1 Theoretical analysis of scratch test 31
3.1.1 Prediction of forces in Berkovich scratch 31
3.1.2 Normal force on Berkovich 34
3.1.3 Tangential force on Berkovich 35
3.2 FEM simulation 37
3.2.1 Forming theorem of gapless hexagonal micro-lens 37
3.2.3 FEM pre-processor 41
3.3 Device design 43
3.3.1 Procedure of LIGA-like process 43
3.3.1.1 Gapless hexagonal lens mold 44
3.3.1.2 Dosage Estimation 45
3.3.2 Mechanical precision manufacturing 48
3.3.2.1 Aspheric lens mold 48
3.3.2.2 Triangular-pyramidal lens mold 49
Chapter 4 Results and discussions 51
4.1 Mechanical properties 51
4.1.1 Friction coefficient 51
4.1.2 Prediction of forces 52
4.1.3 Effect of scratch velocity 56
4.1.4 Effect of normal load 58
4.1.5 Effect of temperature 59
4.2 FEM simulation results 63
4.2.1 Thermoplastic forming behavior of Mg58Cu31Y11 BMG 64
4.2.2 Hot-embossing on Mg58Cu31Y11 BMG 65
4.3 Results of mold replicated 69
4.3.1 Gapless hexagonal lens replicated 70
4.3.1.1 Ni-Co mold 70
4.3.1.2 Mg58Cu31Y11 mold with hexagonal lens 75
4.3.1.3 PMMA sheet with hexagonal lens 80
4.3.1.4 Effect of coefficient of thermal expansion 83
4.3.2 Aspheric surface replicated 85
4.3.2.1 OFC aspheric lens mold 85
4.3.2.2 Hot embossing onto BMG 87
4.3.3 MTPA microstructures replicated 93
4.3.3.1 MTPA lens W-steel mold 93
4.3.3.2 One-stepped hot-embossing process 93
4.3.3.3 Multi-step hot-embossing process 100
4.3.3.4 Convex MTPA PMMA microstructures 101
Chapter 5 Conclusions 104
Reference 107
Appendix A 125

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Chapter 2
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Chapter 3
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Chapter 4
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