摘 要
本文是針對覆晶晶粒尺寸構裝在溫度循環作用下，利用有限元素分析軟體ANSYS進行模擬，探討縫隙填膠之熱膨脹係數、不同機械性質之四種縫隙填膠及有無加裝金屬蓋等參數，對此構裝體之位移、應變及應力的影響。
研究結果顯示，就整體而言，最大等效應力與最大等效應變均發生在距離對稱中心最遠處晶片和縫隙填膠之交界上，就錫鉛凸塊而言，發生在距離對稱中心最遠之最外顆錫鉛凸塊上方位置。隨著縫隙填膠熱膨脹係數之增加，構裝體之最大位移最大等效應變及最大等效應力會跟著增加。加裝金屬蓋能有效降低構裝體之位移量，本文之構裝體而言，至少可降低一半以上，不過加裝金屬蓋會增加構裝體之最大等效應變及最大等效應力。經本文交叉模擬之結果，不論有無加裝金屬蓋，縫隙填膠D均是四種中較好的選擇，這是因為其材料性質的關係，可見對於此種構裝體，選擇縫隙填膠之基本原則為：熱膨脹係數略小於錫鉛凸塊且楊氏係數要大。

Abstract
The thesis is aimed to analyze the flip chip in chip scale package (CSP) by finite element method incorporated with software ANSYS due to thermally cyclic loading. The coefficient of thermal expansion (CTE) of underfill and different mechanical properties of four kinds underfill-A, B, C, D and with/without metal cap are considered as parameters. The effects of above-mentioned parameters on package’s displacement, strain and stress fields are studied.
The results show that the maximum equivalent strain and stress take place at the interface between chip and underfill far away from the center of the whole package and on the top of the most outside solder bump in the solder joint. The larger the CTE of underfill is, the larger the maximum equivalent strain and stress are. Package with metal cap can reduce the displacement to almost half or more of that without cap, but increase the values of maximum equivalent strain and stress. No matter with metal cap or not, the underfill D is the best choice. Hence, the underfill material properties possess lower CTE and larger Young’s modulus than those of solder bump.

目錄
摘要 ………………………………………………………………Ⅰ
英文摘要 …………………………………………………………Ⅱ
目錄 ………………………………………………………………Ⅲ
表目錄 ………………………………………………………………Ⅴ
圖目錄 ………………………………………………………………Ⅵ
第一章 緒論 …………………………………………………… 1
1-1 前言 ………………………………………………… 1
1-2 IC封裝簡介 ………………………………………… 1
1-2-1 覆晶晶粒尺寸構裝之介紹及製程 ……………… 2
1-2-2 覆晶晶粒尺寸構裝結構 ………………………… 3
1-3 研究方向 ……………………………………………… 3
1-4 文獻回顧 ………………………………………………3
1-5 組織與章節 ……………………………………………5
第二章 理論部分 ………………………………………………9
2-1 非線性理論分析 ……………………………………9
2-2 彈塑性理論 …………………………………………12
2-2-1 應力應變曲線 …………………………………12
2-2-2 降伏點規範 ……………………………………12
2-2-3 塑性變形理論 …………………………………13
2-2-4 三維應力應變關係 ……………………………13
第三章 數值模擬 … …………………………………………21
3-1 基本假設 ……………………………………………21
3-2 模型架構 ……………………………………………21
3-2-1 邊界條件與負載 ………………………………22
3-2-2 分析之參數 ……………………………………23
3-3 ANSYS有限元素分析軟體 …………………………23
3-3-1 結構分析 ………………………………………24
第四章 結果與分析 …………………………………………35
4-1 模擬結果 ……………………………………………35
4-2 縫隙填膠之分析 ……………………………………38
4-3 加裝金屬蓋之分析 …………………………………39
第五章 結論與未來展望 ……………………………………65
5-1 結論 ………………………………………………65
5-2 未來展望 …………………………………………65

參考文獻 ……………………………………………………………67

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