隨著電子封裝朝無鉛製程的發展，可攜式電子產品受到衝擊負載的研究亦漸漸的受到重視。目前掉落測試，大部分的破壞模式都發生在介金屬層（IMC）或介金屬層與錫球的邊界上。本文利用3D數值分析軟體ANSYS/LS_DYNA，找出適合的數值模型來進一步分析無鉛錫球受到衝擊負載後，錫球斷裂情形。本文主要是比較模擬和衝擊試驗系統的關係，研究衝擊應力對於各種參數的探討去分析錫球衝擊試驗中的影響結果，利用數值方式和實驗衝擊位移跟錫球接點的可靠度研究，以及探討IMC層的失效模式，改變尺寸大小參數觀察對整體衝擊試驗的影響。
由數值分析結果可知，在此高應變率下，可以觀察錫球接點的機械性質。不同IMC強度下則會產生錫球三種斷裂之破壞模式，而含有IMC與部份錫球斷裂情形之破壞模式則需要更精細的有限元素模型才能產生。此外，發現到速度對於衝擊試驗有相當的影響，速度越快所得到的衝擊應力越小，主要由於錫球材料參數需採用與應變率相依之參數，衝擊測試實際上並非單純的剪力作用。使用模擬來進行此動態實驗可更有效觀察到錫球接點受到破壞的過程。

With the electronic packaging towards the rapid development of lead free process, the related research on the portable electronic devices subject to impact load is emphasized urgently. At present, the failure modes of fracturing in IMC layer and fracturing on IMC/solder boundary are mostly encountered due to drop test and cyclic bending test respectively. The purpose of this work is to use 3D numerical analysis software ANSYS/LS_DYNA, that were found to be a suitable numerical model for further analyzing the impact fracture of lead-free solder. The relationship between simulation and ball impact test system was compared and the effects of variable parameters on solder balls subjected to impact loading was investigated. Also, the transient deformation and fracturing of solder joints subjected to the impact load were studied numerically and experimentally. Then, the transient response and the failure modes of the solder joint due to impact load were predicted by varied strain rate tests.
From the numerical results, the strain rate mechanical properties of solder joint due to high can be effectively obtained. The difference of IMC strength caused three kinds of failure modes of the solder ball, however the failure mode of fracturing in IMC and a party of solder requires a model to simulate with more refined meshes. Different velocities affected the numerical results significantly. The higher the velocity of impact test applied, the lower the impact loading received. That is mainly attributed to the material parameters adopted of a solder ball is strongly dependent on the strain rate considered. Also, it is found that the impact test in reality does not result in a shear-dominant failure mode. While using dynamic simulation instead of the experiment, the damage process of solder joint can be observed. That provides a good reference and contrast for the experimental work in the future.

目錄 5
第一章、緒論 12
1-1 前言 12
1-2 封裝簡介 12
1-3無鉛錫球的發展 14
1-4 研究方向及文獻回顧 16
1-5 組織與章節 18
第二章 模擬規劃與理論基礎 22
2-1 模擬分析目的與動機 22
2-2 衝擊理論 22
2-3 有限元素分析理論 27
2-3-1 顯性解法與隱性解法（Explicit Method & Implicit Method） 27
2-3-3 中央差分法 27
2-3-4 接觸演算法（Contact Algorithms） 28
2-3-5 時間步驟控制（Time Step Control） 29
2-3-6 沙漏現象（Hourglass deformation） 30
2-4 材料非線性 31
2-4-1 降伏條件 31
第三章、模型建立與參數討論 37
3-1 前言 37
3-2 物理模型 37
3-2-1 球碰撞平板耐久度模擬試驗 37
3-2-2 狗骨頭拉伸模型試驗 37
3-2-3 錫球衝擊試驗模擬模型 42
3-3 數值模型討論 42
3-3-1 基本假設 43
3-3-2 介金屬（IMC）破壞規範 44
3-3-3 材料參數 45
3-3-4 網格分析 46
3-3-5 定義破壞模式 46
3-4邊界條件討論 47
3-4-1邊界長度設定 47
3-6提出數值模型 47
第四章、模擬結果與討論 60
4-1 前言 60
4-2 破壞模式與IMC設定強度關係 60
4-3 改變錫球尺寸的影響 61
5-4 拒銲劑(Solder mask)厚度的研究 62
4-5 Pad 厚度的參數研究 63
4-6 對於錫球材料參數的應變率研究 63
4-6-1 改變錫球材料參數-觀察衝擊應力 64
4-6-2 材料參數的討論 65
（1）改變楊氏係數 65
（2）改變應力應變數值-固定楊氏係數 66
第五章、討論分析 80
5-1 尺寸參數的改變 80
5-2 改變應變率和材料系數的衝擊試驗 80
第六章、結論與未來展望 85
6-1結論 85
6-2未來展望 85

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