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博碩士論文 etd-0718112-135700 詳細資訊
Title page for etd-0718112-135700
論文名稱
Title
高功率螢光玻璃發光二極體模組之溫度與熱應力分佈
Temperature and Thermal Stress Distributions on High Power Phosphor Doped Glass LED Modules
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
123
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2012-06-28
繳交日期
Date of Submission
2012-07-18
關鍵字
Keywords
高功率白光二極體、玻璃螢光體、含磷矽膠、有限元素分析
glass phosphor, phosphorescent silicone, finite element analysis, high power white light-emitting diode
統計
Statistics
本論文已被瀏覽 5635 次,被下載 587
The thesis/dissertation has been browsed 5635 times, has been downloaded 587 times.
中文摘要
本研究探討高功率發光二極體構裝參數,與其發光時工作溫度及熱應力分佈之關係。文中採用有限元素分析套裝軟體Marc中之熱彈塑模式,進行上述性能模擬。亦利用測試結果,推導出對應之熱對流係數。文中分別針對兩種白光產生方式及其對應構裝進行分析,一為傳統含磷矽膠與藍光二極體之封裝設計,另一為玻璃螢光體與藍光二極體之封裝設計,比較分析其發光時之溫度與熱應力分佈。並分析不同封裝與模組參數:如固晶材料、晶片基板和透鏡,對其操作溫度與熱應力的影響。模擬結果顯示,上述兩種設計,在單一發光二極體晶柱其功率超過10W,且無散熱鰭片增強散熱效果時,其操作時產生的高溫,將導致晶片與基板間介面熱應力過高,產生熱龜裂破壞。文中亦探討了散熱鰭片設計之可能效益,結果顯示散熱鰭片對改善高功率發光二極體溫度與熱應力分佈極有助益。文中亦針對散熱鰭片相關參數設計,對整體發光二極體構裝溫度與熱應力分佈之影響,進行初步分析,並提出一有效的初步設計。
Abstract
The temperature and thermal stress distributions and variations of the high power LED module were studied in this work. The thermal-elastic-plastic 3D finite element models of MSC.marc software package are employed to simulate these performances for the high power LED module. Two high power white light LED module designs are investigated: one is the traditional phosphorescent silicone with blue LED module and the other is a phosphor glass lens with blue LED module. The distributions of temperature and thermal stress of in these two operating LED modules are compared and discussed. The effects of different packaging parameters:e.g. bonding materials, substrate materials, lens materials on the temperature and thermal stress have also been studied in this work. The simulated results reveal that the serious thermal crack may occur for these two designs if the power of single die is over 10 watt. The simulated results also indicate that an attached fin cooler may improve these thermal crack disadvantaged significantly. The effect of fin design parameters on the peak temperature reduction has studied. A feasible fin design for the high power LED module has also been proposed.
目次 Table of Contents
目錄
摘要 i
Abstract ii
目錄 iv
圖目錄 vi
表目錄 ix
符號說明 xi
第一章 緒論 1
1.1前言 1
1.2高功率發光二極體之發展與應用 2
1.3研究動機 4
1.4文獻回顧 8
1.4.1高功率二極體失效探究 8
1.4.2高功率二極體封裝方式探究 9
1.5組織章節 11
第二章 相關分析理論 12
2.1白光發光理論 12
2.2有限元素理論 14
2.3熱傳遞基礎理論 20
2.4應力分析理論 22
第三章 分析流程與參數設定 25
3.1有限元素分析 25
3.2建模方法與分析步驟 31
3.3模型參數驗證 38
3.4基本假設與參數規劃 39
第四章 結果與討論 50
4.1含磷矽膠模組封裝方式分析 50
4.1.1錫金用於固晶材料之影響 57
4.1.2碳化矽用於晶片基板材料之影響 63
4.1.3有機玻璃用於透鏡材料之影響 67
4.2玻璃螢光體模組封裝方式分析與基本參數比較 70
4.3散熱鰭片參數分析 83
4.3.1散熱鰭片外觀設計參數分析影響 83
4.3.2散熱鰭片之應用效果與影響 95
第五章 結論 104
5.1本文結果 104
5.2 未來工作 105
參考文獻 106
參考文獻 References
參考文獻
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