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論文名稱 Title |
聚亞醯胺薄膜自我組裝技術應用於3D微結構之研究 A Study of Polyimide Self-assembly Technology for Three-dimensional Micro Structure Applications |
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系所名稱 Department |
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畢業學年期 Year, semester |
語文別 Language |
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學位類別 Degree |
頁數 Number of pages |
55 |
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研究生 Author |
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指導教授 Advisor |
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召集委員 Convenor |
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口試委員 Advisory Committee |
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口試日期 Date of Exam |
2005-07-15 |
繳交日期 Date of Submission |
2005-07-19 |
關鍵字 Keywords |
聚亞醯胺 Polyimide |
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統計 Statistics |
本論文已被瀏覽 5662 次,被下載 0 次 The thesis/dissertation has been browsed 5662 times, has been downloaded 0 times. |
中文摘要 |
運用積體電路平面製程技術所製作而成的元件只能以二維的方式呈現,因此在許多應用上將會受到限制。待微鉸鍊及自我組裝等面型微加工技術引進後,即可實現3D微結構與元件的夢想,雖然如此,但要應用在如微型風扇此類會產生大位移的元件,仍有進一步的問題極待解決。傳統的微風扇技術是利用錫鉛球的表面張力進行微型扇葉自我組裝,但以目前技術製造直徑100μm以下的錫鉛球,仍是相當困難,因此本論文致力於開發一種與IC微影製程相容的感光型聚亞醯胺來取代傳統錫鉛球以作微扇葉舉起的接點,如此一來可大幅縮減微型風扇的尺寸;另外,聚亞醯胺薄膜具有良好的抗有機溶液的特性,因此相當適用於濕式釋放法,如此便可達到降低成本、製程積體化及減少製程複雜度之目標。 透過本論文實驗所得製程最佳化的條件,目前已成功的將微扇葉舉起至45°,扇葉面積可達200μm×200μm,製程良率超過50%。經觀察發現,聚亞醯胺薄膜作為微結構接點之關鍵製程所在為回焊溫度的設定,超過405℃以上的回焊製程溫度將會造成薄膜收縮過劇以致無法成功立起扇葉。 |
Abstract |
The device produced by IC planar process only shows in 2D, therefore, many applications may be limited. When adopted the micro hinge and self-assembly of surface micro machining technology, 3D micro structure is coming true. Even though , it’s hard to applied on micro fan this kind of producing continuous steps, further problem is waiting to solve. The traditional micro fan technology using surface tension power of the solder ball to carry out the purpose of self-assembly. Currently the diameter of solder ball smaller than 100μm is fairly difficult, using photosensitive polyimide to form a elastic joint replaces the solder ball, that slashes micro fan size. Therefore PI has very good property resisting organic solvent, hence it’s quiet suitable for using wet release, so that to achieve the purpose of cost down, process integrated and reducing the complex of process. Through the experiment, the optimal recipe has been done. Micro blade has raising to 45°, blade area can reach 200μm×200μm, yield is over 50%. After observation, the key process is reflow temperature of polyimide thin film being micro structure joint, reflow temperature over 405℃ will result in thin film shrinking strongly, and that is unable to raise blade successfully. |
目次 Table of Contents |
中文摘要..................................................I 英文摘要.................................................II 誌謝....................................................III 目錄.....................................................IV 圖目錄....................................................V 表目錄..................................................VII 第一章 緒論........................................................1 1-1 前言.................................................1 1-2 文獻回顧.............................................6 1-3 研究目標與動機.......................................8 第二章 原理分析.........................................16 2-1 前言................................................16 2-2 表面張力自我組裝機制................................17 第三章 研究方法與實驗步驟...............................23 3-1 聚亞醯胺材料特性及製程參數淬取......................24 3-2-1 聚亞醯胺材料特性..................................24 3-2-2 旋轉塗佈曲線淬取..................................26 3-2-3 聚亞醯胺對各溶液抗蝕刻測試........................29 3-3 元件光罩設計........................................30 3-4 製程規畫與實驗結果..................................33 3-4-1 Coventor Ware模擬元件製程.........................33 3-4-2 製程內容說明......................................35 3-5 元件實驗結果........................................44 第四章 討論與建議.......................................49 參考文獻.................................................52 |
參考文獻 References |
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