本文旨在研究錫球在承受高速衝擊時的結構暫態反應，分別使用實驗與模擬探討之。實驗部分共分為六組，包含不同衝擊速度、不同錫球成份、不同銲墊表面處理，不同UBM和Runner以及不同PBO之厚度實驗比較，實驗後探討錫球IMC強度和機械性質的變化，並觀察其破壞模式。
實驗結果發現，當衝擊速度超過臨界值時，錫球承受的最大衝擊力會隨著衝擊速度的增加而減少，錫球成份中添加鎳鈷能有效加強IMC處的連結強度，迴銲一次過後其IMC強度會下降，錫球中添加元素銀比例越高，在衝擊試驗下IMC處強度變弱，衝擊試驗下發現UBM為TiAl之結構優於TiAlTi之結構，且Runner中添加元素鈀可有效改善IMC強度，使衝擊之Mode I發生率減少，PBO厚度5、7.5μm對於IMC強度影響似乎不顯著。
由數值分析結果可知，在高應變率下可有效探討錫球接點的機械性質，根據IMC強度不同會產生錫球三種斷裂之破壞模式，且為IMC強度設定越強，其衝擊力亦隨之增加。設定低降服應力在低IMC強度時其衝擊力結果並非最高，但其衝擊歷時卻是最高的。

The purpose of thesis is to study the transient analysis of structural responses of solder joints under high-Speed impact. By using the experimental and simulation analysis. The experimental work can be divided into six parts, such as different impact speeds, different solder’s components, different pad finishing, different UBM and Runner, and different thickness of PBO. From experiments, the variations of solder joint strength and mechanical properties were received and discussed and the failure mode.
The empirical results show that maximum impact force on solder joints decreases as the impact speed increasing. The solder joint strength becomes stronger with the solder adopting elements of Ni and Co. The strength of solder ball was reduced significantly after a reflow. The intermetallic compound strength reduces with solder ball adopting high content of Ag. In impact test, the resistance of UBM of TiAl is better than that of TiAlTi. The runner adopted with the element Pd can improve the IMC reliablility to reduce Mode I failure. However, the PBO thickness has little influence on IMC strength.
From the numerical results, in the consideration of strain rate on solder joint the mechanical properties of solder joint could be effectively investigated. According to the different IMC strength there will produce three failure modes of solder ball and the impact force becomes higher as the IMC strength setting higher. If the lower yield stress is considered in lower IMC strength, the impact force is not the highest of all, but the time duration is the highest of all.

目錄
目錄 ………………………………………………………………I
表目錄 ..…………………………………………………………...IV
圖目錄 ..……...……………………………………………...….…..V
中文摘要…………………………………………………………….VIII
英文摘要………………………………………………………...……IX
第一章 緒論……...…………………………………………...……….1
1-1 前言………………..……………………………………………1
1-2 封裝簡介...…………..…….…...…………………….…………2
1-2-1 BGA簡介 …………………………………………………4
1-2-2 Ultra CSP與WLCSP簡介…………………………………5
1-3 研究方向及文獻回顧………………………………………......6
1-4 組織與章節…..………..………………………………………12
第二章 實驗工作………………………………….………...……….15
2-1實驗規劃…..……………………………………………………15
2-2試片介紹………..…….…………..…………………………….16
2-3機台介紹與實驗流程…………………………………………..17
2-3-1 機台介紹…………………………………………………17
2-3-2 實驗流程…………………………………………………18
2-4後分析工作………………..……………………………….…..18
2-4-1實驗參數計算…………..…………………………….…...18
2-4-2實驗後試片觀察…………………..………..………….….20
2-4-3 實驗後分析統計…………………..………..………….…21
第三章 模擬規劃與介紹……………………..……………………...31
3-1 模擬分析目的與方法…………………………………………31
3-2 有限元素分析理論……………………………………………31
3-2-1 顯性解法與隱性解法（Explicit Method & Implicit Method）…………………………………………...……31
3-2-2 中央差分法………………………………………………32
3-2-3 接觸演算法（Contact Algorithms）………………..……33
3-2-4 時間步驟控制（Time Step Control）……………....……33
3-2-5 沙漏變形(Hourglass deformation) ………………….……34
3-3 材料非線性……………………………………………………35
3-4 降伏條件………………………………..……………….….…35
第四章 實驗結果與討論……………….……………...…….………40
4-1 不同衝擊速度之BGA……………..…………,………………40
4-2 不同材料之BGA……..……………………………………....41
4-3 迴銲一次不同材料之BGA………………………………...…42
4-4不同材料之Ultra CSP…………………………………………43
4-5 不同Runner及UBM之WLCSP…………………………….44
4-6 不同材料及PBO之WLCSP…………………………………47
第五章 模型建立與參數探討………………………………….……64
5-1 前言……………………………………………………………64
5-2 錫球衝擊試驗模擬模型………………………………………64
5-3 數值模型討論…………………………………………………64
5-3-1 基本假設…………………………………………………64
5-3-2 界金屬層（IMC）破壞規範 …………………..…………66
5-3-3 材料參數 ……………………………………….…………67
5-3-4 網格分析 ……………………………………….…………67
5-3-5 定義破壞模式 …………………………………,………67
5-4 邊界條件討論 ………………………………………...….……68
5-5 模擬結果與討論 …………………………………………….…69
第六章 結論…………………………………………………....…….85
參考文獻…………………………………………………...…………87

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