伴隨著微機電技術的發展，微平台已經被使用多年。近年來大部分的微平台設計都著重於新致動機制、新材料與新製程的應用。在利用結合機構設計概念的系統化方法來設計新式微平台的這個方面， 還需要更多的研究。
　　本研究主要目的是建構出適合的方法，來設計出結合機構設計概念的新式微平台。首先根據機構的基本需求來進行微平台的分析，接著提出微接頭的概念並應用於微平台的合成上。除此之外，文中提出整個設計的流程圖，並經過挑選得到七種的微平台設計。最後經由FEM 的模擬， 確認合成出的微平台具有符合預期作動模式的良好結果。因此本研究是可以有效地應用在微機電元件的設計上。

　　Accompanying with the development of MEMS technology, microstages have been used for many years. Most of the studies on microstages have been aimed at the application of new actuators, materials and fabrication process in recent years. However, the systematic way for designing new microstages with the mechanism conceptual design approach still needs some more input.
　　The objective of this study is to establish a methodology to design new microstages employing the concept of mechanism design. First of all, new microstages for microassembly have been analyzed according to the basic requirements from the mechanism. Afterwards, the concept of microjoint has been presented and used in the synthesis of microstages. Besides, a flow chart of design procedure has been presented and seven kinds of microstages are achieved accordingly. Finally, the FEM simulation of the synthesized microstage illustrates the desirable results that reveal the good agreement with the expected motion. It is shown that this study can be efficiency applied to the design of micro scale devices.

摘要 I
Abstract II
目錄 III
圖目錄 V
表目錄 VII
第一章 緒論 1
1.1 研究背景 1
1.2 文獻回顧 2
1.2.1 靜電式致動的微平台 2
1.2.2 電熱式致動的微平台 9
1.3 研究動機與解決方案 11
1.4 研究目標與論文大綱 12
第二章 微平台製程技術簡介 14
2.1 微平台製程 14
2.2 矽基製程技術 14
2.2.1 薄膜技術 14
2.2.2 微影技術 15
2.2.3 蝕刻技術 17
2.2.4 摻雜技術 19
2.2.5 表面微加工技術 20
2.2.6 體型微加工技術 23
2.3 能量束加工技術 24
2.4 陽極接合 24
第三章 微平台之設計與分析 26
3.1 微平台的設計概念與設計程序 26
3.1.1 微平台之特性與需求 26
3.1.2 系統化設計程序 29
3.2 微平台機構之分析與設計 31
3.2.1 平台機構的構造合成 31
3.2.2 二驅動源機構合成 32
3.2.3 三驅動源機構合成 35
3.2.4 四驅動源機構合成 37
3.2.5 四驅動源機構軸對稱合成 40
3.2.6 由需求來進行合成 43
3.2.7 合成機構之挑選 44
3.3 撓性微接頭之設計與分析 47
3.3.1 撓性微接頭簡介 47
3.3.2 撓性微接頭之設計 48
3.3.3 接頭模擬與分析 50
3.3.4 撓性微接頭設計之建議 60
3.4 微平台實體設計 60
3.4.1 梳式致動器之設計 60
3.4.2 機構之實體化 64
3.4.3 微平台作動模擬與分析 67
第四章 微平台製程設計 79
4.1 具高深寬比之製程 79
4.2 微平台製程 79
4.2.1 晶圓的前處理 80
4.2.2 輔助蝕刻溝槽之加工 80
4.2.3 陽極接合 80
4.2.4 矽晶圓濕蝕刻 81
4.2.5 微平台結構之加工 81
4.2.6 犧牲層之移除 81
第五章 結論 86
參考文獻 88

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