本文主要在探討雷射二極體在雷射焊接與錫焊構裝後，經老化或熱循環潛變效應延生之光纖焊後位移與焊域殘留應力場變化。文中利用有限元素軟體MARC來建立雷射二極體組件於焊域固化時之殘留應力場，配合材料參數、焊域殘留應力場與溫度變化進行焊域潛變分析，計算光纖位置之焊後位移與潛變效應。文中為驗證分析模式之正確性亦配合雷射焊接穿透實驗，決定焊域熔池大小及深度。並由錫焊熱循環實驗結果分析比對潛變位移變化。結果顯示實驗數據與文中分析模式所得數值結果甚為相等。

The roles of residual stresses distribution and creep deformation in the post-weld-shifts (PWS) of a laser model packaging are investigated in this dissertation. The temperature dependent material properties are employed to calculate the distribution of the residual stresses introduced in the solidification of soldering joints and lasering joints respectively. A power law proposed by Norton is applied to the creep deformation calculation. The post-weld-shifts of fiber-solder-ferrule (FSF) introduced in the aging and temperature cycling tests are simulation. A finite element package – MARC is used to module the fiber-solder-ferrule joint and laser joint respectively. Experimental results of the PWS of a FSF joint are compared with the calculated shifts. Results indicate that the redistribution of residual stresses in joint and the creep deformation under high temperature load may affect the PWS significantly. A good agreement between the simulated and the measured results indicate the proposed model is feasible in the laser module packaging analysis.

謝誌 i
摘要 ii
英文摘要 iii
目錄 iv
圖目錄 viii
表目錄 xv
符號說明 xvi


第一章 緒論 1
1-1 研究目的及其背景 1
1-2 雷射二極體模組簡介 5
1-3 文獻回顧 12
1-3.1 焊域之殘留應力 12
1-3.2 介面合金共化物 13
1-3.3 焊域之高溫潛變現象 14
第二章 理論與數值計算 16
2-1 前言 16
2-2 MARC套裝軟體之系統架構 16
2-2-1 MARC系統簡介 17
2-2-2 MARC資料庫之結構 20
2-2-3 MARC套裝程式之輸入平台 20
2-3 有限元素法分析步驟 22
2-4 問題描述與分析方法 23
2-4-1問題描述 23
2-4-2有限元素法分析方法 28
2-5 數學式之推導 29
2-5-1力學理論模式 29
2-5-2熱分析模式 31
2-6 潛變 (Creep) 32
2-6-1潛變理論 (Creep Theory) 23
2-6-2潛變組成模式 (Separated Constitutive Modeling) 33
第三章 高能雷射束焊接之殘留應力與潛變分析 35
3-1 前言 35
3-2 高能雷射束之焊接實驗 38
3-2-1 實驗量測結果與有限元素法模擬 38
3-3 雷射束焊域因含磷鍍層材料所引起熱龜裂之分析 44
3-3-1 焊域熔池固化過程之有限元素法模擬 50
3-3-2 焊域固化殘留應力分佈之數值分析結果 51
3-4 U型座構裝之焊後位移與潛變效應分析 56
3-4-1 有限元素模式 57
3-4-2 實驗與數值分析結果比對 58
3-4-3 討論 59
第四章 雷射二極體模組中光纖套管承受熱循環負載時之潛變效應分析 65
4-1 光纖套管組件尺寸與其材料性質 65
4-2 溫度循環實驗 68
4-3 光纖套管之焊後位移與潛變效應分析 71
4-3-1 有限元素分析模式 72
4-3-2 80Au20Sn錫金焊料數值分析 80
4-4 比較分析與討論 82
第五章 介金屬化合物之強度與潛變分析 84
5-1 雷射晶粒錫銲構裝中之尺寸與相關材料性質 85
5-2 晶粒焊域推力實驗與抗剪強度分析 87
5-3 雷射晶粒模組焊域IMC層強度與熱循環負載之分析 96
5-3-1 有限元素法分析 97
第六章 結論 104
附錄A 107
附錄B 113
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