一般我們常見的電子資訊產品，含多樣主動及被動元件，其封裝積體電路IC是最主要的零件，而其可靠度(reliability)將決定整個產品的壽命和是否可以運作的最主要關鍵。因此必須將晶片有效且可靠的封裝起來，而且由線路接點外接至印刷電路板上運作，這方面的技術統稱電子構裝。

在打線接合方面，Au wire和Al wire是最常被利用於連結IC與外部導線架的橋樑。由於金的延展性好，張力強度大，所以在wire的選擇上，金線已成為主流，同時為了增加金線的機械強度，改善微接點孔洞生成及抑制介金屬的變化，往往會添加微量的鈀或銅。

本研究利用真空熔煉的方式配置不同二元合金，再以下墬式鑄造出二元合金與Al的擴散偶，然後將合金以300℃維持3天均質化熱處理，使合金達到相平衡。經由EPMA成分分析，進而建立Au-Al-Cu和Au-Al-Pd三元系統300℃平衡相圖。

在Au-Al-Cu三元系統300℃平衡相圖中，與文獻500℃相圖，主要差異在於Al-Cu二元系統在370℃時有(Au,Cu)＋γ→α2反應產生，而本研究認定AlAu2相會形成(Al,Cu)Au2相延伸至相圖內部，文獻則認定形成Al(Au,Cu)2相延伸至內部。然而文獻的時效時間只有2小時，可能未達到真的熱力學平衡。而本實驗時效72小時，外加以擴散偶的方式，較容易達到熱力學平衡，可信度也相對較高。

在Au-Al-Pd三元系統300℃平衡相圖中，由於文獻過少，因而無資料可以對照。Au-Pd-Al系統300℃時，已確認出7個三相區存在的區域，而Au2Al相會形成Au2(Al,Pd)固溶相延伸至相圖內部，Au2Al相對鈀的溶解度約5 at.℅。Au-Pd-Al系統300℃時，在金原子百分比約41 at.℅和7 at.℅，均疑似有三元相存在。

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壹、前言 1
1-1 研究背景 1
1-2 研究動機 3
貳、文獻回顧 4
2-1 相平衡 4
2-1-1 Au-Cu 二元系統相平衡圖 6
2-1-2 Al-Au 二元系統相平衡圖 6
2-1-3 Al-Cu 二元系統相平衡圖 6
2-1-4 Al-Pd 二元系統相平衡圖 7
2-1-5 Au-Pd 二元系統相平衡圖 7
2-1-6 Au-Cu-Al 三元系統相平衡圖 7
2-1-7 Au-Cu-Al 三元系統的Au 76 wt.℅ 切面平衡相圖 8
2-2 界面反應 8
2-3 成核與成長 9
2-4 反應路徑 10
參、實驗方法 23
3-1 實驗目的 23
3-2 合金試片的配製 23
3-3 擴散偶製作 28
3-4 均質化熱處理 29
3-5 試片處理 30
3-6 EPMA的量測分析 30
肆、結果與討論 31
4-1 AuxCuyAlz 三元系統300℃ 31
4-1-1 三相區Al2Au-Al-θ 31
4-1-2 三相區Al2Au-θ-η2 31
4-1-3 三相區Al2Au-γ-AlAu 32
4-1-4 三相區Au56Cu12Al32-AlAu-γ 32
4-1-5 三相區Au69Cu12Al19-Al2Au5-AlAu4 32
4-1-6 二相區β-AlAu2 33
4-1-7 AuxCuyAlz 三元系統300℃的β相和α2相 33
4-1-8 AuxCuyAlz 三元系統300℃的γ相 34
4-1-9 AuxCuy-Al 系統300℃的路徑圖相互比較 34
4-2 AuxPdyAlz 三元系統300℃ 35
4-2-1 三相區Al2Au-γ-δ 35
4-2-2 三相區Au10Pd40Al50-AlAu-Al2Au 35
4-2-3 三相區AlAu-Au11Pd40Al49-AlAu2 35
4-2-4 三相區Au10Pd41Al49-Au18Pd34Al48-AlAu2 36
4-2-5 三相區Au8Pd45Al47-Au16Pd52Al32-Au29Pd39Al32及Au8Pd45Al47- Au16Pd52Al32-Au40Pd28Al32 36
4-2-6 三相區Au17Pd51Al32-Au10Pd57Al33-Au9Pd50Al41 37
4-2-7 三相區Au42Pd26Al32-Al2Au5-AlAu4 37
4-2-8 二相區β-Al2Au 37
4-2-9 AuxPdy-Al 系統300℃的路徑圖相互比較 38
伍、結論 39
5-1 AuxCuyAlz 三元系統300℃ 39
5-2 AuxPdyAlz 三元系統300℃ 39
六、參考文獻 41

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