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博碩士論文 etd-0721111-120946 詳細資訊
Title page for etd-0721111-120946
論文名稱
Title
高功率白光二極體之溫度與熱應力分佈
Temperature and Thermal Stress Distributions of High Power White Light Emitting Diodes
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
105
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2011-07-01
繳交日期
Date of Submission
2011-07-21
關鍵字
Keywords
有限元素分析、高功率發光二極體、發光二極體
high power white LED, light emitting diode, finite element analysis
統計
Statistics
本論文已被瀏覽 5652 次,被下載 3417
The thesis/dissertation has been browsed 5652 times, has been downloaded 3417 times.
中文摘要
白光二極體的技術已日漸成熟,但隨著應用範圍從簡單的指示燈擴大至室外照明與室內照明等光需求量大的地方,所以提高白光二極體的功率及光效率是有其必要性。而以目前的白光LED光效率約30%,也就是說會有70%是以熱的形式產生,所以提高功率伴隨的組件溫度影響,將是個封裝設計的關鍵問題,所以本論文的目的是以有限元素分析法,對40mil單磊晶高功率LED進行模擬並預估高功率白光二極體的溫度及熱應力分佈。
文中也針對不同散熱裝置與設計進行模擬,觀察各參數對其散熱成效之影響,更進一步探討其散熱方法之有效性。文中更針對LED相關封裝參數,如固晶材料、晶片基板之種類及尺寸影響進行分析。也針對不同散熱基板設計進行比較與分析,分析其散熱效果與熱應力分佈。文中亦更進一步比較CoB封裝方式與目前單磊晶封裝形式的優缺點進行探討,觀察高功率LED所產生的溫度、熱應力分佈與散熱鰭片之必要性。相關分析結果顯示,在單磊晶封裝設計下LED功率升高達7watt時,產生的高溫將使LED磊晶溫度過高,且使晶片產生的熱應力峰值超過其晶片之降伏強度。分析結果也顯示鰭片設計對於高功率白光二極體極具重要性,可有效增加整體的散熱效果,並且使晶粒溫度及熱應力峰值明顯且有效率的下降。
Abstract
In last decade, white light emitting diodes(LEDs) have become used widely from traditional indicator to general illumination. The increase of its power is the key improving issue. The current light efficiency of white LED about 30%. In other words ,more than 70% of the input electrical energy will be generated in the form of heat. So, how to get rid of the heat damage in high power LED is a severe problem. The finite element analysis is employed to simulate high power white LEDs temperature distribution and thermal stress distributions caused by the dissipated heat.
The effects of package parameters, i.e. die attach, solder material, solder thickness, and chip substrate, on the temperature and thermal stress distributions on high power LED packages are simulated and studied in this thesis. A comparison between the 40mil single chip package and the chip on board(CoB) package has also been executed in this study. Simulated results indicate that the highest power of a single 40mil chip package is 7watt. The thermal stress distribution , i.e. the peak value of local thermal stress is over its yield strength, is occurred as the power up to 7watt. Numerical results also reveal that the appropriate fin design can improve the heat dissipation significantly in high power LED package.
目次 Table of Contents
目錄 i
圖目錄 iii
表目錄 vi
符號說明 vii
摘要 ix
Abstract x
第一章 緒論 1
1.1 前言 1
1.2發光二極體之發展 2
1.3 研究動機 4
1.4 文獻回顧 6
1.5 組織章節 9
第二章 基本原理及研究理論 10
2.1 半導體基本原理 10
2.2 白光發光原理 11
2.3 有限元素理論 15
2.3.1 熱分析理論 18
2.3.2 力學分析理論 19
2.4 畸變能理論 19
第三章 有限元素模型與分析方法 22
3.1 有限元素模型 22
3.2 建模方法 29
3.2.1 分析步驟 29
3.2.2 熱源與散熱形式 33
3.2.3 基本假設 34
3.3 基本參數與參數規劃 40
第四章 結果與討論 42
4.1 基本參數之分析結果 42
4.2 固晶材料與晶片基板之分析 54
4.2.1 銀膠用於固晶材料之影響 54
4.2.2 錫金合金用於固晶材料之影響 62
4.2.3 碳化矽用於晶片基板之影響 73
4.3 散熱基板之影響與CoB之優點 76
4.3.1 散熱基板之影響 76
4.3.2 CoB之優點 77
4.4 散熱鰭片之影響 78
第五章 結論 86
5.1 本文結果 86
5.2 未來工作 87
參考文獻 88

參考文獻 References
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