對高速數位電路而言，隨著訊號上升與下降速度的增快，封裝尺寸的減小與元件密度的增高，串因現像對維持訊號完整度來說已是一個極嚴重的問題。準確地萃取一般三導體結構的傳輸線的等效模型將有助於我們了解串音現像的行為。結合逐層演算法與時域有限差分法(FDTD)的數值計算，我們可以獲得理論上的等效集總電路模型與阻抗的分佈情形。而所求得的電路模型可輕易的代入SPICE軟體。比較所萃取模型的暫態分析與利用時域反射儀量測的實驗結果，兩者的結果顯示有相當良好的穩合度。

For the advanced high speed digital circuits with faster edge rate, smaller packaged size, and higher layout density, crosstalk becomes one of the serious problems for good signal integrity (SI) in the circuits. Accurate extraction of the equivalent model of the general three conductors transmission lines structure can help us understand the behavior of the crosstalk phenomenon. Based on combining the Layer Peeling Technique (LPT) and Finite-Difference Time-Domain (FDTD) numerical approach, both the impedance profile and the equivalent lumped model of the three-conductors transmission lines are theoretically obtained. The equivalent model can easily incorporate into SPICE program. The transient behavior of the these extracted model is compared with the experienced results measured by Time-domain Reflectometry (TDR). The agreement is good.

誌謝 I
論文提要 II
目錄 IV
圖表目錄 V
第一章 序論 1
1.1 研究目的與背景 1
1.2 論文大綱 3
第二章 多導體萃取法 4
2.1 雙導體傳輸線逐層萃取法 4
2.2 三導體逐層萃取法 7
2.2.1 N導體阻抗模型與特性： 7
2.2.2 三導體逐層萃取法： 11
2.2.3 奇、耦模態阻抗概念與集總電路模型： 14
2.2.4 逐層萃取法結果驗證： 18
2.2.5 IPA模型比較： 20
第三章FDTD 演算法 24
3.1 演算法概要 24
3.2 穩定法則 27
3.3 吸收邊界 28
3.3.1 Berenger PML 28
3.3.2 Unsplit_field PML 30
3.4 細線演算法 31
3.5 細槽演算法 35
3.6 集總元件-電容 38
第四章 模擬與量測 39
4.1 耦合現像概論： 39
4.2 不連續耦合結構： 40
4.3 不完整金屬接地面 48
4.4 Bond wires 59
第五章 結論 66
參考文獻 67

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