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博碩士論文 etd-0724107-150045 詳細資訊
Title page for etd-0724107-150045
論文名稱
Title
利用電容式測位移系統量測蝶式雷射模組之銲後位移
The Post-Weld-Shift Measurement of Butterfly-Type Laser Module Packaging by Capacitance Displacememt System
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
79
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2007-07-16
繳交日期
Date of Submission
2007-07-24
關鍵字
Keywords
銲後位移、電容式測位移系統
capacitance displacement measurement system, post-weld-shift
統計
Statistics
本論文已被瀏覽 5656 次,被下載 1367
The thesis/dissertation has been browsed 5656 times, has been downloaded 1367 times.
中文摘要
本論文提出利用一種電容式測位移量測方法,來測量構裝蝶式雷射模組時,因雷射銲接後所產生銲後位移(Post-Weld-Shift)之光纖對準偏移。減少銲後位移是開發低成本、高效能半導體雷射模組的重要議題,而在減少及補償銲後位移的工作之前,須先建構一套能夠量測銲後位移的系統。
相較於以往之CCD影像擷取技術量測銲後位移,其精度受像素所限制,只能達0.07μm左右,本研究使用一套解析度可達0.0254μm之較高精度電容式位移量測系統。量測過程中,感測器感測光纖金屬套管的銲後位移,並經由換算後求得光纖頭端之對準偏移量。經補償後之耦光效率可有效提升至70%以上,且量測結果可定性地量得方向並定量地求得銲後位移大小。
Abstract
A novel technique by employing a capacitance displacement measurement system to measure the post-weld-shift (PWS) caused by laser welding in the butterfly-type laser diode module packaging process is proposed. Reduction of the PWS is an important issue in developing low-cost and high-performance semiconductor laser module. Prior to the reduction and compensation of the PWS, a measurement system of PWS must be constructed.
In comparison to the high-magnification camera with image capturing system (HMCICS) limited in resolution of 0.07μm due to its pixels, a measurement system with a higher resolution of 0.0254μm is used. During the measurement procedure, the PWS of the ferrule probed by the sensors is converted into the fiber misalignment shifts. The coupling efficiency can be improved over 70% after compensation. The result indicates that the PWS can be qualitatively measured and quantitatively computed.
目次 Table of Contents
內容目錄

第一章
參考文獻 References
1.許益誠, “雷射模組構裝之光纖偏移量測與補償研究,” 中山大學光電工程所博士論文, 94年6 月.
2.D. S. Alles, “Trend in Laser Packaging,” in Proc. 40th ECTC, pp.185-192 (1990).
3.Y. Oikawa, H. Kuwatsuka, T. Yamamoto, T. Ihara, H. Hamano, T Minami, “Packaging Technology for 10-Gb/s Photoreceiver Module,” Journal of Lightwave Technology, Vol. 12, No. 2 (1994).
4.鄭木海博士, “雷射二極體構裝技術之近況與趨勢,” 光訊, 第69期, 1997 年12 月.
5.施性坤, “雷射銲接技術構裝雷射模組之銲後位移研究,” 中山大學光電工程所碩士論文, 90 年6 月.
6.W. K. Huang, Y. C. Hsu, M. T. Sheen, and W. H. Cheng, “Post-weld-shift in Butterfly Package,” IEEE Symposium on Electronic Materials and Packaging, pp.77-82 (2002).
7.Y. T. Tseng, H. C. Sung, “ Novel Inspection of Fiber Post-weld-shift in Butterfly Laser Module Packaging,” IEEE Transactions on Advanced Packaging, v 28, n 4, p 713-719 (2005).
8.Mueller, Peter, Valk, Bernd, “Automated fiber attachment for 980nm pump modules,” Electronic Components and Technology Conference, p 5-9 (2000).
9.Y. C. Hsu, Y. C. Tsai, Y. L. Ho, M. T. Sheen, J. H. Kuang, W. H. Cheng, “A Novel Fiber Alignment Shift Measurement and Correction Technique in Laser-welded Laser Module Packaging,” Journal of Lightwave Technology, v 23, n 2, p 486-494 (2005).
10.Y. C. Hsu, Y. C. Tsai, J. H. Kuang, W. H. Cheng, “Postweld-shift-induced Fiber Alignment Shifts in Laser-welded Laser Module Packages: Experiments and Simulations,” Journal of Lightwave Technology, v 23, n 12, p 4287-4295 (2005).
11.Y. C. Hsu, J. H. Kuang, Y. C. Tsai, W. H. Cheng, “Investigation and Comparison of Postweld-shift Compensation Technique in TO-Can- and Butterfly-type Laser-welded Laser Module Packages,” IEEE Journal on Selected Topics in Quantum Electronics, v 12, n 5, p 961-968 (2006).
12.黃韋凱, “2.5-10Gb/s高速蝶式半導體雷射模組銲後位移之研究,” 中山大學光電工程所碩士論文, 92 年6 月.
13.洪玉璽,“蝶式雷射模組銲後位移量測與補償技術,” 中山大學光電工程所碩士論文, 94 年6 月.
14.http://aemes.mae.ufl.edu/~uhk/STRESS-STRAIN.jpg.
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