本論文主旨在探討錫球承受週期性熱負載及老化試驗過程中的殘留應力分佈變化。文中首先應用Surface Evolver預測錫球經熔融過程，冷卻後之幾何形狀，同時藉由有限元素套裝程式MARC軟體，分析錫球冷卻後其殘留應力的分佈。文中分析重點主要為模擬探討不同材質錫球在承受不同週期數 ( -40℃到85℃ ) 的熱循環週期負載，及85℃的長期高溫老化負載後，錫球殘留應力之分佈與變化。並對不同錫球參數，如銲錫高度以及銲墊形狀對上述殘留應力分佈之影響進行分析。此外，文中亦對無鉛銲料如 ( 96.5Sn3.5Ag ) 錫銀銲錫進行分析與比對工作。期經由此分析工作，對不同材質錫球在不同檢測條件下的殘留應力分佈有更深的認識，以提供未來改善有關錫球設計，以提高產品可靠度時之參考。

The variations of residual stress distributions on solder balls under the cyclic thermal load and aging processes are investigated in this thesis. The solidification phenomena for different shapes and materials of the solder balls during the reflow process are predicted by using the Surface Evolver program. The distribution of residual stress in the solder ball is calculated by employing the MARC finite element package. The temperature dependent material properties of the solders, i.e. 63Sn/37Pb and 96.5Sn/3.5Ag, are used in the residual stresses calculations. The variation of the residual stresses distributions of different solder balls under the temperature cycling test ( between –40℃ and 85℃ ) and the aging test ( at 85℃ ) are simulated and studied. The effects of the solder parameters, i.e. the solder height and the pad geometry shapes on the residual stresses distribution are also studied. Besides, the same simulation and analysis has also applied on the solder ball with an unleaded solder 96.5Sn/3.5Ag. A better understanding about the variation of the residual stress in a solder ball is expected from this analysis.

謝誌 i
摘要 iii
英文摘要 iv
目錄 v
圖目錄 viii
表目錄 xiii
符號說明 xiv


第一章 緒論 1
1-1 前言 1
1-2 文獻回顧 2
1-3 組織與章節 7
第二章 理論與數值計算 9
2-1 分析熔融錫球表面應力與固化形狀的程式 – Surface Evolver軟體之介紹 9
2-2 有限元素分析套裝程式 – MARC軟體之介紹 12
2-2-1 MARC套裝程式之系統架構與功能 13
2-2-2 MENTAT數據模組功能之介紹 16
2-3 有限元素法分析步驟 18
2-4 分析方法與理論模式之介紹 19
2-4-1本文分析方法 19
2-4-2力學理論模式 21
2-4-3熱分析模式 24
2-4-4潛變分析模式 25
第三章 錫球熔融固化過程中形狀與殘留應力分佈 27
3-1 錫球之重流（Reflow）過程 27
3-2 不同尺寸錫球固化過程中錫球形狀與焊域殘留應力分佈 32
3-2-1錫球熔融固化後之形狀 32
3-2-2錫球固化後焊域殘留應力分佈之數值模擬結果 49
第四章 錫球承受熱循環與老化試驗過程中熱應力與殘留應力變化情形 59
4-1 錫球在熱循環負載過程中熱應力與殘留應力分佈之變化 59
4-2 錫球歷經老化實驗造成之殘留應力分佈變化 84
第五章 結論 97
參考文獻 100

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