本論文主要在探討陣列封裝面射型雷射二極體模組(Vertical Cavity Surface Emitting Laser Module；VCSEL),於進行陣列封裝高溫老化(Aging)及熱循環(Thermal Cycling Test)過程中,其熱應力、殘留應力分佈與光源對應之雷射點位置焊後位移變化情形。文中並分析VCSEL採用63Sn/37Pb及無鉛之96.5Sn/3.5Ag微錫球銲域歷經老化與熱循環過程，銲材潛變效應，對其殘留應力分佈與銲後雷射光源點位移之影響。
文中使用有限元素套裝程式MARC中的熱傳、非線性彈塑增量，及潛變模組，建立面射型雷射二極體模組之有限元素分析模式，並配合各種不同具時變特性之材料參數函數，進行應力與變形之數值模擬分析。文中亦對VCSEL採用方形與圓形銲墊設計差異，及其在歷經老化過程中不同環境溫度的影響，及VCSEL中各部分殘留應力分佈與潛變效應分析的關係。數值結果顯示，錫球起始固化時之殘留應力分佈對此VCSEL在熱循環與老化過程中之應力與銲後位移研究甚是重要，不可忽略。

The thermal stresses, residual stresses distributions in a vertical cavity surface emitting laser (VCSEL) are investigated in this thesis. The post-weld shifts of the laser light sources in the VCSEL under the re-flow, temperature cycling test and high temperature aging test have also been simulated and studied. The creeping effects of the 63Sn/37Pb solder on the stresses distributions and post-weld shifts are compared and discussed.
The finite element package MARC is used for the stresses and deformation simulations of a VCSEL under different load cases. The heat transfer, the non-linear couple elastic-plastic increment and the creep models are employed in the numerical simulations. The temperature dependent material properties of the 63Sn/37Pb and 96.5Sn/3.5Ag solder are used for the temperature cycling and aging test. The effect of the circle and square solder pad designs on the stresses distributions in a VCSEL is also studied in this thesis. Numerical results indicate that the residual stresses introduced in the solidification is significant in stress and post-weld analyses of a VCSEL.

目 錄
頁次
謝誌…………………………………………………………………. i
中文摘要……………………………………………………………. ii
英文摘要……………………………………………………………. iii
目錄…………………………………………………………………. iv
圖目錄………………………………………………………………. vii
表目錄………………………………………………………………. xi
符號說明……………………………………………………………. xii
第一章 緒論………………………………………………………..1
1-1 前言………………………………………………….1
1-2 面射型雷射二極體模組(VCSEL)簡介…………….7
1-3 文獻回顧…………………………………………….11
1-4 組織與章節………………………………………….12
第二章 相關分析程式與理論…………………………………....14
2-1 前言………………………………………………….14
2-2 MARC與MENTAT程式介紹……………………......14
2-3 問題描述與分析方法……………………………….19
2-3-1 問題描述……………………………………19
2-3-2 分析步驟…………………………………..30
2-3-3 分析方法……………………………….….33
2-4 數學式之說明……………………………………….34
2-4-1 力學理論模式……………………………..34
2-4-2 熱分析模式………………………………..37
2-4-3 潛變模式…………………………………..38
第三章 面射型雷射二極體模組承受熱負載時之殘留
應力變化與位移分析………………………………......42
3-1 前言………………………………………………….42
3-2 面射型雷射二極體模組各組件的材料尺寸
與性質……………………………………………….42
3-3 VCSEL歷經不同熱負載時之殘留應力分佈
變化與位移分析……………………………………..46
3-3-1 面射型雷射二極體模組之廻銲過程應
力與位移分析………………………………..46
3-3-2 面射型雷射二極體模組承受熱循環負
載應力與位移之分析………………………..74
3-3-3 高温加速老化過程之潛變效應分析………..82
3-3-4 面射型雷射二極體模組成品在使用操作
過程應力與位移之分析……………………..94
第四章 結論………………………………………………………….98
附錄………………………………………………………………....100
參考文獻……………………………………………………………103

參考文獻
Anderson, T. ,Guven, I., Madenci, E., and Gustafsson, G, 2000, “The Necessity of Reexamining Previous Life Prediction Analysis of Solder Joints in Electronic Packages,” IEEE, PP. 516-520.
Amagai, M., 1999, “Characterization of Chip Scale Packaging Materials,” Microelectronics Reliability, Vol. 39, pp. 1365-1377.
Bhatti, P. K., Gschwend, K., Kwang, A. Y. and Syed, A. R., 1995, “Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices,” Transactions of the ASME, Vol.117, pp. 20-25.
Barker, D. B., Sharif, I., Dasgupta, A., and Pecht, M. G., 1992, “Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life,” Journal of Electronic Packaging, vol. 114 pp.177-182.
Gupta, V. K., and Barker, D. B., 1995, “Modeling solder Joint Fatigue Life for Gull-wing Leaded Packages: Part I – Elastic Plastic Stress Model, Journal of Electronic Packaging ,”vol. 177 p.123-129.
Hong B. Z., 1998, “Thermal Fatigue Analysis of CBGA Packing with Lead-free Solder Fillets, ”IEEE, Inter Society Conference on Thermal Phenomena, pp.205-211.
Lau, J. H., Pan, S. H., and Chang, C. , 2000, “Creep Analysis of Bumped Direct Chip Attach(DCA)on Microvia Build-up Printed Circuit Board with Underfill ,” Electronic Material and Packing, pp.127-135.
Lau, J. H., and Harkins, C. G., 1990, “Stiffness of Gull-Wing Leads and Solder Joints for a Plastic Quad Flat Pack, ” IEEE, Transactions on Components, Hybrids, And Manufacturing Technology, vol. 13, pp124-130.
Ong, E. T., Tay, A. A. O., and Wu,J. H., 2000, “Effect of Delamination on the Thermal Fatigue of Solder Joints in Flip Chip,” Inter Society Conference on Thermal Phenomer, pp.200-207.
Pardeep K. B., Klaus G., Kwang, A. Y., and Ahmer R. S., 1995, “Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices,” Transactions of the ASME, vol.117 pp.20-25.
Qian, Z., Lu, M. and Liu, S., 1998, “ Constitutive Modeling of Polymer Films From Viscoelasticity to Visco-plasticity ,”Journal of Electronic Packaging, vol. 10 pp.145-149.
Shi, X. Q., Yang, Q. J., Wang, Z. P., Pang, H. L. J., and Zhou, W., 2000, “Reliability Assessment of PBGA Solder Joints Using the New Creep constitutive Relationship and Modified Energy-Based Life Prediction Model,” Proceedings of IEEE Electronic Packaging Technology Conference, pp.398-405.
Thomas R. H. and Huebner, R. T., 1987, “Fatigue and Creep in Solder Joint,” IEEE, pp.148-157.
Wel, Z. and J. W. Morris, J. W., 1992, “Characterization of Eutectic Sn-Bi Solder Joints,” Journal of Electronic Materials, vol. 21, pp.599-607.
Wang, J., Qian, Z., and Liu, S., 1998, “Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique,” Journal of Electronic Packaging, vol. 120 pp.309-313.
Yao, O., and Qu, J., 1999, “Three-Dimensional Versus Two Dimensional Finite Element Modeling of Flip-Chip Packages,” Transactions of the ASME, vol. 121 pp.196-201.
Zarrow, P., 2000,soldering, SMT 101,pp.80-86.
Lau, J. H., 1993, Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, New York, USA.
Lau, J. H. and Pao , Y. H., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, USA.
MARC Analysis Research Corporation, 1992, MARC Analysis Research Corporation, Vol. A, MARC Analysis Research Corporation.
MARC Analysis Research Corporation, 1992, MARC User’s Guige, Mentat II, MARC Analysis Research Corporation.
MARC Analysis Research Corporation, 1994, MARC Element Library, Vol. B, MARC Analysis Research Corporation.
MARC Analysis Research Corporation, 1994, MARC Program Input, Vol. C, MARC Analysis Research Corporation.
MARC Analysis Research Corporation, 1995, MARC Demonstration Problems, Vol. E, Part III, MARC Analysis Research Corporation.
沈茂田，2000，“雷射二極體模組殘留應力及潛變效應之研究”，國立中山大學機械工程研究所博士論文。
許益誠，1998，“積體電路組件焊域之應力分析”，國立中山大學機械工程研究所碩士論文。