本文主要研究工作有二：一在利用與工研院工材所合作兩種構裝之實驗結果：CSP熱循環疲勞實驗及SOJ拉力實驗。配合有限元素法分析求得錫球銲域之應力與應變分佈結果，求出無鉛錫銀銅銲料的Coffin-Manson Equation。另一研究主題則在探討熱膨脹係數匹配誤差對光電組件封裝可靠度的影響。文中首先應用Surface Evolver套裝軟體，預測不同材質錫球歷經迴銲過程固化後的幾何形狀，根據預測的錫球固化形狀建立光電構裝錫球的有限元素網格，並以MARC有限元素軟體，分析錫球在經過迴銲過程及一次熱循環過程後，本身所受到的最大等效塑性剪應變範圍，配合依不同材質建構之Coffin-Manson Equation分別求出錫球在不同佈列設計下的抗疲勞壽命。同時分析各種錫球參數，如體積、偏置量、DNP及材質等對錫球可靠度的可能影響。

Two subjects are included in this thesis; one is to construct the Coffin-Manson equation of the unleaded SnAgCu solder according to the experimental results provided by the Metal Research Laboratory (MRL) of Industrial Technologies Research Institute (ITRI). The results of CSP thermal cycle fatigue and SOJ pull tests and the corresponding stress and strain distributions solved from FEM analyses have been used to derive the Coffin-Manson equation for the SnAgCu solder. The other subject is to investigate the effect of CTE mismatch on the fatigue life of solder balls in the opto-electronic packaging. The solidified shapes of the different solder balls after undergoing the re-flow process are predicted by employing the Surface Evolver package program. The FEA meshes of the solidified solder balls in opto-electronic packaging are built according to the output results of the Surface Evolver program. The maximum equivalent plastic shear strain range of the solder after under one thermal cycle process is calculated by employing the MARC finite element package. The fatigue lives of solder balls under different arrangements are estimated according to the proposed Coffin-Manson equation. The effect of solder ball parameters, i.e. solder volume, solder offset distance, solder DNP and solder material on the reliability of different solder balls has also been explored in this thesis.

目錄 i
圖目錄 iii
表目錄 viii
符號說明 ix
摘要 xi
第一章 緒論 1
1-1 前言 1
1-2 文獻回顧 5
1-3 組織與章節 7
第二章 理論與數值方法 8
2-1 Surface Evolver軟體之理論基礎 8
2-1-1 Surface Evolver軟體簡介 8
2-1-2 Surface Evolver理論基礎 9
2-2 有限元素分析理論 13
2-2-1 力學平衡式 13
2-2-2 熱彈塑增量分析 14
2-2-3 熱傳分析 21
2-2-3 潛變分析理論 23
2-3 材料疲勞分析理論 26
第三章 錫-銀-銅錫球熱循環疲勞經驗公式之建立 30
3-1 CSP熱循環實驗分析 30
3-2 SOJ拉力實驗分析 62
3-3錫-銀-銅疲勞經驗公式的建立 74
第四章 光電封裝錫球可靠度分析 76
4-1 分析模型描述 76
4-2 錫球可靠度分析 92
第五章 結論 116
參考文獻 118

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