本篇論文主要是探討RF濺鍍系統之研究。首先從射頻放電中的暗區厚度、DC偏壓及電極面積的關係，以及射頻濺鍍系統的阻抗匹配網路介紹。再到輝光放電的組成及RF放電相關電參數的探討。接著探討利用網路理論計算出RF濺鍍系統的負載阻抗，並且設計阻抗匹配電路；再分析平行電極RF放電當中的鞘層及電漿的等效電路。
然後，對RF濺鍍系統的氣體放電特性的討論，包含不同壓力及磁場大小下的電容、阻抗及傳導性等特性；由於RF濺鍍系統常使用13.56MHz，所以如何避免射頻干擾的問題必須考慮；並討論在Argon環境下，平行電極的RF放電特性，其中包含各種測量和參數間的相關性。最後，探討RF濺鍍系統實際與理想系統間的差異性，以及設計一個堅固耐用、操作簡便且容易上手的RF濺鍍系統。

In this study, the RF sputtering system has been investigated comprehensively. Firstly, the relationship among the thickness of dark space, DC bias and electrode area under RF discharge is discussed. The impedance matching network of RF sputtering system, the configuration of glow discharge and their related electrical parameters are introduced and illustrated. The network theorem is used to calculate the loading impedance of RF sputtering system and to design an impedance matching circuit. And then the equivalent circuit of sheath and plasma in parallel plate RF discharge is analyzed.
The characteristics of gas discharge of RF sputtering system are discussed, which includes the capacitance, resistance and conductivity on different pressure and magnetic field. Due to RF sputtering system usually driven at 13.56 MHz (this is an open frequency), we also considered how to avoid the radio frequency interference. In addition, the electrical characteristics of parallel plate RF discharge are revealed under argon atmosphere, and some of the general relationships between the various measured and determined parameters are also described. Finally, the difference between real system and ideal system are reported, and how to design a system which is rugged and reliable and can be operated, literally, in ”push-button”fashion, has been described in detail.

中文摘要 ………………………………………………… I
英文摘要 ………………………………………………… II
誌謝 ……………………………………………………… III
總目錄 …………………………………………………… IV
表目錄 …………………………………………………… VII
圖目錄 …………………………………………………… VIII

第一章 緒論 ……………………………………………… 1
1-1 研究動機與目的 …………………………………… 1
1-2 射頻放電(RF discharge) ………………………… 1
1-3 射頻濺鍍(RF Sputtering) ………………………… 5
1-4 輝光放電(Glow discharge) ……………………… 6
1-5 RF放電相關電參數 ………………………………… 7
第二章 原理 ……………………………………………… 9
2-1 RF濺鍍匹配理論 …………………………………… 9
2-1-1 匹配量測理論 …………………………………… 9
2-1-2 匹配網路設計 …………………………………… 10
2-2 平行電極RF放電等效電路 ……………………… 12
第三章 結果與討論 …………………………………… 19
3-1 氣體放電RF濺鍍電特性 ………………………… 19
3-2 射頻干擾問題 ……………………………………… 20
3-3 Argon中平行電極的RF放電特性 ………………… 23
3-3-1 放電功率因素 …………………………………… 23
3-3-2 電流/電壓及電流/功率特性 …………………… 23
3-3-3 阻抗特性 ………………………………………… 24
3-3-4 電漿電壓及鞘層阻抗 …………………………… 25
3-3-5 鞘層電壓 ………………………………………… 30
3-3-6 鞘層寬度 ………………………………………… 31
3-4 實際系統的電壓描述 ……………………………… 33
3-5 Argon中平行電極的RF放電量測 ………………… 35
3-6 操作簡便的RF濺鍍系統設計 …………………… 38
3-6-1 RF濺鍍電源及電壓調整 ……………………… 39
3-6-2 機構設計 ………………………………………… 43
3-6-3 穩定性 …………………………………………… 43
第四章 結論 …………………………………………… 46
參考文獻 ………………………………………………… 78

[1]S. N. Levitskii, Sov. Phys.-Tech. Phys. 27, 913 (1957).
[2]P. D Davidse, SCP atid Solid State Technology, Dec.1966 p.36.
[3]J. Hasted, Physics of Atomic Collision, Butterworth & Co. Ltd., London 1964.
[4]J. L. Vossen and J. J. O'Neill, Jr., RCA Rev. 31, 276 (1970).
[5]J. L. Vossen and J. J. O'Neill, Jr., RCA Rev. 291 566 (1968).
[6]O. Christensen, Proceedings of the 3rd Symposium on the Deposition of Thin Films by Sputtering, University of Rochester, 1969, p80.
[7]J. S. Logan, F. S. Maddocks, and P. D. Davidse, IBM J. Res. Dev. 14, 182 (1970)
[8]J. S. Logan, IBM J. Res. Dev. 14, 172 (1970).
[9]J.L. Vossen. J. Vac. Sci. Technol. 8. S12 (Sept./Oct. 1971).
[10]O. Christensen and P. Jensen, J. Phys. E 5, 86 (1972).
[11]J. S. Logan, U. S. Patent No. 3,617,459 (1971).
[12]H. R. Koenig and L. I. Maissel. Application of RF Discharges to Sputtering. IBM 3. RES. DEVELOP; MARCH 1970; RF SPUTTING.
[13]P. D. Davidse and L. I. Maissel, J. Appl. Physics, 37, 574 (1966).
[14]Johnson, Transmission Lines and Networks (McGraw-Hill Book Co., New York, 1950), First Ed., pp. 290-291.
[15]V. A. Godyak. Soviet Radio Frequency Discharge Research. Falls Church, VA: Delphic Assoc. Inc., 1986, p79-100.
[16]J. Taillet, “Resonance-sustained radio frequency discharges,” J. Phys.,vol. 37, p. 423, 1969.
[17]V. A. Godyak and O. A. Popov, “Experimental study of resonant RF discharges,” Fiz. Plazmy, vol. 5, p. 400, 1979.
[18]F. Schneider, “The mechanism of high frequency discharge between level plates,” Z. Angew. Phys., vol. 6, p. 456, 1954.
[19]J. H. Keller and W. B. Pennebaker, “Electrical properties of RF sputtering systems,” IBM J. Res. Rev., vol. 23, p. 3, 1979.
[20]Valery A. Godyak, Electrical Characteristics of Parallel-Plate RF Discharges in Argon. Member, IEEE, Robert B. Piejak, and Benjamin M. Alexandrovich
[21]V. A. Godyak and A. H. Hanna, “Collisional RF discharge,” Fiz. Plazmy, vol. 6, p. 676, 1980 (also in, sov. J. Plasma Phys., vol. 6, p. 372, 1980).
[22]V. A. Godyak. “Statistical heating of electrons at an oscillating plasma boundary,” Zh. Tech. Fiz., vol. 16, p. 1364, 1972 (also in, sov,. phys. Tech. Phys., vol. 16, p. 1073, 1972).
[23]V. A. Godyak, “Steady-state RF discharges at low pressure,“ Fiz.Plasm!. vol. 2, p. 141, 1976 (also in, sov. J. Plasma Phys., vol. 2, p. 78, 1976).
[24]C. Beneking, “Power dissipation in capacitively coupled RF discharges,” J. Appl. Phys., vol. 68, p. 4461, 1990.
[25]V. A. Godyak and N. Sternberg, “Dynamic model of the electrode sheaths in symmetrically driven RF discharges,” Phys. Rei.., vol. A42, p. 2299, 1990.
[26]V. A. Godyak, R. B. Piejak, and B. M. Alexandrovich, “Ion flux and ion power losses at the electrode sheaths in a symmetrical RF discharge,” J. Appl. Phys.. vol. 69, p. 3455, 1991.
[27]W. P. Allis. S. C. Brown, and E. Everhart, “Electron density distribution in a high frequency discharge in the presence of plasma resonance,” Phys. Rev., vol. 84, p. 519. 1951.
[28]V. A. Godyak and A. H. Hanna, “Influence of self-field on the spatial distribution of a plasma of an RF discharge,” Fiz. Plazmy, vol. 5, p. 670. 1079 (see also, sov. J. Plasma Phys., vol. 5, p. 376, 1979).
[29]Federal Communications Commission, Rules and Regulations; Part 18 (Industrial, Scientific and Medical Equipment) (FCC, Washington, DC, 1964), p95-110.
[30]R. B. McDowell. Solid State Technol. 12 (2). 23 11969).
[31]J. S. Logan, N. M. Mazza, and P. D. Davidse. Electrical Characterization of Radio-Frequency Sputtering Gas Discharge. IBM, East Fishkill Facility, Hopewell Junction, New York 12533
[32]NM. Mazza, IBM J. Res. Dev. 14, 192 '(1970).
[33]J. L. Vossen and J. J. O'Neill, Jr., RCA Rev. 29, 149 (1968).
[34]V. A. Godyak, O. A. Popov, and A. H. Hanna, “Effective electron collision frequency in RF discharge,’’ Fiz. Plazmy, vol. 2. p. 1010, 1976 (also in, sov. J. Plasma Phys., vol. 2. p. 560, 1976).
[35]A. Popov and V. A. Godyak, “Power dissipated in low pressure RF discharge plasmas,” J. Appl. Phys., vol. 57, p. 53, 1986.
[36]V. A. Godyak, O. A. Popov, and A. H. Hanna, “Investigation of space charge sheath at electrodes in RF discharge,” in Proc. XI11 ICPIG (Berlin), 1977, P. Bachman and M. Kastelewicz, Eds. Berlin: Phys.SOc. GDR, 1977, p. 347.
[37]V. A. Godyak, Soviet Radio Frequency Discharge Research. Falls Church, VA: Delphic Assoc. Inc., 1986, p. 43.
[38]V. A. Godyak and R. B. Piejak, “A comparison of electron energy distributions in Ar and He RF discharges,” in Proc. XY ICPIG (Pisa), 1991.
[39]V. A. Godyak and R. B. Piejak, “Abnormally low electron energy and heating-mode transition in a low-pressure argon RF discharge a 13.56 MHz,” Phys. Rev. Lett., vol. 65, p. 996, 1990.
[40]O. A. Popov and V. A. Godyak, “Electron oscillation velocity and electric field in collisionless radio-frequency discharge plasmas,” J. Appl. Pliys., vol. 59. p. 1759, 1986.
[41]J. L. Vossen and J. J. O'Neill, Ultra-stable system for RF sputtering with RF-induced substrate bias. Jr. RCA Corporation, David Sarnoff Research Center, Princeton, New Jersey 08540
[42]M. Surendra and D. B. Graves, “Particle simulations of radio frequency glow discharges,” IEEE Trans. Plasma Sci., vol. 19, p. 144, Apr. 1991.
[43]V. A. Godyak and A. S. Khanneh, “Ion bombardment secondary electron maintenance of steadv RF discharge,” IEEE Trans. Plasma Sci.. vol. PS-14, p. 112, 1986.
[44]V. A. Godyak and R. B. Piejak, “Probe measurements of the space potential in a radio frequency discharge,” J. Appl. Phys., vol. 68, p. 3157, 1990.
[45]V. A. Godyak, Soviet Radio Frequency Discharge Research. Falls Church, VA: Delphic Assoc. Inc., 1986. pp. 110-113.
[46]M. A. Lieberman, “Analytical Solution for capacitive RF sheath.” IEEE Trans. Plasma Sci.. vol. 16, p. 638, 1988.
[47]M. Lieberman, “Dynamics of a collisional, capacitive RF sheath,” IEEE Trans. Plasma Sci., vol. 17, p. 65, 1989.
[48]N. Mutsukura, K. Kobayashi, and Y. Mach, “Plasma sheath thickness in radio-frequency discharges,” J. Appl. Phys., vol. 68, p. 2657, 1990.
[49]D. Vendor and R. W. Boswell, “Numerical modeling of low-pressure RF plasma,” IEEE Trans. Plasma Sci., vol. 18, p. 725, 1990.
[50]J. S. Logan, IBM J. Res. Develop. 14, 172 (1970, this issue ) .
[51]L. I. Maissel, R. E. Jones and C. L. Standley, IBM J. Res. Develop. 14,176 (1970, this issue).
[52]J. L. Vossen, U. S. Patent No. 3,860,507 (1975).
[53]R. T. C. Tsui, Proceedings of the 4th International Vacuum Congress, Manchester, 1968, p555.
[54]J. S. Logan, N. M. Mazza and P. D. Davidse, J. Vac. Sci. Technol. 6, 120 (1969). J. L. Vossen, J. J. O'Neill, Jr., K. M. Finlayson, and R. J. Royer, RCA Rev. 31, 293 (1970).
[55]J. Vac. Sci. Technol., Vol. 12, No. 5, Sept./Oct. 1975
[56]V. A. Godyak, R. B. Piejak, and B. M. Alexandrovich, “An experimental system for symmetric capacitive RF discharge studies,” Rev. Sci. Instrum., vol. 61, p. 2401, 1990.
[57]V. A. Godyak and R. B. Piejak, “ln situ simultaneous radio frequency discharge power measurements,” J . Vac Sci. Techno!., vol. A8, p. 3833, 1990.
[58]J. L. Vossen, J. Vac. Sci. Technol. 8, 751 (1971).