Title page for etd-0726101-141148


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URN etd-0726101-141148
Author S-T Lin
Author's Email Address No Public.
Statistics This thesis had been viewed 4860 times. Download 12938 times.
Department EMBA
Year 2000
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title IC packaging core competence constructed model- An instance of Advanced Semiconductor Engineering, INC.
Date of Defense 2001-06-20
Page Count 91
Keyword
  • core competence constructed model
  • core competence
  • IC packaging
  • Abstract none
    Advisory Committee
  • Stephen D. Tsai - chair
  • Cher-Min Fong - co-chair
  • G. Gary Hu - advisor
  • Files
  • etd-0726101-141148.pdf
  • indicate access worldwide
    Date of Submission 2001-07-26

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