本論文首先介紹平面型變壓器及其在射頻電路的應用，驗證不等圈數比平面型變壓器之阻抗轉換功能並計算其植入損耗，以及利用積體化被動元件製程實現以不等圈數比變壓器為基礎之巴倫器並建立其物理集總元件模型。
本論文也利用CMOS 製程設計具有兩個差動輸入埠及一個單端輸出埠之功率結合器，在設計上等效將兩個巴倫器與一個單端功率結合器整合於單一電路中，以達到節省晶片面積與降低植入損耗的目的，並且能適切考慮環形接地結構以得到較佳之植入損耗或平衡度。最後利用有機增層基板設計堆疊線圈變壓器為基礎之巴倫器，並整理出設計流程與說明匹配方法。

This thesis at first introduces planar transformers and their applications to RF circuits. A method is given to validate the impedance transformation and calculate the insertion loss for a transformer with unequal turn windings. A physical lumped-element model has been established for a planar transformer-based balun implemented using integrated passive device technology. This thesis next presents CMOS power combiner designs with two
differential ports and one single-ended port. Such designs equivalently integrate two baluns and one single-ended power combiner into a single circuit and therefore have the advantages of saving chip area and reducing insertion loss. In addition, the designs consider an annular ground structure to achieve lower insertion loss or better balance property. Finally, this thesis presents a balun using a stacked coil transformer in an organic build-up substrate. For this
purpose, a complete design flow and an impedance matching technique have been given.

目錄
第一章 緒論
1.1 背景簡介 ................................................................................................ 1
1.2 研究動機 ................................................................................................ 1
1.3 以變壓器為基礎之被動式元件沿革 .................................................... 2
1.4 章節介紹 ................................................................................................ 2
第二章變壓器原理與特性
2.1 變壓器結構與轉換特性..........................................................................4
2.2 理想變壓器..............................................................................................5
2.3 變壓器等效電路......................................................................................7
2.4 實際變壓器..............................................................................................9
2.5 以平面型變壓器為基礎之被動元件設計 ........................................ ..11
2.5.1 巴倫器(Balun) ...............................................................................11
2.5.2 功率結合器(Powercombiner) ............................................................12
2.6 平面型變壓器的重要參數 ............................................................. …..13
第三章不圈數比變壓器電性分析與等效電路模型化
3.1 二線與三線纏繞之變壓器..............................................................................14
3.2 任意輸出埠變壓器阻抗轉換驗證..............................................................15
3.3 變壓器植入損耗的求取........................................................................16
3.4 變壓器位基礎之被動元件模型化...............................................................17
3.4.1 螺旋電感模型...................................................................................... 17
3.4.2 變壓器模型......................................................................................... .18
3.4.3 電感線圈............................................................................................... 19
3.4.4 走線交越產生寄生效應.....................................................................21
3.4.5 製程基板寄生效應..............................................................................22
3.4.6製程基板損耗..................................................................................... 22
3.5 三埠元件模型化建立....................................................................................24
第四章不等數比變壓器為基礎之三埠被動元件設計
4.1 設計概念...............................................................................................25
4.2 利用IPD 製程設計不等圈數比變壓器基礎之巴倫器.........................26
4.2.1 被動效率法計算法..........................................................................26
4.2.2 不等圈數比變壓器為基礎之巴倫器之設計...............................26
4.2.3 實作與模擬結果..............................................................................31
4.3 利用CMOS 製程設計不等圈數比變壓器基礎之差動式功率結合
器.......................................................................................................................36
4.3.1 固定面積多埠匹配法.........................................................................36
4.3.2 利用CMOS 製程設計差動式功率結合器.................................37
4.3.3 差動式功率結合器模擬結果..........................................................43
4.4 以變壓器為基礎之並聯結合轉換器設計..........................................47
4.4.1 使用固定面積下單埠匹配設計………………………………47
4.4.2 利用CMOS 製程設計並聯結合轉換器………………….….48
4.4.3 並聯結合轉換器模擬結果.......................................................56
4.4.4 串並聯結合轉換器之比較.......................................................59
4.5 在有機基板實現巴倫器之方法與研究.......................................................63
4.5.1 有機基板..............................................................................................63
4.5.2 堆疊式耦合變壓器為基礎之巴倫器設計流程與模擬結果...63
4.5.3 不同耦合方式之變壓器為基礎之巴倫器設計與比較............72
4.6 設計流程整理與比較……………………………………………….75
4.6.1 製程方面的比較……………………………………………...75
第五章結論………………………………………………………………….77
參考文獻…………………………………………………78

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