隨著科技的進步，電路密度逐年的提高，為了在有限空間內增加訊息的傳遞量，就必須要縮減傳輸線的線寬，進而衍生出許多訊號完整性問題，本論文的研究是探討封裝基板上極細線路傳輸線可能引起的問題，先是分析其電氣特性，並決定傳輸線的架構，介紹粗糙度的影響，再來探討極細線路傳輸線的訊號完整性問題，歸納出單端傳輸線與差動傳輸線的設計準則，並且提出了一被動式等化器設計來增強訊號的表現，主要是利用極細線路傳輸線高電阻的特性，藉由提高特性阻抗，使頻率響應表現更為平坦，這個簡單設計概念，不僅能提升傳輸質量，更不會增加結構的複雜度，還能有效的降低製造成本，對於差動傳輸線的適用性，則是利用TDT共模雜訊分析法來分析，最後透過眼圖的結果來驗證對於訊號的傳遞品質的改善程度。

With the advance of IC manufacturing process, the density of circuit gets higher year by year. In order to increase the amount of transmitted information in limited space, it must reduce the width of transmission line. This phenomenon will induce the problem of signal integrity (SI). This thesis considers the problems which may be caused by the fine transmission line on package board. The electric characteristic of fine line will be first analyzed. Also to decide the structure of transmission line and introduce the effect of roughness. And then, we consider the signal integrity of fine line. The design guide of single line and differential line will be proposed. We propose a passive equalizer which uses the high resistance of fine line to enhance the performance of signal, by raising the characteristic impedance to make the frequency response more steady. This simple conception enhances the signal property and does not increase the complexity of structure. It also reduces manufacturing cost efficiently. We apply TDT common mode noise analysis to judge the adaptability of differential line. At last, we use the eye diagram to confirm the signal quality improvement.

論文審定書 i
致謝 ii
摘要 iii
Abstract iv
目錄 v
圖表目錄 vii
第一章 緒論 1
1.1 研究背景 1
1.2 研究目的與方法 2
1.3 論文大綱 3
第二章 封裝的演進與訊號完整性問題 4
2.1 封裝技術的演進 4
2.1.1 腳位數量的變遷 4
2.1.2基板與印刷電路板的連接 5
2.1.3 晶片與基板的連接方式 6
2.2 晶片的整合技術 8
2.2.1 系統單晶片 8
2.2.2 系統級封裝 9
2.2.3 三維積體電路 10
2.3 極細線路傳輸線的必要性 12
2.4 高頻封裝電路的電氣特性 15
2.4.1 反射效應 17
2.4.2 串音效應 18
2.4.3 有損傳輸線理論 19
第三章 極細線路傳輸線的電氣特性 25
3.1 極細線路傳輸線的特性 25
3.1.1 傳輸線架構的選擇 25
3.1.2極細線路傳輸線的特性阻抗 27
3.1.3 極細線路差分線 30
3.2 粗糙度 32
3.2.1 粗糙度的成因 32
3.2.2 粗糙度的模型 33
3.2.3 粗糙度的影響 37
第四章 極細線路傳輸線的訊號完整性分析 40
4.1 單端傳輸線的設計準則 40
4.1.1 傳輸線間距與介質厚度的關係 40
4.1.2 介質材料的選擇 42
4.1.3 接地迴路的線寬選擇 43
4.1.4 導體厚度的探討 45
4.2 差分傳輸線的設計準則 47
4.3 被動式等化器的設計概念 49
4.3.1 設計原型 51
4.4 結果與討論 54
第五章 結論 62
文獻探討 63

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