本論文為同軸式蝶式雷射模組構裝之研究，改變原有蝶式雷射模組構裝方式，選擇目前技術發展較為成熟的同軸式(Coaxial)構裝作為基礎，發展出一種以同軸式結構，構裝蝶式雷射模組之創新技術。應用此創新之構裝技術，可達成低成本、縮短製程時間及高良率等優點，其研發成果，未來將可應用於低價位新型蝶式雷射模組構裝。
傳統之蝶式雷射模組於構裝時，光纖套管與雷射對準後，鞍型扣件與光纖套管之結合，因雷射銲接造成之銲後位移過大，造成耦光效率低，製程時間長，良率不高之問題。本論文提出之新式構裝技術(TO-Butterfly Package)，其結構類似TO-Can雷射模組，分為上、下件；其中，主要造成銲後位移之方向，平行於雷射光軸出光方向，且元件在此方向上之位移受到拘束，因此影響耦光功率甚小。此外，雷射與光纖之耦光對位與雷射銲接，於同軸式雷射銲接機台(Newport LW4000)進行銲接，完成之次模組(TO-Butterfly TOSA)後，再與蝶式雷射模組之外盒結合。應用本新式構裝技術，可減少製程時間為原本之三分之一，增加耦光效率與良率。
在經過多次的製程改進後，目前利用較成熟技術所構裝完成之19組TO-Butterfly TOSA模組，其耦光效率均超過70%以上，平均耦光效率為81.3%，最佳耦光效率為95.7%，標準差為6.5%。

In this study, a novel technique (TO-Butterfly package) for butterfly-type laser module packaging based on the coaxial type structure is proposed. By applying the low cost TO packaging technique, the cost and fabrication time can be reduced, and the yield rate can be increased. The achievement can be employed to package the novel butterfly-type laser module in the fiber optics communication.
In traditional butterfly-type module package, the PWS was large while saddle clip and fiber ferrule being jointed by laser welding after the fiber ferrule and laser being aligned. Therefore, the coupling efficiency and the yield rate are low with long fabrication time. On the contrary, the TO-Butterfly package, similar to TO-Can laser module, includes upper part and lower part. The direction of the main PWS in TO-Butterfly laser module parallels to the optical axis, in which direction the components are constrained. Therefore, the PWS takes less influence on the coupling efficiency. Furthermore, the aligning process between the fiber and the laser and laser welding process is completed on Newport LW4000 workstation to build up a TO-Butterfly TOSA. After that, the TO-Butterfly TOSA is taken out of the workstation and combined with the case through solder. As a result, the fabrication time can be reduced to one-third. And the coupling efficiency and yield rate can also be improved.
After several times of process modification, the coupling efficiency of the 19 TO-Butterfly TOSA modules by applying the novel packaging technology was all over 70%. The average and the highest coupling efficiency were 81.3% and 95.7%, respectively, and the standard deviation was 6.5%.

中文摘要
英文摘要
致謝
目錄--------------------------------------------------------------------------------Ⅰ
圖目錄--------------------------------------------------------------------------- Ⅳ
表目錄--------------------------------------------------------------------------- Ⅷ
第一章 緒論
1.1研究背景------------------------------------------------------------- 1
1.2研究目的------------------------------------------------------------- 5
1.3文獻回顧------------------------------------------------------------- 6
1.4 論文架構------------------------------------------------------------ 8
第二章 蝶式雷射模組與TO-Butterfly構裝介紹
2.1 蝶式雷射模組構裝------------------------------------------------ 9
2.1.1 蝶式雷射模組之結構-------------------------------------- 9
2.1.2 蝶式雷射模組構裝流程----------------------------------- 11
2.2 TO-Butterfly TOSA構裝方式------------------------------------ 17
2.3 TO-Butterfly TOSA元件設計------------------------------------ 21

第三章 TO-Butterfly TOSA雷射封裝
3.1 TO-Butterfly TOSA 元件------------------------------------------ 29
3.2晶粒黏著機系統----------------------------------------------------- 30
3.2.1晶粒黏著機---------------------------------------------------- 30
3.2.2 晶粒黏著機封裝流程--------------------------------------- 32
3.3 打線機系統---------------------------------------------------------- 36
3.3.1 打線機--------------------------------------------------------- 36
3.3.2 打線機封裝流程--------------------------------------------- 37
第四章 TO-Butterfly蝶式雷射模組構裝
4.1 雷射銲接系統-------------------------------------------------------- 40
4.1.1雷射銲接原理------------------------------------------------- 40
4.1.2 雷射銲接機台------------------------------------------------ 42
4.2 TO-Butterfly TOSA構裝------------------------------------------- 50
4.2.1 原理-同軸式雷射模組構裝-------------------------------- 50
4.2.2 TO-Butterfly TOSA構裝流程------------------------------ 52
4.3 補償方式------------------------------------------------------------- 63
4.3.1 補償方式建立------------------------------------------------ 63
4.3.2 補償參數選擇 ------------------------------------------------ 64
4.4實驗結果-------------------------------------------------------------- 64
4.5 制冷器結合於蝶式模組------------------------------------------- 72
4.6 TO-Butterfly TOSA結合於蝶式雷射模組---------------------- 74
第五章 實驗結果分析與討論
5.1實驗結果與討論----------------------------------------------------- 76
5.2未來工作-------------------------------------------------------------- 80
第六章 結論------------------------------------------------------------------- 81
參考文獻------------------------------------------------------------------------- 82

[1] 黃致嘉, “差動式調變訊號之10Gb/s同軸雷射模組構裝,” 中山大學光電工程所碩士論文, 2009.
[2] K. Siidharsanam Raiiiana Pamidigbantam. Miiiscng Yeo, Ling Xie.Yiyi Ma, S. Bpan Lce, D. Pinjala and Mahadevan K Iycr, “Design Optimization for 10Gbps Electro Absorption Modulator LD Packaging ,” in Proc. Of ECTC 2003, pp, 301-307, 2003.
[3] B. Valk, R. Battig, O. Anthamatten, “Laser Welding for Fiber Pigtailing with Long-term Stability and Submicron Accuracy,” Optical Engineering, Vol. 34, No. 9, pp. 2675-2682, 1995.
[4] 林旻進, “10-40Gb/s同軸式高速雷射模組構裝之研究,” 中山大學光電工程所博士論文, 2008.
[5] “LW4000 operation manual, LW 4200 operation manual”.
[6] W. H. Cheng, M. T. Sheen, C. P. Chien, H. L. Chang, and J. H. Kuang, “Reduction of Fiber Alignment Shifts in Semiconductor Laser Module Packaging,” 2000.
[7] J. H. Kuang, M. T. Sheen, S. C. Wang, G. L. Wang, and W. H. Cheng, “Post-Weld-Shift in Dual-in-line Laser Package,” IEEE Transactions on Advanced Packaging, Vol. 25, No. 1, pp. 81-85, 2001.
[8] 施性坤, “雷射銲接技術構裝雷射模組之銲後位移研究,” 中山大學光電工程所碩士論文, 2001.
[9] W. K. Huang, Y. C. Hsu, M. T. Sheen, and W. H. Cheng, “Post-weld-shift in Butterfly Package,” IEEE Symposium on Electronic Materials and Packaging, pp. 77-82, 2002.
[10] Y. Lin, W. Liu, and F. G. Shi, “Laser Welding Induced Alignment Distortion in Butterfly Laser Module Packages: Effect of Welding Sequence,” IEEE Transactions on Advanced Packaging, Vol. 25, No. 1, pp. 73-78, 2002.
[11] Y. Lin and F. G. Shi, “Effect of Laser Welding Sequence on WIAD in Packaging of Dual-in-Line Laser Modules,” 2005.
[12] Y. Lin, C. Eichele, and F. G. Shi, “Effect of Welding Sequence on Welding-Induced-Alignment-Distortion in Packaging of Butterfly Laser Diode Modules: Simulation and Experiment,” IEEE Journal of Lightwave Technology, Vol. 23, No. 2, pp. 615-623, 2005.
[13] 許益誠, “雷射模組構裝之光纖偏移量測與補償研究, ”中山大學光電工程所博士論文, 2005.
[14] Y. C. Hsu, J. H. Kuang, Y. C. Tsai, and W. H. Cheng, “Investigation and Comparison of Postweld-Shift Compensation Technique in TO-Can- and Butterfly-Type Laser-Welded Laser Module Packages,” 2006.
[15] Y. Lin , J. Guo, A. A. Shapiro, and F. G. Shi, “WIAD Minimization in Butterfly Laser Module Packages: Clip Design,” 2007.
[16] Y. C. Hsu, Y. C. Tsai, J. H. Kuang, M.T. Sheen, P. H. Hsu, and W. H. Cheng, “A Notch-Saddle-Compensation Technique in Butterfly-Type Laser Module Packages,” 2007.
[17] Y. D. Liu, M. T. Sheen, Y. C. Hsu, H. K. Hsu, Y. C. Tsai, and W. H. Cheng, “Online Postweld Shift Measurement of Butterfly-Type Laser Module Employing High-Resolution Capacitance Displacement Measurement System,” 2010.
[18] 胡峰瑞, “利用電容式測位移系統量測蝶式雷射模組之銲後位移,”中山大學光電工程所碩士論文, 2007.
[19] 許宏崑, “電容式測距儀量測蝶式模組構裝之銲後位移與溝槽式扣件補償,” 2008.
[20] 黃韋凱, “2.5-10Gb/s高速蝶式半導體雷射模組銲後位移之研究,” 中山大學光電工程所碩士論文, 2003.
[21] Kulicke and Soffa, “4500 Series Manual Wire Bonders Operation and Maintenance Manual”.
[22] 林三寶, “雷射原理與應用,” 全華科技圖書, 1990.
[23] 鄭木海博士, “雷射二極體構裝技術之近況與趨勢,” 光訊, 第69期, 1997.