全文主要探討雷射晶粒於錫銲固化過程中之殘留應力分佈，及承受熱週期負載時銲層介面合金共化物(Intermetallic Compond，IMC)生長厚度變化，與該IMC層等效強度之變化。為突顯銲層固化時殘留應力分佈在此類產品應力分析的重要性，文中亦分別就是否考慮殘留應力之強度計算結果與實驗量測數值進行比較，結果顯示殘留應力分佈在錫銲分析方面為不可忽略之影響因素。文中亦對各種錫銲參數，如銲錫材料、銲層厚度熱循環負載週期數等進行參數影響分析。期經由此分析工作，提供光電二極體在未來改善可靠度時之參考。

The residual stress distribution, growth of Intermetallic Compound (IMC) layer and the equivalent strength in the Laser diode package are investigated in this thesis. The redistribution of residual stress in the solder layer is calculated by employing the MARC finite element package. The effects of residual stresses and IMC layer on the bonding strength of Laser diode under taken different thermal load cycles are studied. Numerical results are compared with the results measured experimentally. Results indicate the effect of residual stresses introduced in the solder solidification is so important in the stress analysis of a solder joint. The effects of different solder parameters, i.e, solder alloy, solder layer thickness and the number of thermal load cycles, are also analyzed in this work.. A better understanding about the solder bond strength is expected from this analysis.

目錄


頁次
謝誌 i
摘要 ii
英文摘要 iii
目錄 iv
圖目錄 vii
表目錄 xi
符號說明 xii

第一章 緒論 1
1-1 前言 1
1-2 文獻回顧 3
1-3 組織與章節 5

第二章 理論與數值計算 6
2-1 MARC與MENTAT介紹 6
2-1-1 MARC套裝軟體系統之架構與功能 7
2-1-2 MENTAT數據模組功能之介紹 8
2-2 問題描述與分析方法 9
2-2-1問題描述 9
2-2-1分析方法 11

第三章 數值解析與實驗結果 16
3-1 前言 16
3-2 光電二極體錫銲構裝中材料之尺寸與性質 17
3-3 光電二極體焊域IMC層強度與熱循環負載週期之分析 19
3-3-1焊域固化過程中殘留應力分佈 19
3-3-2雷射晶粒焊域在歷經週期性熱循環負載後抗剪強度之變化 21
3-3-3熱週期負載下IMC層成長情形與等效強度之預估 24
3-3-4其他相關參數對焊域抗剪強度之可能影響 24
3-4 比較與驗證 26

第四章 結論 80
附錄一 82
附錄二 86
參考文獻 88

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