本論文的研究目標在於分析與設計微抓舉致動器（Scratch Drive Actuator, SDA）以應用於微型馬達之製作。全文主要可分為下列四大部分:（i）在理論分析上，將分別介紹SDA與SDA微型馬達系統之致動原理； 另外，本文將利用虛功法（Principle of virtual work）求得電壓與靜電力的關係，並更進一步分析SDA之幾何形狀在靜電力作用下產生之形變與輸出力的關係 ;而在馬達方面，將由公式推導出向心力對馬達運轉的影響，以及針對電容尖端效應設計葉片的形狀。（ii）在元件設計方面，同時考慮MUMPs共用製程的限制與微型馬達的特性，設計出微型馬達之結構，並且以L-Editor軟體進一步模擬結構設計。（iii）在製程方面本文將分為前段製程與後段結構釋放製程兩部份，前段製程係委託法國MEMSCAP公司的多人共用微機電製程(Multi-User MEMS Processes, MUMPs)完成 ; 後段製程則是由作者於中山大學以及南部國家奈米元件實驗室（NDL）製作。（iv）在元件特性量測方面，除觀察與分析SDA雙向推動馬達機構、不同形狀葉片對運轉特性的影響之外，也對蝕刻釋放與電腦模擬作深入之研究。而最後元件終於有良好的表現，結果顯示本文所提出之設計具有很高的可行性以及穩定性，且SDA逆向致動的結果也是國內碩士論文中首創的。

This thesis presents the design of a scratch drive actuator (SDA) for Micro Motor Application. In accordance with the force needed to drive the mechanism, the relationship among SDA output force, geometries, and applied voltage is first constructed by employing the principle of virtual work. Having selected the topology of the device, the equations governing the motions and the forces of the micro motor and the actuator can be derived. The SDA and the associated micro motor mechanism are designed by considering the characteristics of Multi-User MEMS Processes, or MUMPs fabrication process. There are several types of SDA used for step motor application being designed and fabricated as illustrative samples. The chip well defined in MUMPs is released by immersing the chip in a bath of HF. It is followed by cleaning in DI water and IPA on a hot plate at 150℃ to reduce stiction.　The samples are inspected by OM and SEM, respectively.　The experimental and analytical results indicate the practicability of the proposed design concept.

內容
誌謝………………………………………………………………………I
摘要……………………………………………………………………...II
Abstract…………………………………………………………………IV
目錄……………………………………………………………………..Ⅴ
圖目錄 ………………………….…………………………………... VIII
表目錄 …………………………...……..………...…...…………… ...XII

第一章 序論…………………………….…………………….……….1
1-1 機電系統與微致動器之分析………...……………………………1
1-2 文獻回顧………………………………………………….………..6
1-3 研究目標與論文結構……………………………….……………..8
第二章 理論分析……………………..……………..………………10
2-1 SDA制動原理………………..………………………………....…10
2-2 電池-電容系統中的能量…….………………………………......16
2-2-1 平行板電容……………..…...………………………….…...15
2-2-2 扇型排列電容…………………………………………...…..19
2-3 SDA Motor理論分析………………………………...…………....22
第三章 元件設計與製作…………………..………………………23
3-1 MUMPs共用製程…………………………….………………..23
3-1-1 MUMPs 薄膜沉積………………………………………….23
（a） 矽基材、氮化矽與第零層多晶矽………………………...26
（b） 第一層氧化矽、第一層多晶矽與第二層氧化矽…………27
（c） 第二層多晶矽與金屬層……………..………….…….….30
3-1-2 MUMPs 製程設計規範（Design rules）……………………32
3-2 SDA設計與SDA馬達設計……………………………………34
3-2-1 結構設計…………..……………………………….………34
（a） 銜接第一層多晶矽與第二層多晶矽之連樁…….……35
（b） 靜電屏蔽層(Shield) 的設計………………………..…37
3-2-1 形狀設計………………………..…………………….……40
（a） 導角的設計………….……………………..…….…..…40
（b） 扇葉形狀設計………………………………..………..…40
3-3 L_Editor 製程模擬與結構模擬………………..…..………...46
3-4 結構釋放製程…….…...………………..…….……….………47
3-4-2 氫氟酸濕式蝕刻設備..…………….….........................….47
3-4-2 蝕刻步驟…………...…………….…….…………..………48
第四章 元件特性量測…………………………..…………………50
4-1 量測設備與實驗步驟……………………………………..……51
4-1-1 實驗量測設備………………………………………..……51
4-1-2 實驗步驟……………………………………………...……53
4-1-3靜態OM圖…………………….………………….…...……55
4-1-4靜態SEM圖…………………………………………………57
4-2 動態錄影圖….………………………………...………...………59
4-3 SDA倒退致動原理……………………..............................…….60
4-4 量測數據………...…………………...................................…….62
第五章 結論與建議………………………………...………...…….64

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