隨著攜帶型電子消費產品的普及，對於使用網路的用戶以及數據流量皆有爆炸性的成長，其中光纖雙向收發元件在光纖網路骨幹中扮演資料傳輸的重要角色，而元件中雷射的溫度會影響其產品壽命、通訊品質與訊號傳輸效率等。
由於光纖雙向收發元件其部分零件具有多種材料選擇的特性，因此本研究主要目的在於利用ANSYS 15.0/Fluent有限體積法軟體建立三維之光纖雙向收發元件，用以探討不同材料之熱傳導係數對於元件散熱性之影響，而元件散熱性之優劣在本研究中又可分為雷射最高溫度之高低與雷射出入光口溫度差之大小兩部分做探討。
在電路基板、外殼、鍍膜層、雷射基板與錫球此五種材料選擇中，本研究模擬結果發現以電路基板與雷射基板熱傳導係數之改變對於元件散熱性有較為明顯之影響，是以稱之為元件散熱性之重要因子，模擬結果分別得到重要因子與雷射最高溫度以及雷射出入光口溫度差之擬合方程式，再將不同雷射功率之影響效應考慮進此擬合模型中，成功建立出一個考慮不同雷射功率之情況下，重要因子熱傳導係數對於元件散熱性之設計規範，將擬合模型代入十一組模擬驗證數據中，雷射最高溫度以及雷射出入光口溫度差之誤差皆小於9%。透過擬合方程式得知，在210mW的雷射散熱功率情況下，電路基板與雷射基板之熱傳導係數分別選擇大於2W/m℃以及60W/m℃之材料，雷射最高溫度以及雷射出入光口溫度差可以分別低於85℃以及12℃。

As portable electronic devices have become widely used, both the demand for internet access and network traffic have increased hugely. The Optical Fiber Transceiver Device is important for communication through optical fiber networks. The temperature of the device affects its lifetime, the quality of communication and the coupling efficiency of the optical fiber.
Since some of the components of the Optical Fiber Transceiver Device can be made of various materials, this work constructs a three–dimensional Optical Fiber Transceiver Device model using the ANSYS 15.0/Fluent software for implementing the finite volume method, and to investigate the effects of the thermal conductivity coefficient of the materials on heat dissipation by the device.
Among five components which have alternative materials — substrate, housing, coating, SMT substrate and solder ball –– the results revealed the dissipation of heat by the device was dominated by the variations of substrate and SMT substrate’s thermal conductivity coefficient. These critical variables were fitted using equations in terms of the maximum temperature of device and the difference between the inlet and outlet temperatures of the laser coupling. The effect of the laser power on the fitting model was considered. Then, the design rule corresponding to the critical components’ thermal conductivity coefficient of the Optical Fiber Transceiver Device was obtained successfully. The errors between the simulated and the fitted results which were concluding the maximum temperature of device and the difference between the inlet and outlet temperatures of the laser coupling were less than 9%. At a heat dissipation by the laser of 210mW, when the thermal conductivity coefficients of the substrate and the SMT substrate’s material were 2W/m℃ and 60W/m℃, the maximum temperature of the device and the difference between the inlet and outlet temperatures were less than 85℃ and 12℃, respectively.

目錄
誌 謝 i
摘 要 ii
Abstract iii
目錄 v
表目錄 viii
圖目錄 xi
第一章 緒論 1
1.1 前言 1
1.2 光纖雙向收發元件簡介 2
1.3 文獻回顧 5
1.3.1 溫度對於半導體雷射之可靠度影響 5
1.3.2 光纖雙向收發元件內部雷射零件之散熱問題 8
1.4 研究動機與目的 9
1.5 全文架構 10
第二章 基礎理論簡介 13
2.1 有限體積法簡介 13
2.2 套裝軟體ANSYS15.0/Fluent簡介 14
2.3 基礎熱傳原理 17
2.3.1 熱傳導 17
2.3.2 熱對流 18
2.3.3 熱輻射 19
2.4 Design Expert 8.0軟體介紹 20
第三章 研究方法 29
3.1 研究流程 29
3.2 基本假設 31
3.3 模型之建立與模擬設定 31
3.3.1 模型結構與尺寸 31
3.3.2 模型材料參數選擇 32
3.3.3 模型網格劃分 33
3.3.4 邊界條件與負載設定 34
3.3.5 收斂性分析 35
第四章 結果與討論 49
4.1 影響元件散熱性之重要因子 49
4.1.1 第一階段實驗設計 49
4.1.2 第二階段實驗設計 52
4.2 重要因子與雷射最高溫度之關係 56
4.3重要因子與雷射出入光口溫度差之關係 58
4.4功率變化對於元件散熱性之影響 60
第五章 結論與未來展望 93
5.1 結論 93
5.2 未來展望 94
參考文獻 95
附錄A 101
附錄B 103

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