電鍍線(Plating bars)是在傳統BGA封裝過程中不可避免的殘留元件，並且會對訊號產生許多影響，例：阻抗不連續、EM效應、較差的傳輸品質..等。而在本論文中探討的則問題則是電鍍線的耦合效應對於訊號線本身的影響，從不同負載的耦合結構分析下手，並提出一個L-stub耦合的架構來減少其耦合量，探討其長度比例、位置擺放及個數，找到可以抵銷雜訊的範圍，利用訊號之間的反射、分流概念來達到減少的效果，且不需要額外加入其他的元件即可達到效果，並與目前減少耦合量的方法做比較，然後試著實作來證明此方法的可行性，最後利用眼圖分析的結果來證實對於訊號的傳遞品質有所改善。

In the BGA family package, plating bars must be added in the manufactured processing , However they will cause discontinuities[1]、radiation effect[2] and bad transmission efficiency[3]~[6].This paper considers the signal transmission problem caused by the couple plating lines. This thesis starts from analyzing the different terminations of the couple lines, then proposes a novel L-stub element structure which can decrease the crosstalk noise efficiently on the plating lines. Discussion of the L-stub length ratio, L-stub position and the numbers of the L-stub then provides the useful range. The basic idea is to use the reflection of source to cancel the original couple and doesn’t have to add additional element. In addition, it compares well with other methods which are also designed for reducing crosstalk and circuits are implemented to prove our design. Last of all, using the eye diagram to manifest the signal quality improvement.

目錄
審定書…………....……….……………………………….…i
誌謝…………….…....……………………………………….ii
目錄….………………………………………………………iii
圖表索引………..……..……………………………………..v
中文摘要………..………………………………..………...viii
Abstract...…….…………………………………….……….ix
第一章 序論…………………………………...........……….1
1.1 研究動機與目的.…………………………………….….1
1.2 何謂電鍍線………………….………………….……….2
1.2 論文大綱..……………………………………………….4
第二章 串音效應……………………………….......….……5
2.1 串音效應的成因.....………………………………….….5
2.1.1 傳輸線串音效應之時域分析…………..........….…....5
2.1.2 開路分析…..………………………………………….9
2.2 Plating Bar耦合架構…………........…………………11
2.2.1 公式推導…...............………………………………..11
2.3 常見的解決方法………………………………………14
2.3.1 蛇行線(Serpentine Line)…….……………………14
2.3.2 Guard trace…………………………………………16
第三章 L-stub結構….……..……………………………...19
3.1 L-stub結構……….…………………………………...19
3.1.1 原理簡介 ………….………………………………..19
3.2 L-stub結構……………….…………………………...20
3.2.1 位置探討 ………………………………..…………..20
3.2.2 長度探討 ………......………………………………..22
3.2.3 個數探討 …………………………………......……..26
3.3 不同結構比較………………………………………....28
第四章 量測與模擬驗證...………………………….……..31
4.1 實作模型.……….........…………………………….….31
4.2 模擬環境修正….…..………………………………….33
4.3 眼圖分析…...………..…………………………..…….38
4.3.1 眼圖介紹 ……………………......…………………..38
4.3.2 IBIS model加上plating bar架構之眼圖模擬……..40
第五章 結論…….........…………………………………….43
參考文獻…………….....…………………………………..44

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