本論文分為兩大部分，在第一部份中，我們將天線整合於堆疊式封裝架構中，並將晶片與天線共設計。利用IPD製程上的優勢採用了強電容耦合饋入及碎形槽孔這兩項技術將天線微型化設計，所設計的微型化天線操作在WLAN 2.4GHz頻帶，天線尺寸僅有4mm×8.625mm (0.0327λ×0.0707λ)，頻寬達到100MHz以上，天線的輻射效率有60%以上的效能表現。
第二部分中，我們為了對多輸入多輸出天線整合於堆疊式封裝中做評估，我們先使用FR4基板設計了堆疊的架構，所設計的MIMO天線採用強耦合饋入縮小化，並且提出了一個較為寬頻的S型隔離器來改善天線的隔離度，此MIMO天線間隔為12mm，隔離器大小僅有10mm×10mm，量測結果中，天線的操作頻寬達200MHz(2.45GHz-2.65GHz)，效率則有60%以上的表現，此天線表現可以驗證強耦合饋入縮小化技術以及隔離器技術在堆疊架構上是可行的。
我們也以模擬的方式評估堆疊式封裝MIMO天線，我們將MIMO天線設計在10mm×10mm的堆疊IPD上，整體MIMO天線中的隔離器僅有2mm×8mm，天線間格為4mm，在模擬結果中，天線的操作頻寬有100MHz，天線效率表現為40%以上。
最後我們再提出兩項適用於堆疊式封裝天線的延伸應用，其一為雙頻天線設計，所設計的操作頻帶為GPS(1.57GHz)頻帶與WLAN(2.4GHz)頻帶，其二為寬頻天線設計，我們提出了IPD尺寸僅有3mm×3mm的堆疊式天線設計，其頻寬表現為40%(4.8GHz-7.2GHz)。

This thesis is divided into two parts. In the first part, the antenna is integrated into the stacked package. The antenna and the semiconductor chip are co-designed together. We utilize the advantage of IPD manufacturing to develop strong capacitively coupled-fed miniaturization technology and fractal slots miniaturization technology. We design a miniaturized antenna operating at WLAN 2.4GHz band. The size of the antenna is only 4 mm×8.625 mm (0.0327λ×0.0707λ). The operating bandwidth is over 100 MHz. The radiation efficiency is over 60%.
In the second part, we design a stacked structure using FR4 substrate. The MIMO antenna is miniaturized by strong capacitively coupled-fed miniaturization technique, and we propose an S-shaped isolator which has wider isolation bandwidth to improve the isolation problem. The separation of both antennas is only 12 mm. The size of the isolator is only 10 mm×10 mm. The measured operating bandwidth is 200 MHz, and the radiation efficiency is over 60%.
We also design a 10 mm×10 mm size of MIMO antenna with 2 mm×8 mm isolator on the stacked package structure. The antenna is operating at WLAN 2.45 GHz band, and the operating bandwidth is over 100 MHz. the radiation efficiency is over 40%.
Finally, we propose two different stacked package antenna applications. The first one is a dual-frequency design. The proposed antenna is operating at GPS (1.57 GHz) band and WLAN 2.4 GHz band. Another is a broadband design. The size of IPD is only 3 mm×3 mm. The operating bandwidth is 40% (from 4.8 GHz to 7.2 GHz).

摘　要 ii
Abstract iii
目　錄 iv
圖　次 vi
第一章 序論 1
1.1研究背景介紹 1
1.2研究動機 2
1.3研究方法 4
1.4論文大綱 5
第二章 適用於堆疊式封裝架構之縮小化天線設計 7
2.1堆疊式封裝架構設計說明 7
2.1.1外部系統接地面之影響 9
2.2強耦合電容饋入之縮小化技術及其影響 11
2.3碎形槽孔之縮小化技術及其影響 18
2.4縮小化PIFA架構天線設計 24
2.5實作與量測探討 27
第三章 強電容耦合饋入MIMO天線及其隔離器設計 30
3.1 MIMO天線與隔離技術簡介與比較 30
3.2隔離器設計概念及其等校模型 32
3.3 G型隔離器之模擬、實作與量測 37
3.4 S型隔離器之模擬、實作與量測 41
第四章 適用於堆疊式封裝架構之縮小化MIMO天線 45
4.1 MIMO天線設計與5mm×5mm隔離器 45
4.2隔離器之設計 48
第五章 堆疊式封裝天線之應用與展望 50
5.1適用於堆疊式封裝的雙頻天線設計 50
5.2 3mm×3mm之堆疊式封裝寬頻天線設計 52
第六章 結論 55
參考文獻 57

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