本論文主要設計一個創新拋光系統，其能針對表面形狀複雜的自由曲面進行表面加工。該系統主要任務在於將一個原本相當不精準（形狀誤差高於數十微米，甚至達數百微米）的中型尺寸（直徑在50mm到150mm之間）曲面，經由所研發的拋光系統，將曲面的精度提昇至次微米的程度。
此拋光系統除了可對自由表面精密大大提昇，且相對於目前所存在的自由曲面拋光法，其具有非常高的加工效率。

本論文使用一套邏輯思考來建立達成本文要完成的任務的子目標。本拋光方法要達成要求的目標的關鍵設計有兩個：（一）本創新刀具必需可隨工件形狀的不同而自行調整，使得刀具與工件間可形成大面積的接觸，而提高拋光效率；（二）刀具與工件間的負載分布具可調整的功能，可改變發生在工件上不同位置的加工率，令工件上誤差大的位置具有較大的加工率。依此，只有上述的微能達成，並配合一套適切的誤差補償策略，便能將誤差輪廓（error profile）快速移除。

本文應用ANSYS（有限元素法軟體）對導力塊做分析，並建立導力塊的施力分布與壓力分布關係，如此便能輕易的由所要求的壓力分布求得施力分布，加速壓力分布的建立，讓整個拋光方法更有效率。此外，就所設計的拋光方法，去設計一台拋光原型機，再應用其來做一系列的實驗，以驗證所提出的拋光方法是可行的。

從實驗結果可以得知，以上拋光方法不但具有高的加工重現性，其還有很高的加工效率。另外，從加工率分布可調性實驗，可以發現本系統之加工量分布與壓力分布預測波形長得很相像，證明其有能力透過壓力分布的可調性來對由曲面進行精密加工。

This article aims to design an innovative polishing method that can do polishing job to a complicated axial symmetric free surface. The main task of the system is to increase the precision of a middle size (diameter range from 50mm to 150mm) free surface with low precision (form error is larger than 10μm, even reach few hundred μm. By using the developed polishing system, the precision is expected to reach and order of sub-micron. It is a machining method which able to outcome a precise free surface, and also a high efficient free surface machining method compared to machining technique nowadays.

At the beginning of this article, a logical thinking method will be used to set up a number of sub-targets from the task of the article. From those sub-targets, the keys of the polishing method would come out to accomplish the task. They are: 1.The machining tool is deformable and able to match up the shape of the surface of the tool to enlarge the polishing area. This will increase the efficiency of the machining method; 2.The pressure distribution between the tool and work piece is controllable to let the surface area with larger error form has larger machining rate. By accomplish the sub-targets above, a set of form error compensate strategy can be use to remove the error profile of the free surface with high efficiency.

To increase the efficiency of the polishing system, the analysis of the force guide by ANSYS (a finite element analysis software) will be done to create a relation between the force applied and the pressure distribution. This will make the pressure distribution construction task easy and the efficiency of polishing will be increased. According to the machining method designed above, a prototype polishing machine will be designed, and a series of experiments will be done on the designed prototype polishing machine to test the workability of the polishing method.

The outcome of the experiments shows that the machine not only has good repeatability, but also has a very high machining efficiency. Besides, the machining distribution experiment shows that the machining method has ability to remove the error distribution from the free surface. It means that is able to do precision machining job to the free surface.

目錄 I
圖索引 III
表索引 VII
中文摘要 VIII
ABSTRACT IX
第一章 緒論 1
１.１ 研究動機與方法 1
１.２ 拋光在精密加工上的運用 3
１.２.１ 拋光方法的加工特點 3
１.２.２ 拋光應用在精密加工 4
１.３ 內容介紹 6

第二章 自由曲面之拋光系統設計 7
２.１ 自由曲面拋光方法概念 7
２.１.１ 可拋光性 7
２.１.２ 高效率拋光 10
２.１.３ 高精度拋光 12
２.２ 自由曲面拋光法要件 14
２.３ 自由曲面拋光法設計 16
２.４ 自由曲面拋光系統設計 19
２.４.１　刀具系統設計 19
２.４.２ 其他系統設計 24

第三章　導力塊壓力分布之分析 26
３.１ 壓力分布現象之探討 26
３.１.１ 漣漪效應 28
３.１.２ 各別力單元的壓力分布 30
３.１.３ 力單元相互疊加現象 33
３.２ 施力分布與壓力分布關係式建立 37
３.３ 關係式驗證 43
３.４ 導力塊效能與瓶頸探討 47

第四章　拋光特性之實驗分析 52
４.１ 實驗規劃 52
４.２ 實驗與量測設備 53
４.２.１ 實驗設備簡介 53
４.２.２ 實驗材料與量測設備簡介 53
４.３ 實驗結果與討論 54

第五章 總結與未來展望 56
５.１ 各章節之總結 56
５.２ 未來展望 57

【1】 Y. T. Su, S. Y Wang, and J. S. Hsiau, (1995), “On machining rate of hydrodynamic polishing process,” Wear, 188, 77-87.
【2】 Y. T. Su, C. C. Horng, and H. K. Kuo, (1996), "Effect of tool surface irregularities on machining rate of hydrodynamic polishing process," Wear, 199, 89-99.
【3】 S. Y. Wang, and Y. T. Su, (1997), "An investigation of machinability of different materials by hydrodynamic polishing process," Wear, 211, 185-191.
【4】 Y. T. Su, T. C. Hung, and Y. Y. Chang, (1998), "On machining rate of hydrodynamic polishing process under semi-contact lubricating condition," Wear, 220, 23-33.
【5】 Y. T. Su, Y. C. Kao, (1999), "An experimental study on machining rate distribution for hydrodynamic polishing process," Wear, 224, 95-105.
【6】 Y. T. Su, (2000), “Investigation of Removal Rate Properties of a Floating Polishing Process,” J. Electrochem. Soc., 147(6), 2290-2296.
【7】 Y. T. Su, T. C Hung, and C. C. Horng, (2000), “An experimental study on tool wear of hydrodynamic polishing process,” Wear, 246, 117-129.
【8】 Y. T. Su, S. H. Liu, and Y. W. Chen, (2001), “A preliminary study on smoothing efficiency of surface irregularities by hydrodynamic polishing process,” Wear, 249, 808-820.
【9】 Y. T. Su, T. C. Hung, and G. C. Weng, (2003), “Ultra-precision machining by cylindrical polishing process,” Int. J. Mach. Tools Manufact., 43, 1197-120.
【10】 Y. T. Su, T. C. Hung, and C. C. Ou, (2006), “A preliminary analysis on tool wear rate of polishing process: adhesion effects,” Wear, 260, 50-61.
【11】 Y. T. Su,, C. C. Horng,, S. Y. Wang, and S. H. Jang, (1996), "Ultra-precision machining by the hydrodynamic polishing process," Int. Mach. Tools Manufact., 36(2), 275-291.
【12】 Y. T. Su, C. C. Horng, J. Y. Sheen, and J. S. Hsiau, (1996), "A process planning strategy for removing non-axially symmetric form error by hydrodynamic polishing process," Int. Mach. Tools Manufact., 36(11), 1227-1245.
【13】 Y. T. Su, and J. Y. Sheen, (1999), “A process planning strategy for removing arbitrary and axially symmetric profile by a polishing process,” Int. Mach. Tools Manufact., 39, 187-207.
【14】 A. J. Leistner, et al. (1992), “Polishing study using Teflon and pitch laps to produce flat and supersmooth surfaces,” Appl. Opt., 31(10), 1472-1482.
【15】 S. F. Soares, et al. (1994), “Float-polishing process and analysis of float polished quartz,” Appl. Opt., 33(1), 85-95.
【16】 T. Kasai, F. Matumoto, and A. Kobayashi (1998), “Newly developed fully automatic polishing machines for obtainable super-smooth surfaces of compound semiconductor wafer,” Annals of CIRP, 37(1), 537-540.
【17】 M. Ikeda (1993), “Study on grinding and polishing method with lip type tools for obtaining middle class diameter spherical lenses,” Int. J. Japan Soc. Prec. Eng., 27(1), 41-46.
【18】 M. Ikeda (1993) June, “Theoretical analysis and spherical polishing with newly proposed non-contact spherical polishing method using lip type tools,” Int. J. Japan Soc. Prec. Eng., 27(2), 107-112.
【19】 Y. Higashi, et al. (1989), “New machining method for making precise very smooth mirror surfaces made from Cu and Al alloys forsynchrotron optics”, Rev. Sci. Instrum., 60(7), 2120-2123.
【20】 Z. Stavreva, D. Zeidler, M. Plötner, and K. Drescher , (1997) January, “Characteristics in chemical-mechanical polishing of copper :Comparison of polishing pads,” Applied Surface Science, 108(1), 39-44.
【21】 S. W. Park, C. B. Kim, S. Y. Kim, and Y. J. Seo, (2003) April, “Design of experimental optimization for ULSI CMP process applications,” Microelectronic Engineering , 66(1-4), 488-495.
【22】 T. F. A. Bibby, J. A. Adams, K. Holland, G. A. Krulik, and P. Parikh, (1997) October, “CMP CoO reduction: slurry reprocessing,” Thin Solid Films, 308(1-4), 538-542.
【23】 R. Carpio, J. Farkas, and R. Jairath, (1995) October , “Initial study on copper CMP slurry chemistries,” Thin Solid Films , 266(2), 238-244.
【24】 Y. J. Seo, S. Y. Kim, Y. O. Choi, Y. T. Oh, and W. S. Lee, (2004)June, “Effects of slurry filter size on the chemical mechanical polishing (CMP) defect density,” Materials Letters , 58(15), 2091-2095.
【25】 G. B. Basim, I. U. Vakarelski, and B. M. Moudgil, (2003)July, “Role of interaction forces in controlling the stability and polishing performance of CMP slurries”, Journal of Colloid and Interface Science , 263(2), 506-515.
【26】 R. Komanduri, M. Jiang, and N.O. Wood, (1998)September, “On chemo-mechanical polishing (CMP) of silicon nitride (Si3N4) workmaterial with various abrasives”, Wear , 220(1), 59-71.
【27】 G. S. Grover, H. Liang, S. Ganeshkumar, and W. Fortino, (1998)January, “Effect of slurry viscosity modification on oxide and tungsten CMP”, Wear, 214(1), 10-13.
【28】 Y. T. Su, and S. S. Jang, (2006), “An investigation of polished surface characteristics by molecular dynamics simulation method,” submitted to wear.
【29】 陳勇維, (2001),“應用液動壓拋光法於工件表面終極粗度之初步探討”,國立中山大學碩士論文,高雄.
【30】 蔡政旻, (2002),“不同工件表面波長度拋光法於表面粗度之改善極限的探討”,國立中山大學碩士論文,高雄.
【31】 賴國智, (1997),“複合式拋光法之刀具表面波紋對加工率特性的影響”,國立中山大學碩士論文,高雄.