本論文為利用垂直鏡面光波導反射器搭配彎曲波導，來製作半導體環形共振器，經由利用多模干涉耦合器之寬度與長度所產生的特殊光能分布，來達到我們設計元件所需的特殊分光比，再結合垂直蝕刻鏡面讓光模在蝕刻鏡面反射，使元件的大小降低成無垂直鏡面的37.6％。
在半導體環形共振器的結構設計上，我們採用一個2×2的多模干涉耦合器在耦合係數為0.15的條件下，用彎曲波導連接兩個具有特殊分光比的多模干涉耦合器，形成一個具有波長選擇性的環形共振器。
在製程方面，本論文採用多重步驟濕蝕刻技術作為此元件之蝕刻技術。先利用濕蝕刻技術在元件表面上蝕刻出脊狀波導及反射鏡，再對彎曲波導及反射鏡外圍做深蝕刻，以減少光模在傳輸和反射時的損耗，最後掀離蝕刻遮罩、磨薄切片做特性量測。
在量測元件特性後，我們可以在直線的部份經由Fabry-perot共振的情形計算出其波導損耗為59.6dB/cm，分光器的部分量測出具有90：10的分光效果，而在環形共振器的部份可得到自由譜域(FSR)為72GHz。

This study uses vertical mirror optical waveguide reflector and bending waveguide to fabricate semiconductor ring resonators. By using multimode interference couplers with specific width and length that
generate distinctive energy distribution to achieve the power splitting of 85:15. We integrate vertically deep etching turning mirror to reflect optical mode, and reduce the component size to 37.6%.
In fabrication process, this study applies multiple wet etching technique to form the waveguide structure. First, we use wet etching technique to etch ridge waveguide and turning mirror, and then perform deep etching in the periphery of bending and turning region to reduce the
bending loss. Finally, the etching mask is lifted off, and the wafer is polished and sliced for measurement.
After measuring the signal, we can compute waveguide loss by Fabry-perot resonant situation. The waveguide loss is 59.6dB/cm. Power splitting of 90:10 is achieved. The free spectral range (FSR) is 72GHz for the ring resonators.

目錄
第一章 簡介..........................................................................................1
1-1前言......................................................................................1
1-2論文架構..............................................................................2
第二章 多模干涉耦合器................................................................3
2-1多模干涉耦合器(MMI)簡介...............................................3
2-1-1 傳播常數與耦合長度的關係.................................3
2-1-2自我成像原理..........................................................5
2-2多模干涉耦合器之模擬..................................................... 9
第三章 元件設計..............................................................................10
3-1　直線脊狀波導............................................................10
3-2 彎曲波導.....................................................................10
3-3 特殊比例分光器.......................................................12
3-4 理論模擬.................................................................... 13
3-4-1 2x2(K=0.85)之MMI模擬.................................... 13
3-4-2 2x2(K=0.85)之交錯型MMI模擬........................ 14
3-4-3 2X2 (K=0.15) MMI反射鏡面器..........................15
3-4-4 反射鏡面分光器之模擬結果..............................17
3-5 環形共振器................................................................18
3-5-1 環形共振器分析方法........................................22
3-5-2 垂直蝕刻鏡面光波導反射器模擬結果...........24

第四章 元件製程...........................................................................26
4-1製程磊晶片簡介.......................................................26
4-1-1 磊晶片結構.......................................................26
4-1-2 磊晶片發光光譜...............................................27
4-2 濕蝕刻製程..............................................................28
4-2-1濕蝕刻製程實驗流程示意圖...........................28
4-2-2濕蝕刻製程步驟...............................................32

第五章 元件量測與討論..........................................................43
第六章 結論...................................................................................48
參考文獻..............................................................................................49

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