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博碩士論文 etd-0803105-030316 詳細資訊
Title page for etd-0803105-030316
論文名稱
Title
自組多層壓印對準機台於壓印製程之應用
Development of self-built multilayer aligner for imprint process
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
74
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2005-06-15
繳交日期
Date of Submission
2005-08-03
關鍵字
Keywords
奈米壓印、液晶顯示器、對準機台
TFT LCD, nanoimprint, multilayer aligner
統計
Statistics
本論文已被瀏覽 5663 次,被下載 34
The thesis/dissertation has been browsed 5663 times, has been downloaded 34 times.
中文摘要
在這篇論文中,討論結合曝光顯影與多道壓印的方法。該方法是利用透明材料,如玻璃,當做模仁進行壓印。因為模仁上有濺鍍金屬層,可以利用圖案的設計,使得模仁具有光罩的功能,當模仁壓入材料後再進行曝光,脫模後顯影以得到所需圖案。文中探討該方法改進現有TFT製程的可能性。由於在壓印的過程中,往往需要多道壓印的製程,因此發展適合多道壓印的對準機台是文中另一重點。由於市面上的對準機台,大部分是結合晶圓接合機,設備的成本支出沉重。本論文利用簡單的機構,包含兩台實體顯微鏡、真空吸盤、四軸定位平台及同軸光源,完成一台低成本對準機台並將提升對準精度到達5μm。而且為了開發新型TFT 壓印材料,AZ系列光阻(AZ-650正光阻)、HOSP(Hygrido Organic Siloxane Polymer)和SE-812等,這三種材料,將被壓印測試並且評估這些材料未來的應用,其中HOSP為一低介電常數的材料,可當作絕緣層。SE-812為一鈍化材料,不容易與其他材料發生化學反應。測試結果發現,AZ-650光阻最適合作為多道壓印製程的材料。
Abstract
In this paper, a new method combining imprint lithography and multiimprint was discussed to improve the generic TFT process. In order to apply the multilayer imprint, the alignment machine is essential for the whole process. Although there are many types of equipment available on the market, the cost of those alignment apparatuses is too expensive. In this paper, a simple theorem is employed to complete a low cost alignment machine with alignment accuracy to 5 μm. Besides, in order to develop new TFT imprint photoresist, three kind of materials, AZ-series photoresist (AZ-650 a positive photoresist), HOSP (Hygrido Organic Siloxane Polymer) and SE-812, are tested for imprint and evaluate the applications of these materials in the future. The AZ-650 suits imprint process in this experiment.
目次 Table of Contents
目錄.................................................................................................................... I
圖目錄...............................................................................................................III
表目錄...............................................................................................................V
中文摘要...........................................................................................................VI
英文摘要..........................................................................................................VII
第一章 緒論......................................................................................................1
1-1研究背景與目的..................................................................................1
1-2文獻回顧..............................................................................................2
1-3本文架構…..........................................................................................6
第二章 TFT壓印微影製程設計…………......................................................8
2-1 TFT製程基本理論..............................................................................8
2-2改良壓印製程設計…........................................................................13
第三章 改良式TFT壓印微影製程實驗及自製多層壓印對準機台之開發…...…………………………...…………………....……….........20
3-1改良式TFT壓印微影製程測試材料簡介........................................20
3-2改良式TFT壓印微影製程參數設定及實驗....................................23
3-3自製多層壓印對準機台開發............................................................34
第四章 實驗結果與討論................................................................................43
4-1改良式TFT壓印微影製程材料測試結果與討論...........................43
4-2自製多層壓印對準機台開發結果與討論........................................49
第五章 結論與未來展望................................................................................52
5-1結論…………………………………………….…….......................52
5-2未來展望............................................................................................52
參考文獻..........................................................................................................54
附錄一..............................................................................................................59
附錄二..............................................................................................................63
附錄三..............................................................................................................64
參考文獻 References
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