在現今高速電路之中，為了能更有效的利用有限的基板空間，印刷電路板勢必要往多層化發展，而過孔結構(via)正是將各個訊號層做垂直方向的穿層連接，然而此不連續的結構，隨著電路操作頻率的提高與工作電壓下降的趨勢下，對於訊號品質的不良影響漸漸地變的更不容忽視。所以為了快速準確地模擬分析此問題，便以傳輸線模型的架構為基礎並結合一些其他元件的模型，如狹縫、去耦合電容、過孔結構等等的一個混合式物理性模型(hybrid physical model)之方式來模擬此一現象，基於此方法我們可以得到與Ansoft HFSS相近的準確度，且可以有更好的時效性。此外藉由此方法我們更進一步的分別探討高速電路之中瞬時切換雜訊經過孔結構耦合至訊號線之效應，以及過孔結構在印刷電路板之中所造成的不良影響，並分析討論抑制雜訊之方法與改善電路板中過孔結構存在所引發的不良效應。

In high-speed digital circuits, in order to utilize the space of printed circuit boards efficiently, the signal via is a heavily used interconnection structure to communicate different signal layers. However, the interconnection discontinuities will result in the degradation of the signal integrity and become a crucial issue for IC designers. To analyze the problems accurately and fast using the hybrid physical equivalent model which combining the transmission line model, slot model, via model, and decoupling capacitor model, etc. Based on the method, we can get a good result of simulation and compute faster than Ansoft HFSS. In addition, by the hybrid physical model method, we simulate and discuss several interesting issues such as resonance in power/ground planes, and the effect of the simultaneous switching noise, we also improve the bad effect of the printed circuit boards existing vias by some ways.

目錄…………………………………………………………………………………………Ⅰ
圖表索引……………………………………………………………………………………Ⅲ
第一章 序論…………………………………………………………………………………1
1.1 研究目的與方法………………………………………………………………………1
1.2 論文大綱………………………………………………………………………………2
第二章 數值模擬方法………………………………………………………………………4
2.1 簡介……………………………………………………………………………………4
2.2 傳輸線模型……………………………………………………………………………5
2.3 模擬結果與比較………………………………………………………………………8
2.4 板層厚度與夾層介質之影響………………………………………………………13
第三章 印刷電路板中過孔結構…………………………………………………………15
3.1 介紹…………………………………………………………………………………15
3.2 四層印刷電路板中過孔結構的模型………………………………………………16
3.2.1 平衡式傳輸線模型………………………………………………………………19
3.2.2 微帶線模型………………………………………………………………………19
3.2.3 連通柱模型………………………………………………………………………22
3.3 過孔結構之模擬與分析……………………………………………………………23
3.4 雙模過孔結構之模擬與分析………………………………………………………27
第四章 瞬時切換雜訊之現象與影響……………………………………………………33
4.1 介紹…………………………………………………………………………………33
4.2 印刷電路板之共振…………………………………………………………………34
4.3 瞬時切換雜訊經過孔結構之耦合效應……………………………………………36
第五章 改善瞬時切換雜訊對訊號耦合之對策…………………………………………42
5.1 使用去耦合電容改善瞬時切換雜訊對訊號線耦合效應……………………………42
5.2 切割電源平面來改善瞬時切換雜訊對訊號線耦合效應……………………………45
5.3 使用地過孔結構改善瞬時切換雜訊對訊號線耦合效應……………………………49
5.4 使用高阻抗表面改善瞬時切換雜訊對訊號線耦合效應……………………………53
5.5 利用相異之夾層介質改善瞬時切換雜訊對訊號線耦合效應………………………55
5.6 總結……………………………………………………………………………………58
第六章 結論………………………………………………………………………………60
參考文獻…………………………………………………………………………………61

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