由於高密度IC的發展，許多研究投入三維積體電路(3D IC)的接合技術，希望能降低製程溫度，以增加接點的可靠度。但是目前低溫製程裡，有許多製程需要較嚴格的環境條件，因此使得製程成本較高，製程步驟也較為繁瑣。近年有研究者提出CAB(Couples-Polishing Activation Bonding)製程，此製程利用超音波震動的方法，使接觸介面產生摩擦效應，利用摩擦生熱的方法來使介面溫度提高，進而產生介面原子擴散的現象而使銅接點產生接合，且此製程可以在常溫下執
行。
本研究利用有限元素法建立微銅塊超音波震動接合製程之三維模擬模型，並探討不同頻率的超音波震動對於銅塊接合面的應力場、應變場及溫度場的影響，並分析摩擦係數以及振幅對於接合面應變之影響。
模擬結果顯示在1500μs的作用時間後， 50k赫茲成功模擬出接合製程，其等效應力曲線可分為應力上升階段、應力下降階段及應力穩定階段。由本研究之分析結果可知，超音波震動頻率高低會影響能量傳遞的速率，50k赫茲在模擬結束前，最外圍的應變比中心應變少了23%；且在發生應力穩定的時間點上，研究結果發現有一臨界頻率，當頻率再升高時，到達應力穩定之時間已趨於一定值。
而最後利用改變摩擦係數以及振幅得到的模擬結果可看出，在固定頻率下，摩擦係數由0.1改為0.15會比0.15改為0.2具有較大的應變上升；而在更動振幅上面，當頻率越低時，振幅對其最大等效應變影響越大。

Since the development of high-density integrated circuits (ICs), numerous studies have used 3D IC bonding technology to reduce processing temperatures and increase reliability. However, numerous stringent environmental conditions have been established for low-temperature processes. This has increased costs and created additional processing steps. Recently, researchers have proposed a couples-polishing activation-bonding (CAB) process. This process involves using ultrasonic vibration technology to induce interfacial friction, thereby increasing temperatures at the interface. Subsequently, atomic diffusion leaving copper contacts generate engagement. This process can be performed at room temperature.
In this study, the finite-element method was used to establish a micro-copper block ultrasonic-vibration-bonding 3D simulation model. In addition, the effects of various ultrasonic-vibration frequencies on the stress, strain, and temperature fields of the interface were explored, and the effects of the coefficients of friction and amplitude on interface strain were analyzed.
The simulation results showed that at 50 kHz, the bonding process was successful after 1500 μs. The equivalent stress could be divided into stress upward, stress downward, and stress stabilization phases. Based on the results, it may be suggested that ultrasound-vibration frequencies affect energy transfer rates. The results obtained at 50 kHz showed that the outermost strain was less than 23% of the center strain.
By increasing the frequency, a critical frequency was determined regarding the period necessary to obtain a steady stress rate.
Finally, when the friction coefficient and amplitude were changed, at a fixed frequency, the coefficient of friction rose from 0.1 to 0.15, which was a larger increase in strain than 0.15 to 0.2. Regarding amplitude changes, when the frequency was low, the amplitude exhibited an increased effect on the maximum equivalent strain.

論文審定書 i
致 謝 ii
摘 要 iii
Abstract iv
目 錄 vi
表目錄 ix
圖目錄 xi
第 一 章 緒論 1
1. 1 前言 1
1. 2高密度IC之發展 2
1. 3文獻回顧 4
1.3. 1直接接合製程 4
1.3. 2金屬-金屬接合製程 5
1.3. 3聚合物黏著接合製程 7
第 二 章 基礎理論介紹 12
2. 1有限元素法簡介 12
2. 2套裝軟體ANSYS 12.1/ LS-DYNA簡介[31] 13
2. 3直接熱固耦合原理 15
第 三 章 研究方法 20
3. 1假設條件 20
3. 2模型建構與設定 20
3.2. 1元素與材料模型的選用 20
3.2. 2模型幾何結構與尺寸 21
3.2. 3網格劃分 22
3.2. 4邊界條件及負載方式與接觸設定 22
3.2. 5材料參數設定與編輯關鍵字文件 23
3.2. 6網格收斂性分析 25
第 四 章 結果與討論 32
4. 1熱功當量設定 32
4. 2微銅塊超音波摩擦接合模擬 33
4.2. 1模擬結果 34
4.2. 2綜合討論 41
4. 3摩擦係數對超音波摩擦接合之影響 43
4. 4振幅對超音波摩擦接合之影響 43
第 五 章 73
5. 1 結論 73
5. 2 未來展望 74
參考文獻 75

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