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博碩士論文 etd-0812109-165353 詳細資訊
Title page for etd-0812109-165353
論文名稱
Title
水冷式散熱器之有限元素分析
Water-cooled Heat Sink in Finite Element Analysis
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
80
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2009-07-14
繳交日期
Date of Submission
2009-08-12
關鍵字
Keywords
散熱、水冷
Heat Sink, Water-cooled
統計
Statistics
本論文已被瀏覽 5702 次,被下載 5995
The thesis/dissertation has been browsed 5702 times, has been downloaded 5995 times.
中文摘要
摘要
隨著電腦處理器的發展,晶片尺寸不斷縮小,應用於高功率的處理器需要較高散熱的效能,在電子設計的熱管理相關技術當中,散熱片絕對是最基礎、基本的一項運用,在一般自然對流無法有效降溫的情況下,一定會需要強制對流來增加散熱。
本文針對高功率熱源的散熱作探討,其中以水冷式的散熱器最為合適,不僅能結合ATC致冷晶片提高效能,噪音低並且穩定,最重要的是能將熱能排出系統外。因此在本研究中,採用計算流體力學(Computational Fluid Dynamics;CFD)的熱流分析,以流道出入口方向、腔體的尺寸、散熱器尺寸等做為改善的變數,探討不同型式的水冷式散熱模組的散熱效能。
從不同流量與熱阻值的探討發現,鰭片散熱器的趨勢曲線與其他散熱器有明顯不同,在低流速時有比較好的表現。利用各種散熱方法發現,N型流道的散熱效能是最好的,在流量為2.2 L/min時熱阻值為0.0971˚C/W。
Abstract
Abstract
With the development of computer processors, the size of chip has become smaller. But the processors used in high-power needs high performance of heat dissipation. In electronic design of the thermal management, the heat sink is the most basic application. Since the natural convection can not cool down effectively, it needs to use the forced convection cooling.
The purpose of this study explored water-cooled sink as the heat source for the high-power chip. The study findings show that the ATC cooling chip enhances the potency and decreased the noise. Most importantly, it dissipates heat. In the present study, the researcher used Computational Fluid Dynamics to analyze the heat flow problem. By applying three variables in terms of the flow channel, the housing size, and the heat sink size in data analyses, the researcher classified different types of water-cooled sink.
From the discussion of different flow rate and the thermal resistance, it shows that the trend curve of the fin-gilled sink is different from others. It also shows that it performs better in the low flow rate. After all using each method of heat dissipation, the potency of N-type channel sink is the best. When flow rate is 2.2 L/min, the thermal resistance is 0.0971˚C/W.
目次 Table of Contents
目錄
頁數
目錄……………………………………………………………………Ⅰ
表目錄…………………………………………………………………Ⅲ
圖目錄…………………………………………………………………Ⅳ
摘要……………………………………………………………………Ⅵ
英文摘要………………………………………………………………Ⅶ



第一章 緒論……………………………………………………………1
1-1前言………………………………………………………1
1-2研究動機與目的……………………………………………3
1-3使用軟體簡介………………………………………………4
1-3-1 Solidworks………………………………………4
1-3-2 ANSYS CFX………………………………………4
1-4文獻回顧……………………………………………………6
第二章 研究理論……………………………………………………11
2-1金屬特性……………………………………………………11
2-2熱流理論分析………………………………………………11
2-2-1統御方程式…………………………………………12
2-2-2紊流模式……………………………………………14
2-2-3 κ-ε紊流模式……………………………………14
2-3熱傳理論……………………………………………………15
2-4熱阻值………………………………………………………15
第三章 研究方法與分析流程………………………………………17
3-1研究方法與分析步驟………………………………………17
3-2實驗過程……………………………………………………18
3-2-1水冷式循環恆溫水槽………………………………18
3-2-2水冷道系統配置……………………………………19
3-3水冷散熱器實驗……………………………………………19
3-4模擬流程……………………………………………………21
3-4-1模擬的基本假設……………………………………21
3-4-2邊界條件與監控點…………………………………23
3-4-3設計目標……………………………………………24
第四章 結果與討論…………………………………………………25
4-1實驗與模擬比較…………………………………………25
4-2改變基座厚度的影響……………………………………33
4-3基座腔室與銅柱的尺寸影響………………………………36
4-3-1改變銅柱尺寸………………………………………37
4-3-2腔室高度與銅柱高度的影響………………………41
4-4細長渠道的設計與通道改善………………………………41
4-4-1細長渠道的設計……………………………………41
4-4-2通道改善……………………………………………44
4-5 N型流道……………………………………………………47
4-6鰭片式水冷的設計…………………………………………52
4-7流量與熱阻值的關係………………………………………60
第五章 結論…………………………………………………………63
5-1結論…………………………………………………………63
5-2未來展望與研究方向………………………………………64
參考文獻………………………………………………………………65
參考文獻 References
參 考 文 獻
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