在 Internet access 資訊容量快速增加的情形下，光纖通訊傳輸容量之要求已朝高速且高效率之方向進行。為了使結構簡單、成本降低，高速 25Gb/s 直接調變半導體雷射對於長距離高速傳輸系統來說是絕對必要的。其好處是可以利用四通道的系統模組達到 100Gb/s 的應用以及可套用波分多工使頻寬增加。
本研究使用直接調變 DFB 雷射已成功達到 25Gb/s 的直接調變速度，利用高速共平面傳輸線結構配合半絕緣基板，3dB 頻寬可大於 20GHz。並藉由電訊號反射量測實驗證實，降低元件的寄生效應可達到較高的直接調變速度。
量測證實操作在室溫下，波長 1300nm 與 1550nm 雷射利用錐形光纖量測到之轉換效率分別為 0.045 與 0.07mW/mA，輸出功率在 60mA 時分別可達 2.73 與 3.96mW/facet。旁模抑制比大於 35dB。3dB 頻寬分別大於 16GHz、20.5GHz，鬆弛振盪頻率分別為 12GHz、16.6GHz。並已完成 25Gb/s 眼圖量測以及高速數據傳輸測試。

With a rapid increase in information capacity of Internet access, high-speed, highly-efficiency, and cost-effectiveness laser source for optical fiber communication is required. High-speed 25Gb/s directly modulated laser is essential of this communication range, because of its simple structure, direct-modulation characteristics, low cost, and integration capability for wavelength division multiplexing (WDM) system, and moreover, it can achieved 100Gb/s data transmission by four channel module system.
In this work, data modulation speed of 25Gb/s direct modulation DFB laser has been achieved. By employing high-speed coplanar waveguide structure with semi-insulating substrate, high-speed with f3dB > 20GHz has been demonstrated. By the electrical reflection measurement, it confirmed that the high-speed direction modulation can be realized through reduction of electrical parasitics.
The laser chips is measured under continuous-wave mode at room temperature. In 1300nm and 1550nm wavelength device, slope efficiency obtained by taper fiber coupled of 0.045 and 0.07mW/mA respectively, output power up to 2.73 and 3.96mW/facet at 60mA. The Side Mode Suppression Ratio was greater than 35dB. 3dB bandwidth of greater than 16GHz and 20.5GHz, relaxation oscillation frequency of 12GHz and 16.6GHz. Finally, clearly back-to-back 25Gb/s eye diagram and error-floor-free performance were obtained.

論文授權書............................................................................................................................... ⅰ
中文審定書.............................................................................................................................. ⅱ
英文審定書............................................................................................................................. ⅲ
致謝............................................................................................................................................. ⅴ
中文摘要.................................................................................................................................. ⅵ
英文摘要................................................................................................................................ ⅶ
目錄......................................................................................................................................... ⅷ
圖次........................................................................................................................................... ⅺ
表次.......................................................................................................................................... ⅹⅴ
第一章 緒論.................................................................................................................... 1
1.1 前言.................................................................................................................... 1
1.2 研究動機.......................................................................................................... 6
1.3 論文架構.......................................................................................................... 8
第二章 半導體雷射之理論與機制......................................................................... 9
2.1 雷射組成.......................................................................................................... 9
2.2 半導體雷射原理.......................................................................................... 10
2.3 雷射種類........................................................................................................ 13
2.4 數位訊號時間分析..................................................................................... 17
2.5 訊號調變........................................................................................................ 21
2.6 靜態響應特性.............................................................................................. 22
2.7 動態響應特性.............................................................................................. 25
2.7.1 開啟延遲............................................................................................ 25
2.7.2 雷射調變頻寬.................................................................................. 27
2.7.3 頻寬限制因素.................................................................................. 30
2.7.4 高電流驅動結果............................................................................. 34
第三章 元件之模擬設計與製作........................................................................... 37
3.1 材料結構與特性.......................................................................................... 37
3.1.1 傳輸線................................................................................................. 37
3.1.2 梁脊波導............................................................................................ 41
3.1.3 磊晶片................................................................................................. 42
3.2 元件製作程序.............................................................................................. 45
3.2.1 辨別梁脊蝕刻方向......................................................................... 45
3.2.2 蝕刻液選擇....................................................................................... 45
3.2.3 製作流程............................................................................................ 46
3.3 元件製程結果與討論................................................................................ 66
第四章 實驗結果與討論.......................................................................................... 69
4.1 直流量測分析.............................................................................................. 69
4.1.1 L-I-V 量測......................................................................................... 69
4.1.2 光頻譜量測....................................................................................... 71
4.2 小訊號量測分析.......................................................................................... 73
4.3 大訊號量測分析.......................................................................................... 81
4.3.1 眼圖量測............................................................................................ 81
4.3.2 位元誤碼率量測............................................................................. 83
4.4 元件量測結果與討論................................................................................ 85
第五章 結論與未來工作.......................................................................................... 87
5.1 結論.................................................................................................................. 87
5.2 未來工作........................................................................................................ 88
參考文獻................................................................................................................................. 89

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