本論文主要研究聚焦離子束(focused ion beam, FIB)對派熱克斯玻璃(Pyrex glass)次微米結構的加工特性。由於聚焦離子束具有高的靈敏度和材料蝕刻率，前散射低，可不需蝕刻光罩對侷限區域直接加工等優點。因此本論文研究利用聚焦離子束快速的直接對玻璃加工出3D次微米結構。有效的製作出最小線寬約為0.39µm，最大深寬比約為5的高深寬比(high-aspect-ratio, HRA)玻璃結構。並且探討蝕刻速度、深度、加工時間等實驗結果與其實驗參數彼此間的關係。此外，嘗試在加工時加入輔助氣體氟化氙(xenon difluoride, XeF2)，研究探討氟化氙對玻璃加工的影響。

The fabrication characteristic of focused ion beam (FIB) for Pyrex glass was investigated. FIB has several advantages such as high sensitivity, high material removal rates, low forward scattering, and direct fabrication in selective area without any etching mask, etc. In this study, FIB etched Pyrex glass was used for fast fabrication of 3-D submicron structures. A high-aspect-ratio (HRA) glass structure of 5 (1.97µm depth/0.39µm width) was fabricated. The experimental results in terms of limiting beam size, ion dose（ion/cm2）, beam current, etc was discussed. Xenon difluoride (XeF2) was applied to enhance the FIB process. Its influence on glass fabrication is studied and characterized.

目 錄
目錄 I
表目錄 III
圖目錄 VI
中文摘要 VIII
英文摘要 IX

第１章 緒論 1
１-１ 研究動機與背景 1
１-２ 玻璃加工技術 2
１-３ FIB技術的發展 4
１-４ 本文架構 7
第２章 FIB原理介紹 9
２-１ FIB 組成 9
２-２ 基本原理 14
２-２-１ 工作原理 14
２-２-２ 成像原理 18
２-２-３ 供氣方式 20
２-２-４ 掃描參數(Scan parameter) 23
２-３ FIB基本功能 24
第３章 實驗步驟、樣本與儀器介紹 26
３-１ 儀器介紹 26
３-２ Pyrex玻璃 30
３-３ 實驗步驟 31
３-３-１ 樣品準備 31
３-３-２ 蝕刻程序 33
第４章 結果與討論 38
４-１ 探討FIB不同離子束條件的特性 38
４-２ 加工不同深寬比3D玻璃結構並分析其相關特性 41
４-３ 探討輔助氣體FIB蝕刻對Pyrex玻璃結構的影響 57
第５章 結論與未來展望 62
５-１ 結論 62
５-２ 未來展望 63
參考文獻 65

Ampere, A.T. (2004) ”Recent development in micromilling using focused ion beam technology”, J. Micromech Microeng., vol. 14, p.R15-R34

Akashil, T., Y. Yoshimura, and S. Higashiyama,(2005)” Deep reactive ion etching of pyrex glass using a bonded silicon wafer as an etching mask”, Micro Electro Mechanical Systems, 18th IEEE International Conference, p.520-523

Becker, H., U. Heim,(2000) ”Hot embossing as a method for the fabrication of polymer high aspect ratio structures”, Sens. Actuat. A , vol.83, p.130-135

Belloy, E., et al. (2000) “The introduction of powder blasting for sensor and microsystem applications”, Sensors and Actuators A, vol. 84, p.330-337.

Cabrinia, S., Carpentieroa, A. et al., (2005) “Focused ion beam
lithography for two dimensional array structures for photonic applications”, Microelectronic Engineering, vol. 78-79, p.11─15

Croman, T., P. Enokson, G. Stemme (1998) “Deep wet etching of borosilicate glass using an anodically bonded silicon substrate as mask”, J. Micromech. Microeng. vol. 8, p.84–87

Effenhauser, C.S., A. Manz, H.M. Widmer, (1993)” Glass chips for
high-speed capillary electrophoresis separations with submicrometer
plate heights”, Anal. Chem. vol. 65, p.652637–2642

Fan, Z. H., D. J. Harrison, (1994)“Miromachining of capillary electrophoresis injectors and separators on glass chips and evaluation of flow at capillary intersections”, Anal. Chem. vol. 66, p.177–184.

FEI Company，http://www.feicompany.com/

Gretillat, M.A., et al.(1997)“A new fabrication method for borosilicate glass capillary tubes with lateral inlets and outlets”, Sens. Actuators A vol. 60, p.219–222.

Giannuzzi, L.A et al.,(2005)” Intoduction to Focused Ion Beams ”, Springer, p.61,65

Ishitani, T. ,T. Ohnishi, Y. Madakoro, and Y. Kawanami, (1991) “Focused -ion-beam ‘cutter’ and ‘attacher’ for micromachining and device transplanttation”, J. Vac. Sci. Technol. B, vol. 9,p.2633-2637

Iliescu,C., J. Miaob, F.E.H. Tay,(2005)” Optimization of an amorphous silicon mask PECVD process for deep wet etching of Pyrex glass”, Surface & Coatings Technology ,vol. 192, p.43– 47

Kirk,E. C. G. et al.,(1988)“Scanning ion microscopy and microsectioning of electron beam recrystallized silicon on insulator devices”,J. Vac. Sci. Technol. B ,vol. 6, p.1940-1943

Kim, Y. K. et al.,(2006)”Focused Ion Beam Nanopatterning for Optoelectronic Device Fabrication” ieee journal of selected topics in quantum electronics, vol. 11, p.1292-1298

Li, X. T. Abe, Y. Liu and M. Esashi.,(2001)” Deep reactive ion etching of Pyrex glass using SF6 plasma”, Sensors and Actuators A, vol.87, p.139 -145

Melngailis, J.,(1987)“Critical review: focused ion beam technology and applications”, J. Vac. Sci. Technol. B, vol. 5, p. 469-495

Nagase, T et al.(2006)”Direct fabrication of nano-gap electrodes by focused ion beam etching” Thin Solid Films, vol. 499 p.279-284

Orloff, J., L Swanson, M. Utlaut., (2003）”High Resolution Focused Ion Beam: FIB and Its Applications” KA/PP, p.124

Oostra, D.J.,et al.(1986)”Sputtering of SiO2 in a XeF2 and in a Cl2 atomosphere”,J. Vac. Sci. Technol. B, vol. 4, p.1278-1282

Peirrat, C.,T. Siegrist, et al.,(1996)”Multiple-layer blank structure for phase-shifting mask fabrecation”, J. Vac. Sci.Technol B,vol.14,p.63-68

Ryssel, H., I. Ruge, (1986) “Ion Implantation “,Wiley, New York,

Ronggui, S. G.C. Righini, (1991)”Characteristics of reactive ion etching of glass and its applications in integrated optics”, J. Vac. Sci. Technol. A vol. 9, p. 2709-2712

Simpson, P.C., A.T. Woolley, R.A. Mathies, (1998) “Micro- fabrication Technology for the Production of Capillary Array Electrophoresis Chips”, Biomed. Microdevices, vol. 1, p.7–25.

Shan, X. C. R. Maeda and Y. Murakoshi,(2002)” Development of a micro hot embossing process for fabricating micro-optical devices”,: Proc. SPIE, vol.4936, p. 67-75

Slikkerveer, P.S., P.C.P. Bouten, F.C.M. de Hass, (2000)” High quality mechanical etching of brittle materials by powder blasting” Sensors and Actuators A , vol. 85, p. 296-303

Stark, T.J. et al.,(1995)”H2O enhanced focused ion beam”, J. Vac. Sci. Technol. B, vol. 13, p.2565-2569

SHIOKAWA, T. et al., (1988)“40nm Width Structure of GaAs Fabricated by Fine Focused Ion Beam Lithography and Chlorine Reactive Ion Etching”, JJAP, vol.27, p.L1160-L1161

SII NanoTechnology Inc.,(2004)”SMI3050SE FIB-SEM Hybrid System Instruction Manual Rev. 1.3

Taniguchi, J., K. Koga, Y. Kogo, I. Miyamoto,(2006)” Rapid and three-dimensional nanoimprint template fabrication technology using focused ion beam lithography”, Microelectronic Engineering, Vol. 83, p.940-942

Tseng, A. A., et al.,(2004),” Fabrication of high-aspect-ratio micro- structures using excimer laser”, Optics and Lasers in Engineering, vol. 41, p.827–847

TAKAHAHI, M. et al.(2005)”Nanoiprint of glass matrials with galssy carbon molds fabricated by focused-ion -beam”,Japanse J.of applied Physics,Vol.44, p.5600-5605

Vasile, M. J. et al., (1999)“Microfabrication techniques using focused ion beams and emergent applications”, Micron, vol.30, p.235─244。

Vasile, M. et al.,(1999)“Depth control of focused ion-beam milling from a numerical model of the sputter process”, J. Vac. Sci. Technol. B vol. 17, p.3085-3090

Wang, X. ,Y. Liu ,etc.(2004)”Ion beam etching of Quartz and BK7 glass ”,Vacuum science and technology (China), vol.24, No.5, p.397-400

Youn, S. W., C.G.Kang,(2005)” Maskless pattern fabrication on Pyrex 7740 glass surface by using nano-scratch with HF wet etching” Scripta Materialia vol.52, p.117–122

楊錫杭，黃廷合 (2004)微機械加工概論，全華科技圖書股份有限公司

王玉麟，(1994).“低能量掃描式聚焦離子束及其表面科學與光電科技應用”，中央研究院原子與分子科學研究所

許英傑，(2005).「利用聚焦離子束光罩製作之灰階微透鏡」，交通大學碩士論文

葉謀振，(1991)，「FIB 應用在故障分析的簡介」，工研院電子所

吳志宏，(2002)，「FY91可行性研究計劃結案報告」，工研院機械所。

許鴻隆，(2005).「近場光學讀取頭中奈米孔與固態浸沒透鏡整合製程之研究」，交通大學碩士論文。