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博碩士論文 etd-0820106-231719 詳細資訊
Title page for etd-0820106-231719
論文名稱
Title
錫銀銅無鉛焊料可靠度及環形介金屬形成機制的探討
Sn-Ag-Cu Solder Reliability and Ring Pattern Formation Mechanism
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
127
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2006-06-14
繳交日期
Date of Submission
2006-08-20
關鍵字
Keywords
環形介金屬、可靠度、無鉛焊料
ring pattern, BGA, Lead-Free, Sn-Ag-Cu
統計
Statistics
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中文摘要
  這次研究主要是針對BGA試片的時效處理,包含電流與試片的觀察,還有掉球試片及環狀圖樣(ring pattern)之研究。在電子構裝中,焊料與基材結合後,因為不同材料在界面處會產生反應,長久以來,在界面的研究是不可缺少的。一個不好的界面,除了會讓產品不良率提高,也會造成其他潛在的危險因素。
  研究方向大致分為三個部分:1.通電流之含鉛BGA,2.通電流之無鉛BGA,3.BGA掉球及環狀圖樣之研究。
1. 通電流之含鉛BGA
  在沒有通電的含鉛BGA試片分析中,實驗的結果與文獻大致相同,並沒有很大的變化。但是在通電流的含鉛BGA試片分析中,發現正負極的介金屬化合物(Intermetallic簡稱IMC)成長快速,而且很快向外擴散,並且把Ni,Cu基材完全反應變成IMC。
  錫球內部經過電子流的影響後,Pb漸漸往正極聚集,造成Pb累積在正極,而在負極的Pb大量減少,在SnPb錫球內明顯可以看出電子遷移的現象。每一個錫球因為SnPb分佈不同,所以最後造成錫球內SnPb的pattern也不一樣,部分錫球中的Pb會大量移動,部分錫球只有少部分的移動,其原因值得探討。
2. 通電流之無鉛BGA
  比較通電與沒有通電的BGA試片,發現通電流的IMC成長比較快速,這可能是因為通過電流的錫球溫度比較高以及電流的影響,造成IMC的成長加速。其餘在正負極的IMC比較上並沒有明顯差異,都是先成長(Ni,Cu)3Sn4再成長(Cu,Ni)6Sn5。
3. BGA掉球及環狀圖樣(ring pattern)之研究
  本論文中,觀察許多無鉛SnAgCu掉球的試片,包括掉球的基板還有脫落的錫球底部檢測,發現掉球的位置是在IMC與鍍Ni層之間。大部分掉球的基板上,只殘留少許的IMC,其餘部分為Ni,所以主要掉球的位置在IMC與Ni層之間。
  在無鉛BGA試片中含P與不含P的試片都有掉球的現象發生,因此,P不是影響掉球的主要因素。本論文中也發現大部分掉球試片表面都有環狀介金屬化合物(ring pattern),經過吃Sn腐蝕液處理後,發現沒有掉球現象的BGA試片也有ring pattern,因此可以知道ring pattern並非掉球的主要因素。在藉由partial wetting的reflow方式及吃Sn腐蝕液處理的一連串實驗後,得到ring pattern的形成機制。
  本論文主要是在探討BGA試片的可靠度與分析,因為目前BGA是電子封裝中很重要的一個部分。加上近年來為了保護環境,所以各國都朝向無鉛焊料發展,在BGA的焊料與基材結合研究中,也變成一個非常重要的課題。希望藉由本論文的研究與探討,能夠提升電子封裝產品的可靠度。
Abstract
none
目次 Table of Contents
摘要 ••••••••••••••••••••••••••••• Ⅰ
總目錄 •••••••••••••••••••••••••••• Ⅲ
表目錄 •••••••••••••••••••••••••••• Ⅵ
圖目錄 •••••••••••••••••••••••••••• Ⅶ
一、前言 ••••••••••••••••••••••••••• 1
1-1、研究背景 •••••••••••••••••••••••• 1
1-2、球矩陣排列封裝(Ball Grid Array Package,BGA) ••••• 1
1-3、焊料比較 •••••••••••••••••••••••• 2
  1-3-1、傳統鉛錫焊錫 •••••••••••••••••••• 2
  1-3-2、無鉛焊錫 •••••••••••••••••••••• 2
1-4、研究動機 •••••••••••••••••••••••• 3
二、文獻回顧 ••••••••••••••••••••••••• 5
2-1、傳統錫鉛焊錫 •••••••••••••••••••••• 6
  2-1-1、未通電之錫鉛焊料 •••••••••••••••••• 6
  2-1-2、通電之錫鉛焊料 ••••••••••••••••••• 9
2-2、無鉛焊錫 ••••••••••••••••••••••• 11
  2-2-1、未通電之無鉛焊料 ••••••••••••••••• 11
  2-2-2、通電之無鉛焊料 •••••••••••••••••• 15
2-3、焊錫接點的脆性破壞 •••••••••••••••••• 17
  2-3-1、錫鉛焊料之脆性破壞 •••••••••••••••• 17
  2-3-2、無鉛焊料之脆性破壞 •••••••••••••••• 18
三、實驗方法 ••••••••••••••••••••••••• 19
3-1、實驗目的 ••••••••••••••••••••••• 19
3-2、通電BGA試片 ••••••••••••••••••••• 19
  3-2-1、BGA(Ball-Grid Array)試片製作與分類 ••••••• 19
  3-2-2、通電實驗步驟 ••••••••••••••••••• 22
  3-2-3、製作Cross Section試片 •••••••••••••• 24
3-3、通電之SnPb wire •••••••••••••••••••• 24
  3-3-1、製作SnPb wire ••••••••••••••••••• 24
  3-3-2、製作Cross Section試片 •••••••••••••• 25
3-4、掉球試片及ring pattern •••••••••••••••• 25
  3-4-1、掉球試片準備及分類 •••••••••••••••• 25
  3-4-2、製作掉球試片 ••••••••••••••••••• 26
  3-4-3、製作ring pattern試片 ••••••••••••••• 27
3-5、儀器準備 ••••••••••••••••••••••• 28
3-6、試片分析 ••••••••••••••••••••••• 28
四、 實驗結果 •••••••••••••••••••••••• 30
4-1、未通電錫球 •••••••••••••••••••••• 30
4-1-1、未通電流之含Pb錫球 •••••••••••••••• 30
   4-1-1-A、Cross Section  •••••••••••••••• 30
   4-1-1-B、介金屬化合物成分分析 ••••••••••••• 31
   4-1-1-C、成分擴散行為 ••••••••••••••••• 32
4-1-2、未通電流之無Pb錫球 •••••••••••••••• 33
4-1-2-A、Cross Section ••••••••••••••••• 33
4-1-2-B、介金屬化合物成分分析 ••••••••••••• 34
4-1-2-C、成分擴散行為 ••••••••••••••••• 35
4-2、電流試驗 ••••••••••••••••••••••• 36
4-2-1、通電流之含Pb錫球 ••••••••••••••••• 39
4-2-1-A、Cross Section ••••••••••••••••• 39
4-2-1-B、介金屬化合物成分分析 ••••••••••••• 40
4-2-1-C、成分擴散行為 ••••••••••••••••• 42
4-2-2、通電流之無Pb錫球 ••••••••••••••••• 43
4-2-2-A、Cross Section ••••••••••••••••• 43
4-2-2-B、介金屬化合物成分分析 ••••••••••••• 44
4-2-2-C、成分擴散行為 ••••••••••••••••• 45
4-3、掉球試片及ring pattern •••••••••••••••• 46
4-3-1、掉球之BGA試片 •••••••••••••••••• 46
4-3-1-A、基底的分析 •••••••••••••••••• 47
4-3-1-B、掉落錫球底部分析 ••••••••••••••• 47
4-3-1-C、基底與錫球底部的綜合比較 ••••••••••• 47
4-3-2、ring pattern ••••••••••••••••••• 48
4-3-2-A、腐蝕錫球行為分析 •••••••••••••••• 48
4-3-2-B、腐蝕後的超音波震動 •••••••••••••• 49
4-3-2-C、無鉛錫球的部分融化設計 ••••••••••••• 51
五、 實驗討論 ••••••••••••••••••••••••• 53
5-1、未通電錫球 ••••••••••••••••••••••• 53
5-1-1、未通電流之含Pb錫球 •••••••••••••••• 53
5-1-2、未通電流之無Pb錫球 •••••••••••••••• 54
5-2、電流試驗 ••••••••••••••••••••••• 55
5-2-1、通電流之含Pb錫球 ••••••••••••••••• 56
  5-2-2、通電流之無Pb錫球 ••••••••••••••••• 60
5-3、5-1與5-2的綜合比較 •••••••••••••••••• 61
5-4、掉球試片及ring pattern •••••••••••••••• 62
5-4-1、掉球之BGA試片 ••••••••••••••••••• 62
5-4-2、ring pattern ••••••••••••••••••• 63
六、實驗結論 ••••••••••••••••••••••••• 67
七、參考文獻 ••••••••••••••••••••••••• 69
表目錄 80~82
表圖目錄 83 ~ 118
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