本研究使用磨粒焊接試驗機將具有銅鍍層之直徑500 μm鑽石顆粒焊接於鋁工件表面間。使用直流電源供應器做為焊接能量，並運用於電極與鑽石顆粒間所介入之電阻材料於通電期間作為主要發熱體，將此能量藉由鑽石顆粒傳入鋁工件表面，使鋁工件軟化之同時將鑽石顆粒壓入。本實驗探討在施力2 ~ 20 N，發熱功率13 ~ 35 W之條件下，焊接範圍形態及焊接界面行為。
以碳化矽之電阻材料的發熱作為焊接熱源而言，可建立由施力、發熱功率所組成之焊接形態圖。此焊接形態圖分為無效焊接區、合適焊接區以及焊接品質不良區。無效焊接區係在 發熱功率約 20 W以下。鑽石顆粒無法充分壓入鋁工件表面中，是由於發熱功率不足所致。合適焊接區係在 發熱功率20 ~ 30 W，焊接品質佳。焊接品質不良區係發熱功率在30 W以上，因鋁工件表面產生氣泡、氣孔，焊接品質差。在合適焊接區中，可由焊接期間之力量變化來控制鑽石顆粒壓入鋁工件表面之深度。

In this study, a particle welding tester has been employed to weld the 500 μm diamond particle coated copper on the aluminum workpiece surface. The DC power supply is used as the welding energy to weld. The resistance material is added into the interface between the electrode and the diamond particle. Hence the welding energy can transfer from the diamond particle to aluminum surface so that the aluminum softens and the diamond particle is embedded into the surface under the applied force. In this experiment, the effects of the applied force (2-20 N), power (13-35 W) on the welding pattern and the behavior of welding interface.
When the silicon carbide is used as the resistance material, the weld able region map is established in terms of the applied force and power. The map is divided into the insufficient heat input, the normal welding and the excess heat input. In the insufficient heat input region the power is less than 20 W, and the diamond can not be embed into the workpiece surface because the power is not enough. In the normal welding region, the power is in the range between 20 to 30 W, where the welding quality is quite good. In the excess heat input region, the power is greater than 30 W, where the welding quality is poor because the blowhole and the gas hole are generated on the surface. In the normal welding region, the embedded depth can be controlled by the different force during welding process.

封面 I
學位論文審定書 II
謝誌 III
總目錄 IV
圖目錄 VI
表目錄 XIII
摘要 XIV
Abstract XV
第一章 緒論 1
1-1 研究動機與目的 1
1-2 文獻回顧 2
1-2-1 鑽石工具製作法之相關文獻 2
1-2-2 優良鑽石工具應有的特點之相關文獻 6
1-2-3 無電鍍法之典型研究文獻 10
1-3 論文重點 11
1-4 論文架構 11
第二章 實驗設備與實驗方法 12
2-1 實驗設備 12
2-1-1 磨粒焊接試驗機 12
2-1-2 資料收集分析與實驗訊號量測設備 15
2-2 實驗方法 16
2-2-1 實驗材料 16
2-2-2 試片處理 20
2-2-3 實驗條件設定 23
2-2-4 實驗步驟 24
第三章 結果與討論 26
3-1 以鑽石顆粒與鋁表面間之電阻為焊接熱源 26
3-2 以電阻材料之電阻熱為焊接熱源 30
3-2-1 矽為電阻材料 31
3-2-2 碳化矽為電阻材料 36
3-3 以碳化矽為電阻材料之發熱功率與電流的關係 42
3-4 以碳化矽為電阻材料之基本焊接界面行為模式與現象 45
3-5 以碳化矽為電阻材料在不同施力與發熱功率之效應 55
3-5-1 施力2 N 55
3-5-2 施力10 N 59
3-5-3 施力20 N 69
3-5-4 焊接形態圖 75
3-6 焊接期間力量變化與鑽石顆粒下壓量之關係 77
3-7 無熱源下之直接壓入法 85
第四章 結論 87
未來研究方向 88
參考文獻 89

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