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論文名稱 Title |
具高品質因子之懸浮式微型電感器設計與製作 Design and Fabrication of High Quality-factor Suspending Microinductors |
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系所名稱 Department |
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畢業學年期 Year, semester |
語文別 Language |
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學位類別 Degree |
頁數 Number of pages |
82 |
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研究生 Author |
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指導教授 Advisor |
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召集委員 Convenor |
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口試委員 Advisory Committee |
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口試日期 Date of Exam |
2008-07-18 |
繳交日期 Date of Submission |
2008-08-27 |
關鍵字 Keywords |
面型微加工技術、低損耗、高品質因子、懸浮式微型電感器 Suspending Micro-inductor, Low Power Dissipation, High Quality Factor, Surface Micromachining |
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統計 Statistics |
本論文已被瀏覽 5705 次,被下載 8 次 The thesis/dissertation has been browsed 5705 times, has been downloaded 8 times. |
中文摘要 |
針對4G 無線通訊系統之應用,本論文致力於開發一種具高品質 因子(High-quality-factor)與低損耗(Low-power-dissipation)之懸浮式微 型電感器(Suspending micro-inductor),主要運用的製程技術為電化學 沉積與面型微加工技術。 為了提升懸浮式微型電感器之品質因子與降低其能量損耗,本論 文提出下列三種方法:(i)採用較低電阻之銅薄膜做為元件之導線材 料,藉此可減少集膚效應(Skin effect)所產生的渦電流(Eddy current), 如此可降低導線之串聯電阻值以減少能量損耗;(ii)利用懸浮結構之 設計以減少基板的能量損耗;(iii)採用康寧玻璃基板(Corning 7740)取 代矽基板,以大幅降低元件於高頻操作時之能量損耗。 本論文所研發完成的懸浮式微型電感器,其高頻特性(0.5~20GHz) 是藉由商用網路分析儀(Agilent E5071C)所量測而得;所有量測的數 據(包含電感值與品質因子)皆進一步透過Agilent ADS 軟體萃取與分 析。最佳化的懸浮式微型電感器之品質因子高達24.9 左右且其相對 應之電感值為5.43 nH。 |
Abstract |
For the application of 4G wireless communication system, this thesis aims to develop a high-quality-factor and low-power-dissipation suspending micro-inductor using electrochemical deposition and surface micromachining technologies. This research presents three technical points to improve the quality factor and reduce the power dissipation of micro inductor, including (i) to adopt a low resistivity material (copper) as the conducting layer to decrease the Eddy current due to the skin effect and reduce the total series resistance and energy loss, (ii) to utilize a suspending structure to diminish the power loss through the substrate and (iii) to replace the silicon wafer with a high resistance substrate (Corning 7740) to compress effectively the power dissipation in high frequency operation. The implemented suspending micro-inductors were characterized by a commercial network analyzer (Agilent E5071C) under 0.5~20 GHz testing frequency range. All the inductances and quality factors of the micro-inductors proposed in this thesis are extracted by the Agilent ADS software. The optimized value of the quality factor is around to 24.9 and the corresponding inductance is equal to 5.43 nH . |
目次 Table of Contents |
摘要 ..................................................................................................... I ABSTRACT .............................................................................................II 誌謝 .................................................................................................. III 目錄 .................................................................................................. IV 圖目錄 .................................................................................................. VI 表目錄 ................................................................................................... X 第一章 緒論......................................................................................... 1 1-1 前言................................................................................................ 1 1-2 文獻回顧與研究動機.................................................................... 3 1-3 實驗方法與論文架構.................................................................... 6 第二章 元件原理與材料特性介紹..................................................... 7 2-1 懸浮式微型電感器之理論............................................................ 7 2-2 懸浮式微型電感器品質因子之影響因素.................................... 9 2-3 懸浮式微型電感器之自我共振頻率.......................................... 13 2-4 懸浮式微型電感器之集膚效應與輻射性損耗.......................... 15 2-5 銅之材料特性與銅薄膜圖形製版技術...................................... 17 第三章 元件設計與製作流程........................................................... 19 3-1 電化學銅薄膜沉積原理介紹與最佳化參數.............................. 19 3-2 懸浮式微型電感器之佈局與結構設計...................................... 21 3-3 懸浮式微型電感器之製程整合.................................................. 23 3-3-1 製作流程..........................................................................23 3-3-2 製程步驟與參數..............................................................24 3-4 實驗設備規格.............................................................................. 31 第四章 結果與討論........................................................................... 37 4-1 實驗結果與討論.......................................................................... 37 4-1-1 氮化鉭/鉭/銅(TaN/Ta/Cu)之底電極掀離開發..............37 4-1-2 銅薄膜之表面微結構與組成分析..................................39 4-1-3 懸浮式微型電感器之SEM 圖結構分析.......................43 4-2 懸浮式微型電感器之電性分析.................................................. 47 4-2-1 懸浮式微型電感器之電感值量測與分析.....................47 4-2-2 懸浮式微型電感器之品質因子量測與分析.................57 第五章 結論與建議........................................................................... 65 5-1 結論.............................................................................................. 65 5-2 建議.............................................................................................. 67 參考文獻.............................................................................................. 68 |
參考文獻 References |
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