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博碩士論文 etd-0831109-145122 詳細資訊
Title page for etd-0831109-145122
論文名稱
Title
低驅動電壓電容式微機電麥克風之開發
Development of Low-driving-voltage Capacitive MEMS Microphone
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
81
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2009-07-11
繳交日期
Date of Submission
2009-08-31
關鍵字
Keywords
低驅動電壓、聚亞醯胺背板結構、電容式微機電麥克風、面型與體型微加工技術
Low driving voltage, Polyimide backplate microstructure, Surface and bulk micromachining technologies, Capacitive MEMS microphone
統計
Statistics
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中文摘要
因應目前行動電話、筆記型電腦、助聽器及個人數位助理(PDA)等產品尺寸日漸縮減以及功能逐漸增強,傳統的駐極體電容式麥克風(Electret Condenser Microphone, ECM)將越來越無法滿足這些可攜式電子產品的需求,所以如何利用微機電系統(MEMS)技術,研發出具有可微型化、高品質與低成本等特性之微型麥克風已是勢在必行。
本論文運用面型與體型微加工之MEMS製程技術,完成一種具有聚亞醯胺背板(Polyimide backplate)結構之電容式MEMS麥克風的開發,其主要製程步驟包括五次黃光微影(Photolithography)與七次薄膜沉積的製程。本論文所設計之低應力氮化矽/多晶矽/氮化矽懸浮薄膜聲壓感測面積與麥克風上下電極間距分別為2×2 mm2與2 μm。
本論文開發之MEMS麥克風是在特殊的無響箱中量測其頻率響應,在音源頻率為1 kHz下,只須外加3伏特之偏壓即可獲得-60.3 dB/Pa的靈敏度(已扣除前級放大器的22.6 dB增益輸出)以及51 dB之訊雜比(Signal to noise ratio, SNR);以上所顯示之極低的驅動電壓、適中之訊雜比與聲壓感測靈敏度等特性,接近於國內外相關一流研究單位之成果。
Abstract
To achieve the miniaturization and high performance of the mobile phone, notebook, hearing aid and personal digital assistant (PDA), many researchers focus on the developing a new-type microphone with very small dimension, high quality and low manufacturing cost utilizing MEMS technology.
By using the surface and bulk micromachining technologies, this thesis designed and fabricated a capacitive MEMS microphone with a polyimide bcakplate microstructure. The main processing steps adopted in this study include five photolithoghaphies and seven thin-film depositions. A MEMS-based microphone with an only 2×2 mm2 sensing area of the floating Si3N4/Poly-Si/Si3N4 membrane and a 2 μm-height gap distance between the top and bottom electrodes was implemented and characterized.
Measured in a special isolated-box and under 1 kHz audio frequency, a -60.3 dB/Pa sensitivity (deducted the 22.6 dB output gain of the pre-amplifier) and a 51 dB signal to noise ratio (SNR) of the implemented MEMS microphone can be obtained as the biasing voltage only about 3 volts. The very low driving voltage, moderate SNR and sensitivity demonstrated in this work keep abreast with the results of many outstanding research laboratories in the world.
目次 Table of Contents
摘要.............................................................................................................I
Abstract......................................................................................................II
誌謝..........................................................................................................III
目錄..........................................................................................................IV
圖目錄......................................................................................................VI
表目錄................................................................................................VIII
第一章 緒論..............................................................................................1
1-1 前言..............................................................................................1
1-2 研究動機......................................................................................4
第二章MEMS麥克風之原理介紹...........................................................6
2-1 MEMS麥克風之種類...................................................................6
2-1-1壓電式MEMS麥克風........................................................6
2-1-2壓阻式MEMS麥克風........................................................7
2-1-3電容式MEMS麥克風........................................................8
2-2 電容式MEMS麥克風之研究.....................................................9
2-2-1 理論分析.....................................................................11
2-2-2 聚亞醯胺材料特性.........................................................17
第三章 元件設計與製作流程................................................................23
3-1 電容式MEMS麥克風之光罩佈局設計...................................23
3-2 電容式MEMS麥克風之製程整合設計……...........................25
3-2-1 電容式MEMS麥克風製作流程....................................25
3-2-2 詳細製程步驟與參數......................................................27
第四章 結果與討論................................................................................35
4-1 結構分析........................................................................35
4-1-1 聚亞醯胺背板烘烤溫度分析.........................................35
4-1-2 鋁犧牲層釋放結構分析.................................................37
4-2元件特性分析......................................................................39
4-2-1 電容-電壓(C-V)量測.......................................................39
4-2-2 頻率響應量測.................................................................44
第五章 結論與未來展望........................................................................54
5-1 結論............................................................................................54
5-2 未來展望....................................................................................55
參考文獻..................................................................................................57
附錄..................................................................................................60
參考文獻 References
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