論文使用權限 Thesis access permission:校內校外均不公開 not available
開放時間 Available:
校內 Campus:永不公開 not available
校外 Off-campus:永不公開 not available
論文名稱 Title |
低驅動電壓電容式微機電麥克風之開發 Development of Low-driving-voltage Capacitive MEMS Microphone |
||
系所名稱 Department |
|||
畢業學年期 Year, semester |
語文別 Language |
||
學位類別 Degree |
頁數 Number of pages |
81 |
|
研究生 Author |
|||
指導教授 Advisor |
|||
召集委員 Convenor |
|||
口試委員 Advisory Committee |
|||
口試日期 Date of Exam |
2009-07-11 |
繳交日期 Date of Submission |
2009-08-31 |
關鍵字 Keywords |
低驅動電壓、聚亞醯胺背板結構、電容式微機電麥克風、面型與體型微加工技術 Low driving voltage, Polyimide backplate microstructure, Surface and bulk micromachining technologies, Capacitive MEMS microphone |
||
統計 Statistics |
本論文已被瀏覽 5660 次,被下載 0 次 The thesis/dissertation has been browsed 5660 times, has been downloaded 0 times. |
中文摘要 |
因應目前行動電話、筆記型電腦、助聽器及個人數位助理(PDA)等產品尺寸日漸縮減以及功能逐漸增強,傳統的駐極體電容式麥克風(Electret Condenser Microphone, ECM)將越來越無法滿足這些可攜式電子產品的需求,所以如何利用微機電系統(MEMS)技術,研發出具有可微型化、高品質與低成本等特性之微型麥克風已是勢在必行。 本論文運用面型與體型微加工之MEMS製程技術,完成一種具有聚亞醯胺背板(Polyimide backplate)結構之電容式MEMS麥克風的開發,其主要製程步驟包括五次黃光微影(Photolithography)與七次薄膜沉積的製程。本論文所設計之低應力氮化矽/多晶矽/氮化矽懸浮薄膜聲壓感測面積與麥克風上下電極間距分別為2×2 mm2與2 μm。 本論文開發之MEMS麥克風是在特殊的無響箱中量測其頻率響應,在音源頻率為1 kHz下,只須外加3伏特之偏壓即可獲得-60.3 dB/Pa的靈敏度(已扣除前級放大器的22.6 dB增益輸出)以及51 dB之訊雜比(Signal to noise ratio, SNR);以上所顯示之極低的驅動電壓、適中之訊雜比與聲壓感測靈敏度等特性,接近於國內外相關一流研究單位之成果。 |
Abstract |
To achieve the miniaturization and high performance of the mobile phone, notebook, hearing aid and personal digital assistant (PDA), many researchers focus on the developing a new-type microphone with very small dimension, high quality and low manufacturing cost utilizing MEMS technology. By using the surface and bulk micromachining technologies, this thesis designed and fabricated a capacitive MEMS microphone with a polyimide bcakplate microstructure. The main processing steps adopted in this study include five photolithoghaphies and seven thin-film depositions. A MEMS-based microphone with an only 2×2 mm2 sensing area of the floating Si3N4/Poly-Si/Si3N4 membrane and a 2 μm-height gap distance between the top and bottom electrodes was implemented and characterized. Measured in a special isolated-box and under 1 kHz audio frequency, a -60.3 dB/Pa sensitivity (deducted the 22.6 dB output gain of the pre-amplifier) and a 51 dB signal to noise ratio (SNR) of the implemented MEMS microphone can be obtained as the biasing voltage only about 3 volts. The very low driving voltage, moderate SNR and sensitivity demonstrated in this work keep abreast with the results of many outstanding research laboratories in the world. |
目次 Table of Contents |
摘要.............................................................................................................I Abstract......................................................................................................II 誌謝..........................................................................................................III 目錄..........................................................................................................IV 圖目錄......................................................................................................VI 表目錄................................................................................................VIII 第一章 緒論..............................................................................................1 1-1 前言..............................................................................................1 1-2 研究動機......................................................................................4 第二章MEMS麥克風之原理介紹...........................................................6 2-1 MEMS麥克風之種類...................................................................6 2-1-1壓電式MEMS麥克風........................................................6 2-1-2壓阻式MEMS麥克風........................................................7 2-1-3電容式MEMS麥克風........................................................8 2-2 電容式MEMS麥克風之研究.....................................................9 2-2-1 理論分析.....................................................................11 2-2-2 聚亞醯胺材料特性.........................................................17 第三章 元件設計與製作流程................................................................23 3-1 電容式MEMS麥克風之光罩佈局設計...................................23 3-2 電容式MEMS麥克風之製程整合設計……...........................25 3-2-1 電容式MEMS麥克風製作流程....................................25 3-2-2 詳細製程步驟與參數......................................................27 第四章 結果與討論................................................................................35 4-1 結構分析........................................................................35 4-1-1 聚亞醯胺背板烘烤溫度分析.........................................35 4-1-2 鋁犧牲層釋放結構分析.................................................37 4-2元件特性分析......................................................................39 4-2-1 電容-電壓(C-V)量測.......................................................39 4-2-2 頻率響應量測.................................................................44 第五章 結論與未來展望........................................................................54 5-1 結論............................................................................................54 5-2 未來展望....................................................................................55 參考文獻..................................................................................................57 附錄..................................................................................................60 |
參考文獻 References |
[1] 「微機電系統技術與應用」 ,行政院國家科學委員會精密儀器發展中心出版,2003。 [2] P.R. Scheeper, A.G. van der Donk, W. Olthuis, and P. Bergveld,” A View of Silicon Microphones,” Sensors and Actuators A, vol. 44, pp.1-11, 1994. [3] G.M. Sessler,” Acoustic Sensor,” Sensors and Actuators A, vol.25-27, pp.323-330, 1991. [4] M. Royer, J.O. Holmen, M.A. Wurm, O.S. Aadland, and M. Glenn, "ZnO on Si Integrated Acoustic Sensor", Sensors and Actuators A, vol.4, pp.357-362, 1983. [5] R. Schellin and G. Hess,"A Silicon Subminiature Microphone Based on Piezoresistive Polysilicon Strain Gauges", Sensors and Actuators A, vol.32, pp.555-559, 1992. [6] D. Hohm and R. Gerhard-Multhaupt, "Silicon-dioxide Electret Transducer", J. Acou. Soc. Am, pp.1297-1298, 1984. [7] A.J. Sprenkels, R.A. Groothengel, A.J. Verloop and P. Bergveld, "Development of an Electret Microphone in Silicon", Sensors and Actuators A, pp.509-512, 1989. [8] P.R. Scheeper, A.G.H. van der Donk, W. Olthuis, and P. Bergveld, "Fabrication of Silicon Condenser Microphone Using Single Wafer Technology", J. Microelectromech. Syst. vol. 1,no. 3, 1992. [9] Patrick R. Scheeper, Wouter Olthuis, and Piet Bergveld, "The Design, Fabrication, and 69 Testing of Corrugated Silicon Nitride Diaphragms", J. Microelectromech. Syst., vol.3, no.1, pp.36-42, 1994. [10] P.-C. Hsu, C.H. Mastrangelo, and K.D. Wise, "A High Sensitivity Polysilicon Diaphragm Condenser Microphone , Center for Integrated Sensors and Circuits", Department of Electrical Engineering and Computer Science, USA, 1998. [11] J.J. Bernstein and J.T. Borenstein, "A Micromachined Silicon Condenser Microphone with On-chip Amplifier, Solid-state Sensor and Actuator Workship, pp.239-243, 1996. [12] W. Kuhnel and G. Hess, "A Silicon Condenser Microphone with Structured Backplate and Silicon Nitride Membrane", Sensors and Actuators A, vol.30, pp.251-258, 1992. [13] M. Pedersen, W. Olthuis, and P. Bergveld, "A Silicon Condenser Microphone with Polyimide Diaphragm and Backplate", Sensors and Actuators A, pp.97-104, 1997. [14] P. Rombach, M. Miillenborn, U. Klein and K. Rasmussen, "The First Low Voltage, Low Noise Differential Silicon Microphone, Technology Development and Measurement Results.” IEEE International Micro Electro Mechanical Systems Conference, pp.42-45, 2001. [15] J. Bergqvist and F. Rudolf, “A Silicon Condenser Microphone Using Bond and Etchback Technology”, Sensors and Actuators A, vol.45, pp.115-124, 1994. [16] W. Kuhnel and G. Hess,”A Silicon Condenser Microphone with Structured Backplate and Silicon Nitride Membrane", Sensors and Actuators A, vol.30, pp.251-258 , 1992. [17] Z. Skvor, "On the Acoustical Resistance due to Viscous Losses in the Air Gap of Electrostatic Transducers, Acustica, pp.295-299, 1967. [18] J. Bergqvist, “Finite-element Modelling and Characterization of a Silicon Condenser Microphone with a Highly Perforated Backplate", Sensors and Actuators A, vol.39, pp.191-200, 1993. [19] P. Bergveld, “The Merit of Using Silicon for the Development of Hearing Aid Microphones and Intraocular Pressure", Sensors and Actuators A, vol.41-42, pp.223-229, 1994. [20] 周森,「複合材料-奈米、生物科技」,全威圖書有限公司。 [21] HD Microsystem, Pyralin PI-4100 Processing Guidelines. [22] HD 4100 series General Introduction. [23] http://www.national.com/mpf/LM/LMV1012.html |
電子全文 Fulltext |
本電子全文僅授權使用者為學術研究之目的,進行個人非營利性質之檢索、閱讀、列印。請遵守中華民國著作權法之相關規定,切勿任意重製、散佈、改作、轉貼、播送,以免觸法。 論文使用權限 Thesis access permission:校內校外均不公開 not available 開放時間 Available: 校內 Campus:永不公開 not available 校外 Off-campus:永不公開 not available 您的 IP(校外) 位址是 54.173.214.79 論文開放下載的時間是 校外不公開 Your IP address is 54.173.214.79 This thesis will be available to you on Indicate off-campus access is not available. |
紙本論文 Printed copies |
紙本論文的公開資訊在102學年度以後相對較為完整。如果需要查詢101學年度以前的紙本論文公開資訊,請聯繫圖資處紙本論文服務櫃台。如有不便之處敬請見諒。 開放時間 available 已公開 available |
QR Code |