本研究是利用掃瞄式以及穿透式電子顯微鏡，探討氧化鋁單晶材料以維氏壓痕機在室溫施壓力之微結構變化，以及機械雙晶對氧化鋁微結構的影響。
藍寶石 (Sapphire) 是一種氧化鋁 (Al2O3) 單晶，又稱為剛玉(Corundum)，具有優良的機械、光學、化學以及抗輻射性質，近年來受到工業界廣泛的應用。
機械雙晶是氧化鋁塑性變形的主要形式，其有兩種形式，(1)基面雙晶 (basal twinning) (2)菱面雙晶 (rhombohedral twinning)，作者用維氏壓痕機以20 N施力於 (0001) 面時，在斷面產生基面雙晶B (0001)，菱面雙晶R1 ( 102) 、R1 ” ( 104) 。以20 N施力於 (1 10) 面時，在斷面產生基面雙晶B (0001)、B 1 ( 101) ，菱面雙晶R2 ( 012) 。
為了了解壓力方向在雙晶中所扮演的角色，本次的研究將探討在室溫不同的壓力方向，在掃瞄式以及穿透式顯微鏡觀察上，對於氧化鋁試片的雙晶(twinning)微結構產生何種影響和衍生出來的差排(dislocation)微結構。

The research has been analyzed by using scanning electron and transmission electron microscopy (SEM and TEM).To research microstructure in single crystal alumina induced by Vickers indentation and the effect of alumina microstructure induced by deformation twinning.
Sapphire is a kind of alumina single crystal called Corundum. It has fine machinery, optical, chemistry and anti-radiationary nature and been used widespread in industry world in recent years.
Mechanical twinning is the main mode of plastic deformation. It has two types (1) basal twinning (2) rhombohedral twinning. When author pressed 20 N on (0001) plane, it produces B (0001), R1 ( 102) and R1 ” ( 104) in cross- section. But when pressing 20 N in (1 10) plane, it produces B (0001), B 1 ( 101) and R2 ( 012) in cross-section.
In order to understand the role of pressure direction in twinning at room temperature, this research will discuss what effects will be produced twinning microstructure of alumina sample and derivation of dislocation microstructure by using scanning electron and transmission electron microscopy.

誌謝 II
摘要 III
Abstract IV
目 次 VI
圖 次 IX
表 次 XIV
第 一 章 簡介 1
1.1 緒論 1
1.2 研究目的 4
第 二 章 文獻回顧 5
2.1氧化鋁結構 (Structure of Al2O3) 5
2.2 赤鐵礦結構 (The structure of haematite) 16
2.3 雙晶 (Twin) 結構 22
2.4 氧化鋁的雙晶 (Twinnings in Al2O3) 25
2.5差排和滑移系統 37
2.6矽的裂痕尖端 (Crack tip in silicon) 39
第 三 章 實驗步驟 40
3.1 Sapphire試片 40
3.2 實驗流程 41
3.3 X–ray 繞射分析 43
3.4 硬度測定 43
3.5 破裂韌性測定 (Fracture Toughness) 44
3.6 光學顯微鏡 (OM) 與掃描式電子顯微鏡 (SEM) 45
3.7 穿透式電子顯微鏡 (TEM) 47
3.8 微觀缺陷觀察 48
3.9 原子力顯微鏡 (AFM) 49
3.10 背向散射電子繞射 (EBSD) 50
第 四 章 實驗結果 51
4.1 X-ray繞射分析 51
4.2 硬度分析 52
4.3從c面 (0001) 壓痕之研究 53
4.3.1表面微結構分析 53
4.3.2斷面微結構分析 56
4.4從a面 (1 10) 壓痕之研究 64
4.4.1斷面微結構分析 64
(a) 64
4.5缺陷分析 68
4.5.1微觀缺陷觀察與分析 68
4.6 AFM 結果 71
4.7 高解析原子影像及 FFT simulation 分析 77
第 五 章 討論 82
5.1 雙晶觀察 82
5.1.1 從c面壓痕 82
5.1.2 從a面壓痕 89
5.2 裂痕觀察 91
5.3 差排觀察 91
第 六 章 結論 92
第 七 章 未來工作 93
第 八 章 參考文獻 94
附錄 96
附錄 1 實驗中所研究結構於JCPDS-ICDD卡之相對資料 96
附錄 2氧化鋁結構 [0001] 方向上之立體投影圖 97
附錄 3 氧化鋁結構 [1 10] 方向上之立體投影圖 98
附錄 4 氧化鋁結構 [10 0] 方向上之立體投影圖 99
附錄 5 Hexagonal systems 100

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