本研究以富有創意的電鑄方法分別製作出直徑3mm厚度 0.2mm和直徑1mm厚度0.1mm之鑽石磨盤。以鎳錠為陽極。以插入ABS母模中的微小鎢鋼心軸以及塗抹在母模局部表面上的導電層為陰極。陰極與陽極置於含有鑽石顆粒之電解液中進行複合電鑄。在電流密度2.5ASD下，在母模中沈積出一定厚度的複合鍍層。使用丙酮溶液蝕除母模後，即可得到微型鑽石磨盤。本研究另外探討電鑄方法、鍍液配方與電流密度對鑽石磨盤品質之影響。
從實驗結果顯示使用外部循環泵浦擾動鍍液的情況下，鑽石磨盤表面之鑽石覆蓋率可達54.19%，最佳。使用胺基磺酸鎳鍍液所電鑄成形的鑽石磨盤表面平整性比使用硫酸鎳鍍液的情況佳。

In this study, two sizes of diamond grinding wheels which are the diameter of 3 mm with thickness of 0.2 mm and the diameter of 1 mm with thickness of 0.1 mm are fabricated by a creative composite electroforming method. The pure nickel metal is set as anode. The micro cylindrical bar of tungsten carbide acted as spindle of the micro diamond grinding wheel, which is inserted into the hole of ABS mold and the conducting layer pre-coated on the local surface of ABS mold are set as cathode. The nickel sulfate bath mixing a constant amount of diamond particle is selected as electrolyte bath. At the current density of 2.5 ASD, the nickel-diamond composite layer with a constant thickness is electrodeposited on the ABS mold. When the ABS mold is dissolved by using acetone liquid, then the nickel-diamond composite layer could be used as the micro diamond grinding wheel is obtained.
Moreover, in the study, the effects of electroforming method, composition of the electrolyte and current density on the surface quality of nickel-diamond composite layer are investigated. From the experiment results, it can be know that at the current destiny of 2.5 ASD, the covered area of diamond particle in this composite layer is 54.19% using the external hanging pump. And the flatness on the surface of this composite layer electroformed in the nickel sulfamate bath is better than that in nickel sulfate bath.

謝誌 III
總目錄 IV
圖目錄 IX
表目錄 XI
摘要 XII
Abstract XIII
第一章 緒論 1
1-1 前言 1
1-2 研究動機 2
1-3 文獻回顧 3
1-3-1 微型刀具製作方法 3
1-3-2 鎳基鑽石複合電鍍 4
1-4 本論文重點 5
1-5 本論文架構 5
第二章 理論基礎 6
2-1 電鍍 ( Electroplating ) 6
2-1-1電鍍液成分介紹 9
2-1-2離子在電解質溶液中的三種傳遞方式 12
2-1-3電鍍的結晶過程 13
2-1-4金屬陽極 14
2-1-5電雙層 15
2-1-6極化現象 16
2-1-7析出電位 17
2-2鎳金屬電鍍 18
2-2-1鎳的基本性質 18
2-2-2鎳鍍液的種類 19
2-3複合電鍍 21
2-3-1複合電鍍的形成機制 22
2-3-2複合電鍍的影響因素 25
2-4電鑄原理 27
第三章 實驗設備與方法 28
3-1實驗流程與規劃 28
3-2 實驗設備 30
3-2-1電鑄方法(一) 31
3-2-2電鑄方法(二) 32
3-2-3電鑄方法(三) 33
3-2-4電鑄方法(四) 34
3-2-5電鑄方法(五) 35
3-3實驗程序 38
(1) 母模材質選用與製作 38
(2) 母模前處理 38
(3) 心軸前處理 38
(4) 塗佈導電層 39
(5) 安裝套環(電鑄方法(三)、(四)、(五)使用) 39
(6) 延伸電鍍區設計(電鑄方法(五)使用) 39
(7) 鎳基複合電鑄 40
(8) 脫模 40
3-4實驗參數 42
3-5磨削測試設備 45
3-6使用儀器 47
3-7實驗步驟 48
3-7-1直徑3mm之鑽石磨盤 48
3-7-2直徑1mm之鑽石磨盤 49
第四章 結果與討論 50
4-1電鑄方法之影響 50
4-1-1電鍍方法(一) 51
4-1-2電鑄方法(二) 53
4-1-3電鑄方法(三) 55
4-1-4電鑄方法(四) 57
4-1-5電鑄方法(五) 60
4-2母模設計之影響 63
4-3母模在陰極位置之影響 65
4-3-1母模位置(一) 66
4-3-2母模位置(二) 67
4-3-3母模位置(三) 68
4-4電流密度之影響 70
4-5鍍液配方之影響 74
4-5-1硫酸鎳配方 74
4-5-2胺基磺酸鎳配方 77
4-6 磨削測試 79
4-5-1磨削測試-紅銅 79
4-5-2磨削測試-玻璃 79
第五章 結論 82
5-1 結論 82
5-2 未來展望與研究方向 83
參考文獻 84

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