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博碩士論文 etd-0902110-165314 詳細資訊
Title page for etd-0902110-165314
論文名稱
Title
抓舉致動式微型馬達之設計與製作
Design and Fabrication of SDA-based Micromotor
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
90
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2010-07-31
繳交日期
Date of Submission
2010-09-02
關鍵字
Keywords
微馬達、微機電系統、抓舉致動式微型馬達
MUMPs, SDA μ-motor, MEMS, Micromotor
統計
Statistics
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中文摘要
本論文之研究目的為設計與製作抓舉致動式微型馬達(Scratch Drive Actuator Micromotor, SDA μ-motor),論文中採取三種新型結構設計,此三種結構分別為(1)外環式上蓋結構;(2)凸緣式上蓋結構;(3)凸緣式肋骨結構。為了驗證本論文所設計SDA μ-motor結構之可行性,本論文先透過MEMSCAP公司的多人共用微機電製程(Multi-User MEMS Processes, MUMPs)製作出SDA μ-motor元件並進行量測,經由實驗結果得知,凸緣式上蓋結構之SDA μ-motor操作頻率為100 Hz,電壓加至75 Vop時,SDA之平板產生明顯振動,並於電壓達100 Vop正弦波時開始轉動;另外,環式上蓋結構及凸緣式肋骨結構之SDA平板僅產生振動現象,但具此結構之SDA μ-motor並無轉動現象發生,其推論原因為後者之摩擦力過大所致。綜上所論,本論文証明具凸緣式上蓋結構設計之SDA μ-motor具有較佳的轉動特性。
本論文的第二個研究目標是將MUMPs製程驗證過可行的SDA μ-motor之設計,運用國內實驗設備建立台灣可以掌控的SDA μ-motor製程整合技術平台,本研究共設計有8道黃光微影製程,所開發之SDA μ-motor之Run Card製程步驟約為62個,其中是以第3道與第5道黃光微影製程的微型突點(Dimple)/軸稱(Bushing)精密對準,以及第6道黃光微影製程後之錨座(Anchor)接觸窗口蝕刻為元件是否成功運轉的最重要關鍵製程所在。雖然台灣自行開發之SDA μ-motor製程技術平台尚未達到高良率的境界,但是完整的製程模組開發與整合已經透過本論文之研究而具體呈現。
Abstract
This thesis presents three kinds of novel structural design of SDA-based micromotors(μ-motors), including out-side cover structure, flange cover structure and flange rib structure. In order to verify the feasibility of these structures, the device is fabricated by MUMPs micro-electro-mechanical system (MEMS) foundry. According to the experimental results, SDA μ-motor of flange cover structure is comparatively more ideal than the other structures. The ideal structure operates at 100 Hz when the voltage is added to 75 Vop, which results in resonant vibration on the SDA plate, and begins to rotate when the voltage reaches 100 Vop.
The secondary goal of this thesis is using SDA μ-motor of flange cover structure to build surface micromachining process integration. The fabrication processes include eight photolithography masks, and the total fabrication procedure takes 62 steps. According to the experimental result, the device is made and succeeded or not, except that receiving the alignment technology influences, etching phosphorus silicon glass to define anchor is also an important process. Though processing technology of SDA μ-motor researched and developed by Taiwan has not reached high yield yet, but intact process module develop and integration has already appeared specifically through the research of this thesis.
目次 Table of Contents
摘要...................................................................................................................... I
英文摘要........................................................................................................... III
誌謝................................................................................................................... IV
目錄.................................................................................................................... V
圖目錄............................................................................................................. VIII
表目錄.............................................................................................................. XII
第一章 緒論........................................................................................................1
1-1 前言............................................................................................................1
1-2 研究動機....................................................................................................4
1-3 文獻回顧....................................................................................................5
1-4 研究目標....................................................................................................7
第二章 原理與設計............................................................................................8
2-1 SDA 致動原理[7] .....................................................................................8
2-2 電池-電容系統中的能量........................................................................13
2-2-1 平行板電容.......................................................................................14
2-2-2 扇型排列電容...................................................................................16
2-3 MUMPs 製程設計規範(Design rules)....................................................18
2-4 抓舉致動式微型馬達設計......................................................................19
2-4-1 結構設計...........................................................................................21
(A) 上蓋凸緣結構...................................................................................21
(B) 肋骨凸緣結構...................................................................................22
(C) 環狀式上蓋結構...............................................................................22
2-4-2 形狀設計...........................................................................................23
(A) 導角的設計.......................................................................................23
(B) 平板形狀設計...................................................................................24
2-5 L-edit 製程模擬與結構模擬...................................................................25
第三章 MUMPs 製程簡介與自行開發製程之步驟..................................... 27
3-1 MUMPs 共用製程[7]..............................................................................27
3-1-1 MUMPs 薄膜沉積............................................................................27
(A) 矽基材、氮化矽與第零層多晶矽...................................................28
(B) 第一層氧化矽、第一層多晶矽與第二層氧化矽...........................30
(C) 第二層多晶矽與金屬層...................................................................32
3-2 自行開發製程之步驟..............................................................................34
3-2-1 元件製作流程...................................................................................34
3-2-2 元件製程步驟...................................................................................36
3-3 國內製程設備..........................................................................................53
第四章 結果與分析..........................................................................................59
4-1 MUMPs 結果...........................................................................................60
4-2 自行開發製程之靜態OM 圖.................................................................64
4-2 自行開發製程之靜態SEM 圖...............................................................68
4-3 動態錄影圖..............................................................................................69
第五章 結論與未來展望..................................................................................71
5-1 結論.........................................................................................................71
5-2 未來展望.................................................................................................72
參考文獻............................................................................................................73
參考文獻 References
[1] 楊啟榮, “微機電系統技術與應用”, pp. 142, 2003.
[2] J. Zhu, T. Akiyama, K. Shono, “A Micro Step Motion of Polysilicon Structures on Silicon Substrate,” Electronic Manufacturing Technology Symposium, Proceedings of 1993 Japan International pp.85 - 88 , 1993.
[3] T. Akiyama, K. Shono, “Controlled Stepwise Motion in Polysilicon Microstructures,” IEEE,Vol.2, Issue.3 pp.106-110, 1993.
[4] T. Akiyama, D. Collard, H. Fujita, “Scratch Drive Actuator with Mechanical Links for Self-Assembly of Three-Dimensional MEMS,” IEEE, Vol. 6, Issue.1, pp.10 – 17, 1997.
[5] R. J. Linderman, V. M. Bright, “Optimized Scratch Drive Actuator or Tethered Nanometer Positioning of Chip-Sized Components,” Solid-state Sensor and Actuator Workshop Hilton Head Island, South Carolina, June 4-8, 2000.
[6] R. J. Linderman, P. E. Kladitis, V. M. Bright, “Development of the Micro Rotary Fan,” Sensors and Actuators A, Vol. 95, pp.135-142, 2002.
[7] 黃建誌, “結合微撓性機構應用於光切換器之靜電抓爬式致動器分析與設計,” 國立清華大學碩士論文, 2001.
[8] 吳嘉昱, “微抓舉式致動器之研究,” 國立清華大學碩士論文, 2002.
[9] 殷宏林, “陣列式自組裝三維微結構之研究,” 國立清華大學碩士班論文, 2001.

[10] J. Carter, A. Cowen, B. Hardy, R. Mahadevan, M. Stonefield, and S.Wilcenski, “PolyMUMPs Design Handbook revision 11,” Cronos Integrated Microsystems, 2001.
[11] 陳冠銘, “微抓舉式致動器應用於微型馬達上之模擬與設計,” 國立中山大學碩士班論文, 2007.
[12] H. Fujita, 1989, “Microactuators for Micro-motion System,” The Third Toyota Conference, pp.279-295
[13] L. Li, J.G. Brown, D. Uttamchandani, “Flexing of Scratch Drive Actuator Plates: Modeling and Experimentation,” IEEE Proc.-Sci- Meas. Technol, Vol.151, No.3, May 2004.
[14] R. J. Linderman, V. M. Bright, “Nanometer Precision Positioning Robots Utilizing Optimized Scratch Drive Actuators,” Sensors and Actuators A , Vol.91, pp.292-300, 2001.
[15] T. Akiyama, K. Shono, “A New Step Motion of Polysilicon Microstructures,” IEEE, pp.272 – 277, 7-10 Feb. 1993.
[16] P. Langlet, D. Collard, T. Akiyama, H. Fujita, “A Quantitative Analysis of Scratch Drive Actuation for Integrated X/Y Motion System,” Solid State Sensors and Actuators, Vol.2, pp.773– 776, 1997.
[17] R. J. Linderman, V. M. Bright, “Optimized Scratch Drive Actuator or Tethered Nanometer Positioning of Chip-Sized Components,” Solid-state Sensor and Actuator Workshop Hilton Head Island, South Carolina, June 4-8, 2000.
[18] T. Akiyama, H. Fujita, “A Quantitative Analysis of Scratch Drive Actuator Using Buckling Motion,” IEEE, pp.310, 29 Jan.-2 Feb. 1995.

[19] T. R. Hsu, “MEMS & Microsystems Design and Manufacture,” McGrawHill, 2002.
[20] Y. Fukuta, D. Collard, T. Akiyama, E. H. Yang, H. Fujita, “Microatuated Self-Assembling of 3D Polysilicon Structures withReshaping Technology,” IEEE, pp.477-481, 1997.
[21] T. Akiyama, D. Collard, H. Fujita, “Scratch Drive Actuator with Mechanical Links for Self-Assembly of Three-Dimensional MEMS,” IEEE, Vol. 6 , Issue.1, pp.10 –17, 1997.
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