本研究主要探討異方性導電膠膜 (Anisotropic Conductive
Film, ACF)中之導電粒子在構裝過程中之變形與接觸電阻之
變化，並利用MARC有限元素套裝軟體模擬接觸過程中ACF之
熱-彈-塑行為。

文中分析模型分為兩部份，首先建立一軸對稱導電粒子模型，
以模擬單導電粒子在製程中之彈-塑變形，並分析金屬鍍膜厚
度對於導電粒子變形量、接觸半徑以及接觸電阻之影響。另
外，也對於粒子與電極之間於接合過程所產生之不連續接觸
問題進行討論。接著建構三維有限元素模型以探討ACF中導電
粒子之個數與壓力對於導體球變形與接觸行為之影響，其中
導電粒子以等效非線性彈簧取代之，以求減少電腦運算量。
模擬結果顯示，導電粒子參數對於製程中之接觸特性有重要
影響。

In this thesis, the contact behavior of the conduct particles in the anisotropic conductive film (ACF) packaging process is investigated. The thermal elastic-plastic finite element (FE) model is employed to simulate the contact process. The commercial MARC finite element method package is used in this work. Two contact models of the ACF packaging are studied : the single particle and the multiple-particles models. In the single particle model a simple axial symmetric FE model is used to simulate the variation of elastic-plastic deformations during packaging process. The effect of coating thickness on the contact deformation is discussed.

To explore the effect of particle distribution on the contact deformation and the conduct behavior in the ACF packaging, the multiple-particles 3D model has also been studied. However, to overcome the computing difficulties introduced from huge degrees of freedom, the equivalent nonlinear springs are employed to stand for some conductive particles. The effect of particle distribution and particle parameters on the conductive behavior are studied. Results indicate that the conductive particle parameters may affect the conductive characteristics significantly in the ACF packaging process.

目錄i
圖目錄iv
表目錄xi
符號說明 xii
摘要xiv
Abstract xv
第ㄧ章 緒論1
1-1 前言1
1-2 文獻回顧2
1-3 研究動機與目標7
第二章 ACF製程介紹與基本理論9
2-1 異方性導電膜9
2-2 異方性導電膜接合機制12
2-3 赫茲接觸理論12
2-4 ACF接觸電阻理論13
第三章 單一導電粒子二維軸對稱分析與參數討論21
3-1 有限元素分析模型21
3-1-1 網格建立21
3-1-2 條件設定與假設22
3-2製程模擬中之不連續接觸現象24
3-3鍍膜厚度對接觸電阻之影響25
3-4不同工作溫度下鍍膜厚度對接觸電阻之影響26
第四章 多導電粒子之三維分析與參數討論43
4-1有限元素模型之網格建立與邊界條件43
4-2 等效非線性彈簧44
4-2-1 等效彈簧原理44
4-2-2 等效彈簧之選取45
4-2-3 等效彈簧模型驗證45
4-3壓力對接觸電阻之影響46
4-4不同工作溫度下壓力對接觸電阻之影響47
4-5導電粒子數對接觸電阻之影響48
4-6不同工作溫度下導電粒子數對接觸電阻之影響48
第五章 結論89
5-1 結論89
5-2 未來工作90
參考文獻91

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