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博碩士論文 etd-0907107-032945 詳細資訊
Title page for etd-0907107-032945
論文名稱
Title
高功率發光二極體高溫加速老化之失效分析
Degradation Analysis of High Power LED Device in High Temperature Acceleration Aging Test
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
119
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2007-07-13
繳交日期
Date of Submission
2007-09-07
關鍵字
Keywords
有限元素分析、加速老化、發光二極體、高功率發光二極體
finite element analysis, light-emitting diode, high-power LED, degradation
統計
Statistics
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中文摘要
高功率發光二極體(LED)之技術已日漸成熟,應用範圍更廣泛,其面臨之操作環境亦更加嚴苛。本研究透過實驗,觀察高功率藍光發光二極體,在高溫環境下操作所產生之老化情形,並利用有限元素分析軟體,探討造成老化的可能原因。此外,透過光追跡軟體,討論經高溫實驗後所造成之變質現象,對光場分佈會造成何種程度之影響。
實驗將東貝、億光與Lumileds之產品置於80oC、100 oC、120 oC之環境下操作。實驗結果顯示,老化現象包括:透鏡與矽膠黃化、碳化;透鏡龜裂、變形、矽膠變質產生氣泡、磊晶內電阻上升及逆向電流上升等。並且同一廠牌之發光二極體,在三種不同操作環境下之老化情形不盡相同,其中以120oC實驗結果差異性最大。對於不同廠牌發光二極體之實驗結果,文中亦作討論比較。
由有限元素分析結果發現,溫度過高會造成磊晶下方之銲錫產生脫層現象,造成接觸不良,此現象由實驗結果亦可得到證實。此外,由光追跡與光場量測結果皆證實,內部灌膠因高溫變質,對光場分佈會造成嚴重影響。
Abstract
Recently, the high-power light-emitting diodes (LEDs) have been used from the traditional indicator purpose to general illumination purpose. The operating environment and requirement has been more severe. The long operating life high efficiency and high reliability are its main feature attracting the lighting community to this technology.
The effect of operating temperature on the degradations of high-power blue LEDs is studied in this thesis. The experiment, measurements, and finite element simulations were conducted to investigate the possible causes of LED degradation. The influence of LED material degeneration on the radiometric pattern was analyzed by tracing rays simulation.
Different groups of sample LEDs produced by Lumileds, Unity opto technology Co., and Everlight electronics Co. were studied. Different operating ambient temperatures, e.g. 80oC, 100 oC, and 120 oC, were considered in the accelerated aging test. Experimental results indicated that yellowing, carbonization, gel degeneration, lens chapping and deformation were observed during the test. Results also indicated that the operating temperature is the key factor for LED failure mechanism, that is, different operating ambient temperature may lead to different degradation phenomenon.
Numerical simulation results shown that the creep caused by high temperature and thermal stress would cause solder takeoff. This takeoff defects were observed in experimental results. Through ray tracing simulation, it is assured that gel degeneration would change the radiometric pattern of the LED significantly.
目次 Table of Contents
Contents………………………………………………………………. i
List of Figures………………………………………………………… iii
List of Tables…………………………………………………………. ix
List of Symbols……………………………………………….………. x
List of Abbreviations…………………………………………………. xi
摘要……………………………………………………….………….. xii
Abstract……………………………………………………………….. xiii
Chapter 1 Introduction………………………………………………... 1
1-1 Evolution and applications of high power LED………………… 1
1-2 Literature review………………………………………………... 2
1-3 Contents…………………………………………………………. 3
Chapter 2 Accelerating Aging Test………………………………….... 6
2-1 Equipment and experimental setup……..……………………... 6
2-2 Electrical characters measurement………………….…………... 9
2-3 Optical characters measurement………...……………………… 10
2-3-1 Relative radiometric power…….…..………………………... 10
2-3-2 Radiation pattern measurement……………………………... 10
2-4 Results and Discussions…………..…………………………...... 11
2-4-1 Everlight LEDs……………………………………………… 12
2-4-2 Uni LEDs……………………………………………………. 14
2-4-3 Lumileds LEDs…...…………………………………………. 16
2-4-4 Discussions………………………………………………….. 18
Chapter 3 Thermal-mechanical Finite Element Simulation of
Lumileds LEDs………………..…………………………..
68
3-1 Thermal-mechanical modeling………………………………….. 68
3-1-1 Hypotheses and Boundary Conditions………………………. 70
3-1-2 Model Stability Analysis…………………………………….. 72
3-1-3 Model Adjustment…………………………………………… 72
3-2 Results and discussions…………………………………………. 73
Chapter 4 Tracing Rays Simulation…………………………………... 86
4-1 Tracing Rays modeling…………………………………………. 86
4-2 Results and Discussions………………………………………… 87
Chapter 5 Conclusions………………………………………………... 96
5-1 Summary………………………………………………………... 96
5-2 Further works…………………………………….……………... 97
Reference……………………………………………………………... 99
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