銲線接合技術發展時間較久，相關設備及技術也較其他接合方式成熟且產品可靠度較高，故目前在封裝製程上銲線接合技術仍為主流的製程方法。現今主要使用金線做為接合的線材，但由於金價逐年上漲，在成本與市場的考量下，因而有了以銅線取代金線的作法產生。
　　本研究主要透過三維有限元素法模擬銅銲線-鋁墊於熱超音波接合時之衝擊與超音波振動階段，比較不考慮熱效應時之結構計算模擬與考慮熱效應之熱固耦合模擬之求解結果的差異性，以及比較銅銲線熱超音波接合與金銲線熱超音波接合時之差異性，同時探討鋁墊厚度變化對銅銲線-鋁墊於熱超音波接合效果之影響。
　　由本研究之分析結果可知，溫度變化造成之熱效應將導致材料機械性質的改變，使得考慮熱效應之熱固耦合模擬所得之整體等效應力與等效應變小於不考慮熱效應時之結構計算模擬結果，而銅銲線熱超音波接合相較於金銲線熱超音波接合造成鋁墊較大量的塑性變形，進而造成嚴重的鋁擠出現象，且增加鋁墊厚度對鋁擠出效應之改善並不明顯。

　　Wire bonding has been used in integrated circuit packaging for many years which has been more full-grown than other bonding methods, and gold wire has been the preferred choice. Because of the rising price of gold every year, copper wire has been increasingly used to replace gold wire.
　　The main focus of this paper is to simulate 3D copper-Al pad thermosonic wire bonding stage by using 3D finite element method. Firstly, the differences between mechanical analysis (the thermal effect was not considered) and thermo-mechanical coupling analysis from both impact stage and ultrasonic vibration stage, respectively, were compared. Secondly, the differences between copper thermosonic wire bonding analysis and gold thermosonic wire bonding analysis were discussed. Finally, the effects of Al pad thickness variation on the copper thermosonic wire bonding analysis were studied.
　　Results showed that, due to the mechanical properties will be decreased by thermal effects caused from temperature increasing, the obtained effective stress and efective strain of thermo-mechanical coupling analysis were less than the results obtained from mechanical analysis. The pad plastic defomation in copper thermosonic wire bonding is more critical than gold thermosonic wire bonding. Therefore, copper thermosonic wire bonding will lead to serious pad splashing. Also, quantity of the decreasing of pad plastic deformation was limited by increasing the pad thickness.

目錄 I
表目錄 IV
圖目錄 VI
摘要 X
Abstract XI
第一章 緒論 1
1.1前言 1
1.2銲線接合製程技術介紹 2
1.3文獻回顧 3
1.4研究目標 8
1.5論文架構 9
第二章 研究方法 14
2.1有限元素法簡介 14
2.2 LS-DYNA程式簡介 16
2.3 LS-DYNA理論基礎 21
2.3.1結構計算之統御方程式（Governing Equation） 21
2.3.2時間積分（Time Integration） 24
2.3.3熱傳分析之統御方程式 25
第三章 分析方法 32
3.1熱固耦合 32
3.2熱固耦合模擬銲線接合模型之建構與邊界條件設定 34
3.2.1模擬模型結構與尺寸設定 34
3.2.2材料模型選用設定 35
3.2.3材料參數設定 36
3.2.4網格元素選用與劃分 39
3.2.5銲線接合過程與邊界條件設定 40
3.2.6銲線接合接觸設定 41
3.2.7熱傳條件設定 42
3.2.8等效應力與應變計算方法 44
第四章 結果與討論 57
4.1驗證模擬 57
4.2銲線熱超音波接合之衝擊階段模擬 59
4.2.1模擬結果分析 60
4.2.2模擬結果討論 66
4.3銲線熱超音波接合之超音波振動階段模擬 68
4.3.1模擬結果分析 69
4.3.2模擬結果討論 75
4.4不同鋁墊厚度之銅銲線熱超音波接合熱固耦合模擬 78
4.5銅銲線熱超音波接合熱固耦合模擬之平行運算效能測試 80
第五章 結論與未來展望 120
5.1結論 120
5.2未來展望 121
參考文獻 123

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