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博碩士論文 etd-0911106-150016 詳細資訊
Title page for etd-0911106-150016
論文名稱
Title
鑽石散熱器的分析與製作
The analysis and manufacturing of diamond heat sink
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
56
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2006-07-28
繳交日期
Date of Submission
2006-09-11
關鍵字
Keywords
刮痕、鑽石
heat sink, diamond
統計
Statistics
本論文已被瀏覽 5699 次,被下載 22
The thesis/dissertation has been browsed 5699 times, has been downloaded 22 times.
中文摘要
隨著電腦越來越發達,電子元件所散發出來的熱量也越來越多,如果散熱器的效能沒有加以提升的話,那些無法散出的熱量將會讓元件受到破壞。本研究探討鑽石當成散熱器的製程可行性,從濺鍍金屬,電鍍,刮痕測試,拉力測試金屬膜在鑽石膜的附著力,及以有限元素的套裝軟體作有關熱流方向,熱傳量,溫度梯度的模擬,本論文發現最適合的散熱器製程條件為在基板溫度300 ℃下利用100 W的射頻功率及2 mTorr下所濺鍍出的銅可達1.9 kg/cm2的附著力及由模擬在不同工作溫度來做一系列的探討發現鑽石厚度為100 µm為最經濟的厚度。
Abstract
As the time goes by, the more computers become advance, the more heat they produce. If the heat sink of electronic device is not good enough to remove the heat, the electric circuit can be destroyed due to the overheat. This thesis discusses a possible heat sink making of diamond thin layer. Appling the sputtering, Cu thin film has deposited on CVD diamond film, and applying electroplate coating, the thickness of Cu film has increased to 100 µm. In this work a satisfied coating condition has been found to deposite Cu film on diamond, such as: substrate temperature at 300 ℃, the RF power at 100 Watt and vapor pressure at 2 mTorr for the RF sputtering of Cu on diamond. Using scratch test and pull-off test the adhesion of Cu on diamond has been analyzed to have an adhesive force of 1.9 kg/cm2.Through the simulation with FEMLAB, the finite element method, heat flux, thermal convection and temperature gradient have been simulated. A best thickness of the diamond thin film has been found to be no more thick than 100 µm for the heat sink device.
目次 Table of Contents
第一章 前言
1.1 研究動機
1.2 研究目的
1.3 研究方法
第二章 實驗部份
2.1電漿概論
2.2濺鍍實驗
2.3電鍍實驗
2.4附著力量測
2.5散熱
2.5.1熱傳導原理
2.5.2熱對流原理
2.6FEM套裝軟體模擬
2.6.1有限元素法
2.6.2 FEMLAB 簡介
2.6.3 模型及參數設定
第三章 結果與討論
3.1 刮痕測試
3.2 拉力測試
3.3 FEMLAB 模擬
3.3.1熱傳
3.3.2 溫度分布
3.3.3 溫度梯度
3.3.4 散熱器底層的總散熱量
第四章 結論
第五章 附錄
第六章 參考文獻
參考文獻 References
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L. J. Olafsen, J. R. Meyer, M. J. Yang, and H. Lee, “Thermal Characterization of Diamond-Pressure-Bond Heat Sinking for Optically Pumped Mid-Infrared Lasers”, IEEE journal of quantum electronics, 11(1999) P 1597

[3] N. Boiadjieva”, C. Kellehef, G. Dajee, S.Nadigb ,”Novel Heat Spreader for the Optical Probing of PC Board Mounted Flip Chips”, 19th IEEE Semi-Therm Symposium(2003) P284

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[5] Ping Hui, H. S. Tan, Y. S. Lye, “Design of circular heat spreaders
on semi-infinite heat sinks in microelectronic device applications”, IEEE Transactions On Components Part A, 20, (1997) 4

[6] 林源琪,奈米級鑽石顆粒的成長與特徵分析,國立中山大學碩士論文, 2004

[7] 陳怡均,鑽石滲硼電極之製作與分析,國立中山大學碩士論文, 2005

[8] Hideaki Yamada, Akiyoshi Chayahara, Yoshiaki Mokuno, Yuji Horino, Shinichi Shikata,”Simulation of temperature and gas flow distributions in region close to a diamond substrate with finite thickness”, Diamond and Related Materials (2006) in print

[9] Tefan Weiss ,Elke Zakel, Herbert Reichl, “Mounting of high power Laser diodes on diamond heatsinks”, IEEE Transactions On Components Part A, 19, (1996) 1
[10] Hong Xiao著,張鼎張,羅正忠譯,半導體製程技術導論,歐亞書局 (2002)p.222

[11] 金原燦著,賴耿陽譯,薄膜製作工藝學,復漢出版社印行(1987)p.32

[12] 羅吉宗,薄膜科技與應用,全華科技圖書股份有限公司(2005)p.2-17

[13] D.Ferrier, Electroplating a nonconductive substrate, U.S. Patent 5536386. July 16, 1996

[14] H.Ichimura, A.Rodrigo,”The correlation of scratch adhesion with composite hardness for TiN coatings’, Surface and Coatings Technology 126 (2000) p152

[15] Q. Hua Fan, A. Fernandes, E. Pereira, J. Gra´cio, “Adhesion of diamond coatings on steel and copper with a titanium interlayer”, Diamond and Related Materials 8 (1999) p1549

[16] Min Ku Lee, Whung Whoe Kim, Joung Soo Kim, Won Jong Lee, “Adhesion and wear properties of TiN film deposited on martensitic stainless steel and satellite by reactive magnetron sputter ion plating”, Journal of Nuclear Materials 254 (1998) p45

[17] James G. Kohl, Irwin L Singer, “Pull-off behavior of epoxy to silicone duplex coatings”, Progress in Organic Coatings 36 (1999) p 15

[18] Frank P. Incropera, David P. DeWitt, “Fundamentals of heat and mass transfer”, John Wiley & Sons, New York, P 75

[19] 許家豪,楊台發,未公開發表之實驗結果
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