本論文運用面型微加工技術製作新型聚亞醯胺(Polyimide, PI)自我組裝式(Self-assembly)微形扇葉以應用於微形風扇晶片之開發。經實驗證明，有效利用聚亞醯胺薄膜在熱回熔時產生的表面張力，可將釋放後之多晶矽微扇葉平板結構掀舉，舉起角度與製程參數及聚亞醯胺薄膜尺寸有關聯；另一方面為了有效限制扇葉舉起之最大角度並且完成結構之定位，本研究進一步加入微鉸鍊(Micro hinge)結構之設計與製作。
本論文探討不同聚亞醯胺薄膜厚度與熱回熔參數(溫度及時間)對其表面張力之影響，經實驗證明在聚亞醯胺薄膜厚度為18 μm，回熔溫度為380 ℃且回熔時間為10小時之條件下，多晶矽微扇葉平板被聚亞醯胺掀舉之角度可達70°；另外，在聚亞醯胺厚度為25 μm，回熔溫度為400 ℃ 且回熔時間為 10小時，因聚亞醯胺薄膜過度收縮形變，所以產生更大的拉力致使微形扇葉掀舉角度高達130°。
最後，本論文更進一步探討聚亞醯胺可撓接點之位置對微扇葉ψ軸偏轉量之影響；並且成功利用多可撓接點設計與不對稱之扇葉結構之設計形成螺旋式與不共平面多關節式之3D微形扇葉結構。

This study presents a novel polyimide-based self-assembly three dimensional micro blade using surface micromachining technology for the development of micro-fan chip. The high surface-tension-force of reflowed polyimide has can be used to lift the free-standing micro blade. In addition, the thesis introduces a micro hinge structure to effectively limit the maximum lifting angle of the micro blade and to accurately lock hinge-pin into the vertical position.
Many parameters have been investigated its influence on the surface-tension- force of polyimide, including the thickness of polyimide and the temperature/time in reflow processing. Based on the experimental results, 18 μm-thick polyimide can lift the micro blade at 70° angle under 380 ℃/10 hrs reflow condition. On the other hand, 25 μm-thick polyimide has demonstrated its maximum lifting angle can be achieved to 130° utilizing the very high surface-tension-force induced by over contraction and deformation when it was reflowed at higher temperature (400 ℃).
Finally, this dissertation has studied the relation between the position of polyimide elastic-joint and the deflection angle (ψ). Furthermore, this thesis has successfully demonstrated a novel multi-joint and asymmetrical microstructure for the development of the spiral and out-of-plane 3D micro blade.

摘要 I
Abstact II
誌謝 III
目錄 IV
圖目錄 VI
表目錄 XII
第一章 緒論 1
1-1 前言 1
1-2 研究動機與目標 3
1-3 實驗方法與論文架構 5
第二章 自我組裝技術與微鉸鍊之原理介紹 7
2-1 自我組裝技術之分類與比較 7
2-2 表面張力式自我組裝之材料分類與比較 10
2-3 聚亞醯胺材料特性 14
2-4 微鉸鍊結構之設計原理 16
第三章 聚亞醯胺自我組裝微型扇葉元件設計與製作 18
3-1 聚亞醯胺自我組裝微型扇葉結構介紹 18
3-2 聚亞醯胺自我組裝微型扇葉元件佈局設計 19
3-3 聚亞醯胺自我組裝微型扇葉元件製程整合 26
3-3-1 元件製作流程 26
3-3-2 元件製程步驟 28
3-4 製程設備 43
第四章 實驗與量測結果 51
4-1 微鉸鍊結構 51
4-2 聚亞醯胺可撓接點之膜厚對微扇葉掀舉角度之影響 54
4-3 聚亞醯胺回熔溫度與時間對微扇葉掀舉角度之影響 58
4-4 聚亞醯胺接點幾何大小與形狀對微扇葉掀舉角度之影響 60
4-5 聚亞醯胺可撓接點位置變化對微扇葉掀舉之影響 63
4-6 聚亞醯胺肋骨式接點 64
4-7 多關節微扇葉設計 66
4-7-1 多聚亞醯胺接點式螺旋型微扇葉結構 66
4-7-2 不共平面式多關節扇葉結構 67
第五章 結論與建議 68
5-1 結論 68
5-2 建議 71
參考文獻 73

[01]丁志明，方維倫等人，“微機電系統技術與應用”，行政院國家科學委員會精密儀器發展中心出版，2003年。
[02]MCNC, The Multi-User MEMS Processes (MUMPs),
http://www.mcnc.org
[03]R. J. Linderman, P.E. Kladitis, V. M. Bright, “Development micro
rotary fan”, Sensor and Actuator A, vol. 95, pp. 135-142, 2002.
[04]K.W.C. Lai, A.P. Hui, W.J. Li, “Non-contact batch micro-assembly by
centrifugal force”, Proceeding of the IEEE MEMS’98 Workshop,
Heidelberg, Germany, pp. 29-33, 1998.
[05]Y. W. Yi, C. Liu, “Magnetic actuation of hinged microstructure,”
Journal of Microelectromechanical Systems, vol. 8, no.1, pp.
10-17,1999.
[06]J. W. Judy and R. S. Muller, “Magnetically actuated, addressable
microstructures,” Journal of Microelectromechanical Systems, vol. 6,
no.3, pp.249-256, 1997.
[07]K. S. Pister, M. W. Judy, S. R. Burgett, R. S. Fearing, “Microfabricated
hinges,” Sensors and Actuators A, vol. 33, pp.249-256, 1992.
[08]L. Fan, R. T. Chen, A. Nespola, M. C. Wu, ”Universal MEMS platforms
for passive RF components: suspended inductors and variable
capacitors,” Proceeding of the IEEE MEMS’98 Workhsop, Heidelberg,
Germany, pp. 29-33, 1998.
[09]T. Akiyama, D. Collard, H. Fujita, “Scratch drive actuator with
mechanical links for self-assembly of three-dimensional MEMS,”
Journal of Microelectromechanical Systems, vol.6, no.1, pp.10-17,
1997.
[10]E. Quevy, L. Buchaillot, D. Collard, “3D self-assembling and actuation
of electrostatic microstructures, ”IEEE Transactions on electron
devices,” vol. 48, no. 8, pp. 1833-1839, 2001.
[11]Y. C. Tai, L. S. Fan and R. S. Muller, “IC-processed micro-motors:
design, technology, and testing,” Proceeding of the IEEE MEMS’89
Workshop, Salt Lake City, UT, pp.1-6, 1989.
[12]R. T. Chen, H. Nguyen, M. C. Wu, “A high-speed low-voltage
stress-induced micromachined 2/sp1 times/2 optical switch,” IEEE
Photonics Technology Letters, vol. 11, no. 11, pp. 1396-1398, 1999.
[13]M. A. Helmbrecht, U. Srinivasan, C. Rembe, R. T. Howe, R. S. Muller,
“Micromieeors for adaptive-optics arrays,” The 11th International
Conference on Solid-State Sensors and Actuators (Transducers ‘01), Munich, Germany, pp.1290-1293, 2001.
[14]D. C. Miller, W. Zhang, V. M. Bright, “Microrelay Packaging
Technology Using Filp-chip Assembly”, Proceeding of the IEEE
MEMS’00 Workshop, Miyazaki, pp. 265-270, 2000.
[15]R. A. Syms, E. M. Yeatman, V. M. Bright, George M.
Whitesides, ”Surface Tension-Powered Self-Assembly of
Microstructures—The State-of-the-Art”, IEEE Journal of
MicroElectroMechanical Systems, 12, No .4, pp. 387-417,2003.
[16]P. E. Kladitis, K. F. Harsh, V. M. Bright, Y. C. Lee, “Three-dimensional
modeling of solder shape for the design of solder self-assembled
micro-electro-mechanical systems,” Proceeding of the IEEE MEMS’00
Workshop, Nashville, Tennessee, pp. 11-18, 1999,
[17]K. F. Harsh, V. M. Bright, Y.C. Lee, ‘‘Solder self-assembly for
three-dimensional microelectromechanical systems,’’ Sensors and
Actuators, vol. 77, pp.237-244, 1999.
[18]R. R. A. Syms, C. Gormley, S. Blackstone, “Improving yield, accuracy
and complexity in surface tension self-assembled MOEMS,” Sensors
and Actuators A, Vol .2839, pp.1-11, 2000.
[19]P. W. Green, R. R. A. Syms, E. M. Yeatman, ‘‘Demonstration of
Three-dimensional Microstructure Self-Assembly,’’ Journal of Micro-electromechanical Systems, vol. 4, no. 4, pp. 170-176, 1995.
[20]W.D.Callister, “Materials Science and Engineering an Introductuon 6/e”,
JOHN WILEY & SONS , 2003.
[21]R. R. A. Syms, ‘‘3D micro-optomechanical devices by surface tension
powered self-assembly,’’ Microengineering in Optics and
Optoelectronics, pp. 41-46, 1999.
[22]王智弘，“聚亞醯胺薄膜自我組裝技術應用於3D微結構之研究”，國
立中山大學電機工程所碩士論文，2005。
[23]Dupont, “HD 4012 thick formable Polyimide Coating”
[24]M. J. Madou, Fundamentals of Microfabrication, 2nd Edition, CRC
[25]T. Ebefors, E. Kalvesten, G. Stemme, “Three dimensional silicon
triple-hot wire anemometer based on polyimide joints,” Proceeding of
the IEEE MEMS’98 Workshop, Heidelberg, Germany, ,pp. 93-98, 1998.
[26]J. Y. Lin, S. S. Lee, K. S. J. Pister, M. C. Wu, “Three-dimensional
micro-Fresnel optical elements fabricater by micromachining
technique,” Electronics Letters, vol. 30, pp. 448-449, 1994.
[27]L. Y. Lin, J. L. Shen, S. S. Lee, and M. C. Wu,”Surface- micromachined
micro-xyz stages for free-space microoptical bench,” IEEE Photonics
Technology Letters, vol. 9, no. 3, pp. 345-347, 1997.
[28]E. J. Garcia, J. J. Sniegowski, “Surface micromachined microengine,” Sensor and Actuator A, vol. 48, pp. 159-165,1995
[29]V. Kaajakari, A.. Lal, “Thermo-kinetic actuation for hinged structure
batch microassembly,” Proceeding of the IEEE MEMS’00 Workshop,
Las Vegas, pp.196-199, 2002
[30]T. R. Hsu, “MEMS ＆ Microsystems Design and Manufacture,”
McGrawHill, 2002.
[31]R. R. A.. Syms, ”Equilibrium of Hinged and HinglessStructures Rotated
Using Surface Tension Force”, IEEE Journal of
MicroElectroMechanical Systems, Vol. 4, No. 4, pp. 177-184, 1995.
[32]K. F. Harsh, V. M. Bright, Y. C. Lee, ”Solder Self-assembly for
Three-dimensional Microelectromechanical Systems”, Sensor and
Actuator A, Vo1. 77, pp. 237-244, 1999.
[33]B. M., V. M. Bright, and J. A. Neff, ‘‘A solder self-assembled large
angular displacement torsional electrostatic micromirror,’’Micro
Electro Mechanical Systems, pp. 499-502, 2002.