隨著網際網路的風潮，為了滿足高頻寬資料傳輸的需求，光纖通訊已經成為有線通訊的主流。光纖套管零組件在光通訊的收發模組中佔有很重要的地位，為確保雷射對光纖的高耦光效率不會因長時間使用及溫度變化環境下操作後降低，光纖必須被確實的固定在金屬套管中；目前的光纖固定是利用焊錫等接合劑，在高溫熔融狀態下，藉由毛細現象讓焊錫慢慢流入內徑400μm的套管中，此種方式，無論在穩定性、準確性上皆無法有很好的表現，加上是以人工來進行操作，即使是有經驗的操作員，產品的良率也不到三成。所以本論文研究改善模組製程，將原本手動灌錫機制改為主動式的注射機制，實作出主動式灌錫機構，能夠確保更穩定、精確的灌錫注入套管中，將成功率由原本的二成五提升至七成五對於產能有很大的提升。

Optical communication dominates the wire-communication since the requirement of the high speed data transfer in the Internet. Fiber Solder Ferrule (FSF) plays an important role in transceiver modules of the optical communication. For the reason to keep the coupling efficiency between the laser diode and fiber after time using and a various temperature operation, fiber has to be carefully fixed in the metal ferrule. The fixing of the fiber now is finished to let the melting solder flow into a 400μm diameter ferrule by the capillary action manually. The stability and accuracy of this method can not match the required performance. And the human operation makes this process more unstable to cut down the yield below 30% even by an experienced operator. So, this study analyzes the FSF process and proposes an active strategy to replace the original passive method by capillary action. An active soldering mechanism is implemented to precisely and stable filling the solder into the ferrule. The yield can be significantly raised from 25% to 75%.

目錄 I
圖目錄 III
表目錄 V
摘要 VI
Abstract VII
第一章 序論 1
1.1 研究動機 1
1.2 光纖套管構裝 1
1.3 改善灌錫機構的必要性 3
1.4 研究目的 4
第二章 毛細現象分析 5
2.1 手動毛細現象灌錫 5
2.2 毛細力分析 6
2.3 主動式灌錫機制 8
第三章 灌錫機制設計 11
3.1 性能要求 11
3.2 機構設計 12
第四章 實驗結果 16
4.1 實驗設備 16
4.2 穩定性試驗 17
4.3 套管灌錫實驗 20
第五章 結論與未來展望 22
參考文獻 23

1. D. S. Alles, “Trends in laser packaging,” in Proc. 40th ECTC,
1990, pp.185–192.
2. W. H. Cheng, M. T. Sheen, C. P. Chien, H. L. Chang, and J. H. Kuang, “Fiber alignment shift formation mechanisms of fiber-solder-ferrule joints in laser module packaging,” J. Lightwave Technol., vol. 18, pp. 1177–1184, June 2001.
3. Yih-Tun Tseng, Yung-Ching Chang, “Active Fiber-Solder-Ferrule Packaging Method for Automation”, Accepted on IEEE Transactions on Components and Packaging Technologies, 2003.
4. Peter Mueller, Bernd Valk, “Automated Fiber Attachment for 980nm Pump Modules,” IEEE Electronic Components and Technology Conference, vol. 18, pp. 5–9, 2000.
5. W. H. Cheng, M. T. Sheen, C. P. Chien, H. L. Chang, and J. H. Kuang, “Reduction of fiber alignment shifts in laser module packaging,” J. Lightwave Technol., vol. 18, pp. 842–848, June 2000.
6. Pang, J.H.L., Chong, D.Y.R. , “Thermal cycling analysis of flip-chip solder joint reliability,” Components and Packaging Technologies, IEEE Transactions on , Volume: 24 Issue: 4 , Dec 2001 pp. 705 -712.
7. Beranek, M.W. , Rassaian, M. , “Characterization of 63Sn37Pb and 80Au2OSn solder sealed optical fiber feedthroughs subjected to repetitive thermal cycling, “Advanced Packaging, IEEE Transactions on , Volume: 24 Issue: 4 , Nov 2001 pp.76 -585.
8. J. H. Kuang, M. T. Sheen, S. C. Wang, C. H. Chen, and W. H. Cheng, “Crack formation mechanism in laser-welded Au-coated Invar materials for semiconductor laser packaging,” IEEE Trans. Comp., Hybrids, Manufact. Technol, pp. 94–100, 1999.
9. D.B. Wallace, “Method and Apparatus for Forming Microdrolets of Liquids at Elevated Temperatures,” U.S. Patent 5,415,679, May 16, 1995.
10. Hayes, D.J.; Grove, M.E. , “Development and application by ink-jet printing of advanced packaging materials,” Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings International Symposium on 14-17 Mar 1999 , pp. 88 -93.
11. Meyer W. , “Micro dispensing of adhesives and other polymers,” Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on 21-24 Oct. 2001, pp. 35-39.
12. Hamburgen W.R., “Precise robotic paste dot dispensing,” Electronic Components Conference, 1989. Proceedings 39th , 22-24 May 1989 , pp. 593 -602.
13. Cao Y., Gao M., Pinilla E., “Fabrication and test of a filling station for micro/miniature devices,” Energy Conversion Engineering Conference, 1997. IECEC-97 Proceedings of the 32nd Intersociety , 27 July-1 Aug. 1997 , pp. 1509 -1513 vol.2.
14. Fuller S.B., Wilhelm E.J., Jacobson J.M., “Ink-jet printed nanoparticle microelectromechanical systems,” Microelectromechanical Systems, Journal of , Volume: 11 Issue: 1 , Feb. 2002 ,pp. 54 -60.
15. Qingbin Liu, Leu M.C.,Orme M. , “Amplitude modulated droplet formation in high precision solder droplet printing,” Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on , 11-14 March 2001 ,