由於高速傳輸的需求與日遽增，在通訊系統中光纖陣列已成為一個不可或缺且無可取代的地位，然而隨著傳播距離變長，光功率損失將成為一個重要的問題。為了增加光纖陣列模組的傳輸量與耦合率，將製造高精度的二維光纖陣列來達到此目標。
現今製作一維光纖陣列技術已相當成熟，文中使用錫球柵格陣列接合技術，銲接數個一維光纖陣列成為二維光纖陣列。錫球柵格陣列接合技術本身具有自我對位之優點，在水平方向上可提供良好的接合精度，但在垂直方向卻無此特性，所以我們使用主動式構裝的方式，在接合光纖陣列時額外施加外力來控制接合高度。首先經由模擬軟體選擇最佳構裝參數來製作試片，並進行接合實驗，量測實際結果與模擬來進行比較分析。

For the requirements of high-speed signal transmission has been increasing, the fiber array in the communication system has a lot of advantages which can not be replaced. But the loss of coupling efficiency is a difficult problem as the distance of communication is getting longer and longer. In order to increase the transmission and the coupling efficiency, we produce the two with high precision to reach the goal.

The technique producing one dimension fiber array is very adept now. This paper chooses mounting several one dimension fiber array to produce the two dimension fiber array. Because BGA has self-alignment character, the fiber array can get nice mounting accuracy in horizontal but can’t get in vertical. We use active packing to manufacture two dimension fiber. In this process we exert external force to control the mounting height. In the first, use approximate software to get the best manufacturing parameter. Then complete the experiment and compare the result with the approximation.

中文摘要.........................................................2
英文摘要.........................................................3
謝誌.................................................................4
目錄.................................................................5
圖目錄.............................................................8
表目錄...........................................................10
第一章 緒論 .........................................11
1-1前言.........................................................11
1-2二維光纖陣列製作方式.........................12
1-3錫球陣列接合技術.................................14
1-4研究動機與目的.....................................17
第二章 文獻回顧..................................18
2-1錫球接合應用於光電元件上….............18
2-2改良接合高度精度方法.........................19
2-2-1特殊機構設計..................................19
2-2-2以外力改變接合高度......................20
2-2-3幾何結構最佳化設計......................20
2-3銲墊與銲錫材料選擇..............................22
2-4潛變效應..................................................26
第三章 研究方法...................................29
3-1模擬規劃..................................................29
3-1-1單顆模擬..............................................32
3-1-2陣列模擬...........................................33
3-1-3分佈模擬之探討...............................35
3-1-4最佳化之實際模型模擬...................35
3-2 模擬環境設定.........................................36
3-2-1 模擬假設..........................................36
3-2-2 初始條件..........................................37
3-2-3 邊界條件..........................................37
3-2-4 潛變設定..........................................38
3-2-5 溫度循環..........................................39
第四章 模擬結果分析與討論..............42
4-1單顆模擬.................................................42
4-1-1銲墊直徑最佳化模擬結果.................42
4-1-2 銲錫體積最佳化模擬結果................44
4-2陣列模擬.................................................45
4-2-1銲墊間距最佳化模擬結果.................45
4-2-2試片重量.............................................48
4-2-3錫球分佈模擬.....................................48
4-3 完整模型比較........................................50
第五章 結論與未來發展......................52
5-1結論.........................................................52
5-2未來工作.................................................52
參考文獻.......................................................54

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